Patents by Inventor Melissa A. Workman

Melissa A. Workman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer packaging and singulation method
    Patent number: 7196410
    Abstract: A multi-device lid for a micro device wafer has a plurality of micro devices. The multi-device lid includes a multi-lid substrate configured to cover the plurality of micro devices of the micro device wafer. The multi-lid substrate has a trench pattern with intersection portions and non-intersection portions on a first side of the multi-lid substrate. The trench pattern is configured such that the intersection portions of the trench pattern extend adjacent to at least two of the plurality of micro devices when the multi-lid substrate is coupled to the micro device wafer.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: March 27, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Bradley C. John, Charlotte R. Lanig, Melissa A. Workman
  • Wafer packaging and singulation method
    Publication number: 20060128064
    Abstract: A multi-device lid for a micro device wafer has a plurality of micro devices. The multi-device lid includes a multi-lid substrate configured to cover the plurality of micro devices of the micro device wafer. The multi-lid substrate has a trench pattern with intersection portions and non-intersection portions on a first side of the multi-lid substrate. The trench pattern is configured such that the intersection portions of the trench pattern extend adjacent to at least two of the plurality of micro devices when the multi-lid substrate is coupled to the micro device wafer.
    Type: Application
    Filed: January 25, 2006
    Publication date: June 15, 2006
    Inventors: Chien-Hua Chen, Bradley John, Charlotte Lanig, Melissa Workman
  • Wafer packaging and singulation method
    Patent number: 7026189
    Abstract: A method for packaging and singulating a wafer having a plurality of micro devices includes providing a multi-lid substrate having a trench having intersection portions and non-intersection portions formed on a first side of the multi-lid substrate. The multi-lid substrate is coupled to the wafer such that the intersection portions of the trench pattern extend adjacent to at least three micro devices. Portions of the multi-lid substrate between a second side of the multi-lid substrate and the trench pattern are removed while the multi-lid substrate is coupled to the wafer.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: April 11, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Bradley C. John, Charlotte R. Lanig, Melissa A. Workman
  • Wafer packaging and singulation method
    Publication number: 20050176166
    Abstract: A method for packaging and singulating a wafer having a plurality of micro devices includes providing a multi-lid substrate having a trench having intersection portions and non-intersection portions formed on a first side of the multi-lid substrate. The multi-lid substrate is coupled to the wafer such that the intersection portions of the trench pattern extend adjacent to at least three micro devices. Portions of the multi-lid substrate between a second side of the multi-lid substrate and the trench pattern are removed while the multi-lid substrate is coupled to the wafer.
    Type: Application
    Filed: February 11, 2004
    Publication date: August 11, 2005
    Inventors: Chien-Hua Chen, Bradley John, Charlotte Lanig, Melissa Workman