Abstract: The present invention discloses an electrospinning composition comprising a catalyst and a functionalized polymer or copolymer bearing one or more epoxy ring. The mixture further comprises an anhydride, preferably phthalic anhydride as a cross-linking agent. Wherein a molar ratio of epoxy to anhydride in the electrospinning composition is within the range of 1:1 to 50:1. The present invention further discloses a preparation method of the electrospinning composition and an electrospun nano-/submicrostructures prepared using the method and composite material comprising the electrospun nano-/submicrostructures.

Abstract: The present invention discloses an electrospinning composition comprising a catalyst and a functionalized polymer or copolymer bearing one or more epoxy ring. The mixture further comprises an anhydride, preferably phthalic anhydride as a cross-linking agent. Wherein a molar ratio of epoxy to anhydride in the electrospinning composition is within the range of 1:1 to 50:1. The present invention further discloses a preparation method of the electrospinning composition and an electrospun nano-/submicrostructures prepared using the method and composite material comprising the electrospun nano-/submicrostructures.

Abstract: A self-healing system of nano/microstructures comprising a first type 1 and a second type 2 of longitudinal nano/microstructures each having an outer surface 100, each having a core 10, 11 and a polymeric first layer 20, 21 coaxially surrounding said core 10, 11 and at least one of said longitudinal nano/microstructure comprising a catalyst 101, wherein the core 10 of said first type nano/microstructures 1 comprises an epoxy resin, and the core 11 of said second type nano/microstructures 2 comprises a hardener, each of said first and second type nano/microstructures further comprise a second layer 30, 31 coaxially surrounding said first layer 20, 21 wherein the stiffness of said second layer 30, 31 is higher than the stiffness of said first layer 20, 21, and said hardener reacts with said epoxy resin when said first layer 20, 21 and second layer 30, 31 of said first and second type of nano/microstructures 1, 2 rupture upon a mechanical damage.