Abstract: An inkjet printing system includes a mounting assembly and an inkjet printhead assembly. The mounting assembly includes a plurality of datums and the inkjet printhead assembly includes a carrier and a plurality of printhead dies each mounted on the carrier. The inkjet printhead assembly is mounted in the mounting assembly such that the carrier contacts at least one of the datums. Thus, positioning of the carrier relative to the mounting assembly is established.

Abstract: A printhead is formed from a plurality of ink ejectors mounted on an inner surface of a rigid substrate while protruding through holes provided in the substrate. Electrical contact is provided on a surface of the ink ejectors common with the ink ejecting nozzles thereby avoiding vias to another surface. The rigid substrate provides a conducting layer on its inner surface such that the ink ejectors may be connected thereto with solder reflow techniques.

Abstract: An ink transfer sheet and method for using the same. The transfer sheet includes a backing layer, a release layer on the backing layer, and an ink receiving layer on the release layer. The ink receiving layer contains a quaternary ammonium salt thereon or impregnated therein. To use the transfer sheet, an ink containing an anionic coloring agent is applied to the ink receiving layer, preferably using thermal inkjet methods. Thereafter, the transfer sheet is positioned on a fabric substrate. Heat is applied to the sheet which causes the release layer and ink receiving layer to adhere to the substrate. The backing layer is then detached from the release layer leaving the release and ink receiving layers (with the printed image thereon) on the substrate. This process transfers the image to the fabric substrate, with the image being stabilized by interactions between the quaternary ammonium salt and anionic coloring agent.

Abstract: A printhead is formed from a plurality of ink ejectors mounted on an inner surface of a rigid substrate while protruding through holes provided in the substrate. Electrical contact is provided on a surface of the ink ejectors common with the ink ejecting nozzles thereby avoiding vias to another surface. The rigid substrate provides a conducting layer on its inner surface such that the ink ejectors may be connected thereto with solder reflow techniques.

Abstract: An inkjet pen includes a multilayered platform and a plurality of printhead dies each mounted on the multilayered platform. The multilayered platform includes a first layer having an ink inlet defined therein, a second layer having a plurality of ink feed slots defined therein, and at least one third layer having an ink manifold defined therein. As such, the ink manifold of the at least one third layer fluidically couples the ink inlet of the first layer with the ink feed slots of the second layer. Each of the printhead dies are mounted on the second layer of the multilayered platform and include an array of printing elements and an ink refill slot communicating with the array of printing elements, with each of the printing elements including a firing chamber and a feed channel communicating with the firing chamber.

Abstract: An ink transfer sheet and method for using the same. The transfer sheet includes a backing layer, a release layer on the backing layer, and an ink receiving layer on the release layer. The ink receiving layer contains a quaternary ammonium salt thereon or impregnated therein. To use the transfer sheet, an ink containing an anionic coloring agent is applied to the ink receiving layer, preferably using thermal inkjet methods. Thereafter, the transfer sheet is positioned on a fabric substrate. Heat is applied to the sheet which causes the release layer and ink receiving layer to adhere to the substrate. The backing layer is then detached from the release layer leaving the release and ink receiving layers (with the printed image thereon) on the substrate. This process transfers the image to the fabric substrate, with the image being stabilized by interactions between the quaternary ammonium salt and anionic coloring agent.

Abstract: A three-color ink-jet cartridge has a conduit connecting an ink reservoir to a print head orifice. The conduit has a pair of internal longitudinal grooves to permit ink to flow past a trapped bubble in the conduit. This ink flow prevents ink leakage through the orifice when ambient pressure changes cause the trapped bubble to expand.

Abstract: An inkjet printing system includes a scalable printhead with an ink manifold. The scalable printhead is formed by mounting an ink manifold and multiple thermal inkjet printhead dies to a carrier substrate. The carrier substrate is machined to include through-slots. There is a through-slot for each refill slot among the multiple printhead dies. A first end of a given through-slot connects to a refill slot of a corresponding printhead die. An opposite, second end of the through-slot connects to the ink manifold. The ink manifold includes an inlet for coupling to an ink supply reservoir. The ink manifold also includes one or more channels and a plurality of feed openings. Each feed opening connects to a printhead die refill slot by way of a substrate through-slot.

Abstract: A robust printhead is disclosed comprising a substrate, an ink flow channel formed in the substrate, a beveled die having disposed heater resistors and which is inserted into the substrate, a TAB circuit used to electrically couple the beveled die to the substrate, and an encapsulated upper surface. The encapsulant is disposed at least over the electrical coupling between the beveled die and the interconnect.

Abstract: A scalable wide-array printhead is formed by mounting multiple thermal inkjet printheads to a carrier substrate. The printheads are mounted to one face and logic ICs and drive ICs are mounted to an opposite face. Interconnects are formed through the carrier substrate to electrically couple the printheads to the logic ICs and drive ICs. The carrier substrate is formed of silicon and etched to define ink refill slots. A solder bump mounting process is used to mount the printheads to the carrier substrate. Such process serves to align each of the printheads. The solder forms a fluidic boundary around a printhead ink slot.

Abstract: An ink transfer sheet and method for using the same. The transfer sheet includes a backing layer, a release layer on the backing layer, and an ink receiving layer on the release layer. The ink receiving layer contains a quaternary ammonium salt thereon or impregnated therein. To use the transfer sheet, an ink containing an anionic coloring agent is applied to the ink receiving layer, preferably using thermal inkjet methods. Thereafter, the transfer sheet is positioned on a fabric substrate. Heat is applied to the sheet which causes the release layer and ink receiving layer to adhere to the substrate. The backing layer is then detached from the release layer leaving the release and ink receiving layers (with the printed image thereon) on the substrate. This process transfers the image to the fabric substrate, with the image being stabilized by interactions between the quaternary ammonium salt and anionic coloring agent.

Abstract: An ink-jet pen is disclosed that has a body of resilient felted polyurethane foam mounted in an ink chamber for ink retention and backpressure. A rectangular ink pipe extends from a bottom wall of the ink chamber between the walls of the ink chamber. A wire mesh filter is mounted to the ink pipe. The ink pipe and mesh filter extend into compressive contact with the foam to locally increase the capillarity of the foam. Any air that comes out of solution collects as a bubble in the rectangular ink pipe. This bubble does not block ink flow to the printhead, however, because the corners of the rectangular ink pipe provide a fluid capillary path. The bubble tends to form in a spheroid shape and does not extend into the corners of the ink pipe. In addition, rectangular filters are used, which reduces waste and expense compared to circular filters.

Abstract: A fail-safe, backup valve for an ink-jet print head in a pressurized ink delivery system. The backup valve is in series with and is actuated by a back pressure regulator if the operating pressure of the print head approaches atmospheric pressure during operation.

Abstract: A three-color ink-jet cartridge has a conduit connecting an ink reservoir to a print head orifice. The conduit includes a standpipe which has a pair of internal longitudinal grooves to permit ink to flow past a trapped bubble in the standpipe thereby preventing ink leakage through the orifices when pressure changes cause the trapped bubble to expand. The conduit also includes a tube from the standpipe to the print head. Disposed longitudinally along the tube is a rib which enables capillary flow of ink around a bubble in the tube to prevent depriming of the print head.

Abstract: The present invention relates to free-ink type ink-jet pens. A dual-chambered housing forms ink accumulators which provide a local supply of ink for a printhead mechanism. The accumulators are fluidically coupled to an off-board ink reservoir by a valve mechanism. A pressure regulator mechanism is incorporated into a chamber for maintaining a predetermined gage set point back-pressure within the pen and for regulating the flow of ink from the reservoir by controlling the valve mechanism. A near linear force by biasing the regulator mechanism so as to balance it against a force exerted thereon by the ambient atmosphere via a vent when the valve mechanism is opened due to a force exerted by a differential between ambient atmospheric pressure and the bias force. The mechanism is insensitive to the rate of flow of ink through the valve.

Abstract: A multiplexed array of resistors including a plurality of address leads and a plurality of ground leads which cooperatively define a matrix of nodes, each node defining a possible location in the matrix for a resistor heater interconnecting one address lead and one ground lead. Resistor heaters are located in the array at only a portion of the nodes. The locations of the resistor heaters are selected to limit the conductance of alternate current paths around the resistor heater when addressed. The resistor heaters are preferably formed at nodes selected so that no two address leads are interconnected through resistor heaters to more than one common ground lead. Preferably, each alternate current path includes at least four non-addressed resistors in series.

Abstract: A method for processing an integrated circuit of the type having conductive die bond pads thereon. The fabricated IC is coated with a layer of photoresist. The photoresist is exposed to create a pattern which includes windows over the pads and a connection between at least two of the pads. The exposed photoresist is dissolved and the exposed portions are plated with gold to a depth sufficient for creating a bump over each die bond pad suitable for bonding a conductive lead thereto. The remaining photoresist is dissolved thus leaving a plurality of bumps for attaching conductive leads thereto and an electrical connection between at least two of the bumps.

Abstract: A tape automated bonding (TAB) frame and a process for testing the same. The frame is designed to receive a die, an integrated chip or other similar components having output leads. The frame generally comprises a relatively thin film of dielectric material, a pattern of substantially adjacent inner lead bonds, a pattern of substantially adjacent outer lead bonds for providing input/output ports to the die, and a pattern of substantilly adjacent probe points for providing test points to the frame and the die thereon. A generally flat and rigid plate is mounted on a prober for supporting both a cut-out portion of the frame and the die thereon. The testing process includes the steps of excising the die from the frame in the form of a coupon, such that the coupon contains the pattern of scrap probe points on the TAB frame and the die; placing the excised coupon onto the prober; aligning the coupon; and testing the coupon and the die.

Abstract: A tape automated bonding (TAB) test coupon excised from a TAB frame and a process for testing the coupon and the die mounted thereon. The coupon includes a relatively thin film of dielectric material and a pattern of substantially adjacent inner lead pads on the dielectric film. The inner lead pads are disposed in close proximity to the die. A pattern of substantially adjacent test probe pads generally surround the pattern of inner lead pads for providing test points for the frame and the die thereon. A pattern of substantially adjacent outer lead pads generally surround the pattern of test probe pads for providing input/output ports to the die. Electrical conductors interconnect the inner lead pads, the outer lead pads and the test probe pads in a predetermined conductive pattern. The inventive test process includes the steps of excising the die from the frame in the form of a coupon. The coupon contains the die, the inner lead pads and the pattern of test probe points.

Abstract: An integrated circuit (IC) and lead frame assembly comprises a first TAB segment having a plurality of leads having inner and outer ends. The inner ends are connected to bumps formed in a square pattern adjacent the periphery of the IC. A second TAB segment includes a plurality of leads having inner and outer ends. The inner ends are connected to a second set of bumps formed on the IC inwardly from the first set. The outer ends of the leads on the second TAB segment are connected to traces on the first TAB segment which are interleaved between the leads on the first TAB segment. The outer ends of the traces and leads on the first TAB segment thus connect to all of the IC bumps. This arrangement increases the number of connections which can be made to the IC.