Patents by Inventor Melburne C. Lemieux
Melburne C. Lemieux has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11968787Abstract: A method of forming a transparent electrically conductive film including depositing a dispersion of metal nanowires onto a substrate surface, delivering a solution including a fusing agent in a solvent onto the substrate surface, and drying the substrate surface after depositing the metal nanowires and delivering the fusing agent solution to fuse at least some of the metal nanowires into the transparent electrically conductive film comprising a fused metal nanowire network.Type: GrantFiled: June 26, 2018Date of Patent: April 23, 2024Assignee: C3 Nano, Inc.Inventors: Ajay Virkar, Ying-Syi Li, Melburne C. LeMieux
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Publication number: 20210307163Abstract: This disclosure provides electrically conductive materials, including electrically conductive textile materials, such as woven or knitted fabric textiles, individual fibers, and woven fibers and yarns. The conductive materials comprise a substrate material, such as a textile or other suitable material, and a metal embedded in the substrate material, in particular where the metal is embedded into and below the surface of the material. Also provided are methods of making the electrically conductive materials.Type: ApplicationFiled: August 3, 2019Publication date: September 30, 2021Inventors: Melburne C. LEMIEUX, Steven Brett WALKER, Gaurav TULSYAN
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Publication number: 20200377744Abstract: Metal nanowires, such as silver nanowires coated on a substrate were sintered together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency and low haze. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described.Type: ApplicationFiled: August 14, 2020Publication date: December 3, 2020Inventors: Ajay Virkar, Ying-Syi Li, Xiqiang Yang, Melburne C. LeMieux
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Patent number: 10781324Abstract: Metal nanowires, such as silver nanowires coated on a substrate were sintered together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency and low haze. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described.Type: GrantFiled: February 1, 2018Date of Patent: September 22, 2020Assignee: C3Nano Inc.Inventors: Ajay Virkar, Ying-Syi Li, Xiqiang Yang, Melburne C. LeMieux
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Publication number: 20180297840Abstract: A method of forming a transparent electrically conductive film including depositing a dispersion of metal nanowires onto a substrate surface, delivering a solution including a fusing agent in a solvent onto the substrate surface, and drying the substrate surface after depositing the metal nanowires and delivering the fusing agent solution to fuse at least some of the metal nanowires into the transparent electrically conductive film comprising a fused metal nanowire network.Type: ApplicationFiled: June 26, 2018Publication date: October 18, 2018Inventors: Ajay Virkar, Ying-Syi Li, Melburne C. LeMieux
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Publication number: 20180287608Abstract: Reduction/oxidation reagents have been found to be effective to chemically cure a sparse metal nanowire film into a fused metal nanostructured network through evidently a ripening type process. The resulting fused network can provide desirable low sheet resistances while maintaining good optical transparency. The transparent conductive films can be effectively applied as a single conductive ink or through sequential forming of a metal nanowire film with the subsequent addition of a fusing agent. The fused metal nanowire films can be effectively patterned, and the patterned films can be useful in devices, such as touch sensors.Type: ApplicationFiled: June 6, 2018Publication date: October 4, 2018Inventors: Ajay Virkar, Xiqiang Yang, Ying-Syi Li, Dennis McKean, Melburne C. LeMieux
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Patent number: 10029916Abstract: Metal nanowires, such as silver nanowires coated on a substrate were fused together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency. Materials formed form the fused metal nanowire networks described herein can have a transparency to visible light of at least about 85% and a sheet resistance of no more than about 100 Ohms/square or a transparency to visible light of at least about 90% and a sheet resistance of no more than about 250 Ohms/square. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. When formed into a film, materials comprising the metal nanowire network demonstrate low sheet resistance while maintaining desirably high levels of optical transparency, making them suitable for transparent electrode formation.Type: GrantFiled: June 22, 2012Date of Patent: July 24, 2018Assignee: C3Nano Inc.Inventors: Ajay Virkar, Ying-Syi Li, Melburne C. LeMieux
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Patent number: 10020807Abstract: Reduction/oxidation reagents have been found to be effective to chemically cure a sparse metal nanowire film into a fused metal nanostructured network through evidently a ripening type process. The resulting fused network can provide desirable low sheet resistances while maintaining good optical transparency. The transparent conductive films can be effectively applied as a single conductive ink or through sequential forming of a metal nanowire film with the subsequent addition of a fusing agent. The fused metal nanowire films can be effectively patterned, and the patterned films can be useful in devices, such as touch sensors.Type: GrantFiled: February 26, 2013Date of Patent: July 10, 2018Assignee: C3NANO INC.Inventors: Ajay Virkar, Xiqiang Yang, Ying-Syi Li, Dennis McKean, Melburne C. LeMieux
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Publication number: 20180155558Abstract: Metal nanowires, such as silver nanowires coated on a substrate were sintered together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency and low haze. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described.Type: ApplicationFiled: February 1, 2018Publication date: June 7, 2018Inventors: Ajay Virkar, Ying-Syi Li, Xiqiang Yang, Melburne C. LeMieux
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Patent number: 9920207Abstract: Metal nanowires, such as silver nanowires coated on a substrate were sintered together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency and low haze. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described.Type: GrantFiled: October 30, 2012Date of Patent: March 20, 2018Assignee: C3NANO INC.Inventors: Ajay Virkar, Ying-Syi Li, Xiqiang Yang, Melburne C. LeMieux
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Publication number: 20150298248Abstract: A bonded structure formed by a low-temperature bonding method comprises a first substrate bonded to a second substrate by a conductive layer comprising a metal. The conductive layer includes a first interfacial portion adjacent to the first substrate, a second interfacial portion adjacent to the second substrate, and a central portion between the first and second interfacial portions. The first and second interfacial portions comprise an interfacial conductivity of from about 1% to about 20% of a bulk conductivity of the metal, and the central portion comprises from greater than 20% to about 80% of the bulk conductivity of the metal. The bonded structure comprises a bond strength of from about 10 lbf to about 200 lbf.Type: ApplicationFiled: April 15, 2015Publication date: October 22, 2015Inventors: Steven Brett Walker, Melburne C. LeMieux
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Patent number: 9087995Abstract: Nanostructures are doped to set conductivity characteristics. In accordance with various example embodiments, nanostructures such as carbon nanotubes are doped with a halogenated fullerene type of dopant material. In some implementations, the dopant material is deposited from solution or by vapor deposition, and used to dope the nanotubes to increase the thermal and/or electrical conductivity of the nanotubes.Type: GrantFiled: September 9, 2013Date of Patent: July 21, 2015Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Ajay Virkar, Melburne C. LeMieux, Zhenan Bao
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Publication number: 20140302296Abstract: Inks for the formation of transparent conductive films are described that comprise an aqueous or alcohol based solvent, carbon nanotubes as well as suitable dopants. Suitable dopants generally comprise halogenated ionic dopants. In some embodiment, the inks comprise sulfonated dispersants that can effectively provide additional doping to improve electrical conductivity as well as stabilize the inks with respect to settling and/or improve the fluid properties of the inks for certain processing approaches. The inks can be processed into films with desirable levels of electrical conductivity and optical transparency.Type: ApplicationFiled: September 24, 2012Publication date: October 9, 2014Applicant: C3NANO INC.Inventors: Melburne C. LeMieux, Ajay Virkar, Yung-Yu Huang
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Publication number: 20140238833Abstract: Reduction/oxidation reagents have been found to be effective to chemically cure a sparse metal nanowire film into a fused metal nanostructured network through evidently a ripening type process. The resulting fused network can provide desirable low sheet resistances while maintaining good optical transparency. The transparent conductive films can be effectively applied as a single conductive ink or through sequential forming of a metal nanowire film with the subsequent addition of a fusing agent. The fused metal nanowire films can be effectively patterned, and the patterned films can be useful in devices, such as touch sensors.Type: ApplicationFiled: February 26, 2013Publication date: August 28, 2014Applicant: C3NANO INC.Inventors: Ajay Virkar, Xiqiang Yang, Ying-Syi Li, Dennis McKean, Melburne C. LeMieux
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Patent number: 8785763Abstract: Nanostructures are joined using one or more of a variety of materials and approaches. As consistent with various example embodiments, two or more nanostructures are joined at a junction between the nanostructures. The nanostructures may touch or be nearly touching at the junction, and a joining material is deposited and nucleates at the junction to couple the nanostructures together. In various applications, the nucleated joining material facilitates conductivity (thermal and/or electric) between the nanostructures. In some embodiments, the joining material further enhances conductivity of the nanostructures themselves, such as by growing along the nanostructures and/or doping the nanostructures.Type: GrantFiled: August 30, 2013Date of Patent: July 22, 2014Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Melburne C. LeMieux, Ajay Virkar, Zhenan Bao
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Publication number: 20140138612Abstract: Nanostructures are doped to set conductivity characteristics. In accordance with various example embodiments, nanostructures such as carbon nanotubes are doped with a halogenated fullerene type of dopant material. In some implementations, the dopant material is deposited from solution or by vapor deposition, and used to dope the nanotubes to increase the thermal and/or electrical conductivity of the nanotubes.Type: ApplicationFiled: September 9, 2013Publication date: May 22, 2014Applicant: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Ajay Virkar, Melburne C. LeMieux, Zhenan Bao
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Publication number: 20140087164Abstract: Inks for the formation of transparent conductive films are described that comprise an aqueous or alcohol based solvent, carbon nanotubes as well as suitable dopants. Suitable dopants generally comprise halogenated ionic dopants. In some embodiment, the inks comprise sulfonated dispersants that can effectively provide additional doping to improve electrical conductivity as well as stabilize the inks with respect to settling and/or improve the fluid properties of the inks for certain processing approaches. The inks can be processed into films with desirable levels of electrical conductivity and optical transparency.Type: ApplicationFiled: September 24, 2012Publication date: March 27, 2014Applicant: C3NANO INC.Inventors: Melburne C. LeMieux, Ajay Virkar, Yung-Yu Huang
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Publication number: 20140001437Abstract: Nanostructures are joined using one or more of a variety of materials and approaches. As consistent with various example embodiments, two or more nanostructures are joined at a junction between the nanostructures. The nanostructures may touch or be nearly touching at the junction, and a joining material is deposited and nucleates at the junction to couple the nanostructures together. In various applications, the nucleated joining material facilitates conductivity (thermal and/or electric) between the nanostructures. In some embodiments, the joining material further enhances conductivity of the nanostructures themselves, such as by growing along the nanostructures and/or doping the nanostructures.Type: ApplicationFiled: August 30, 2013Publication date: January 2, 2014Applicant: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Melburne C. LeMieux, Ajay Virkar, Zhenan Bao
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Publication number: 20130342221Abstract: Metal nanowires, such as silver nanowires coated on a substrate were sintered together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency and low haze. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described.Type: ApplicationFiled: October 30, 2012Publication date: December 26, 2013Applicant: C3NANO INC.Inventors: Ajay Virkar, Ying-Syi Li, Xiqiang Yang, Melburne C. LeMieux
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Publication number: 20130341074Abstract: Metal nanowires, such as silver nanowires coated on a substrate were fused together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency. Materials formed form the fused metal nanowire networks described herein can have a transparency to visible light of at least about 85% and a sheet resistance of no more than about 100 Ohms/square or a transparency to visible light of at least about 90% and a sheet resistance of no more than about 250 Ohms/square. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. When formed into a film, materials comprising the metal nanowire network demonstrate low sheet resistance while maintaining desirably high levels of optical transparency, making them suitable for transparent electrode formation.Type: ApplicationFiled: June 22, 2012Publication date: December 26, 2013Inventors: Ajay Virkar, Ying-Syi Li, Melburne C. LeMieux