Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: An electronics component assembly for cooling high power density components including a fluid cooled module cover. In one embodiment, the electronics component assembly includes a module cover that is configured to make thermal contact with heat-generating electronic components of a module. The module cover includes an inlet, an outlet and at least one fluid passageway between the inlet and the outlet. The fluid passageway permits fluid to flow through the module cover, thereby allowing the module cover to act as a heat sink.