Patents by Inventor Melissa Mei Ching Ng

Melissa Mei Ching Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Clip frame semiconductor packages and methods of formation thereof
    Patent number: 8951841
    Abstract: In one embodiment, a semiconductor package includes a clip frame with a first clip having a first support structure, a first lever, and a first contact portion, which is disposed on a front side of the semiconductor package. The first support structure is adjacent an opposite back side of the semiconductor package. The first lever joins the first contact portion and the first support structure. A first die is disposed over the first support structure of the first clip. The first die has a first contact pad on the front side of the semiconductor package. An encapsulant material surrounds the first die and the first clip.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: February 10, 2015
    Assignee: Infineon Technologies AG
    Inventors: Melissa Mei Ching Ng, Mei Chin Ng, Peng Soon Lim
  • Clip Frame Semiconductor Packages and Methods of Formation Thereof
    Publication number: 20130249067
    Abstract: In one embodiment, a semiconductor package includes a clip frame with a first clip having a first support structure, a first lever, and a first contact portion, which is disposed on a front side of the semiconductor package. The first support structure is adjacent an opposite back side of the semiconductor package. The first lever joins the first contact portion and the first support structure. A first die is disposed over the first support structure of the first clip. The first die has a first contact pad on the front side of the semiconductor package. An encapsulant material surrounds the first die and the first clip.
    Type: Application
    Filed: March 20, 2012
    Publication date: September 26, 2013
    Applicant: Infineon Technologies AG
    Inventors: Melissa Mei Ching Ng, Mei Chin Ng, Peng Soon Lim