Patents by Inventor Melissa Siow-Lui Lee

Melissa Siow-Lui Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging substrate comprising staggered vias
    Patent number: 6538307
    Abstract: A packaging substrate is formed with staggered vias interconnecting fan-out circuitry for improved strength and rigidity. Embodiments of the present invention include substrates wherein less than 20% of the vias are aligned.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: March 25, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Viswanath Valluri, Edwin Fontecha, Melissa Siow Lui Lee
  • Cu-balanced substrate
    Patent number: 6507100
    Abstract: A packaging substrate is formed with electrically non-functional areas of Cu on the upper surface and/or lower surface for improved strength and rigidity and reduced warpage and bending. Embodiments of the present invention include substrates containing electrically non-functional grid-like Cu areas on the upper and lower surface such that the ratio of the total Cu area on one surface is about 55% to about 100% of the total Cu area on the other surface.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: January 14, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Viswanath Valluri, Edwin Fontecha, Melissa Siow-Lui Lee
  • Stacked SRAM die package
    Patent number: 6476475
    Abstract: A circuit assembly is formed with a polyimide coated lower SRAM die and an upper die resin bonded to the SRAM die. The repair access opening in the polyimide coating on the upper surface of the SRAM die is filled with polyimide for protection before attaching the upper die to the SRAM die. Embodiments of the present invention including positioning a solid piece of polyimide within the repair access opening or spraying a thin coating of polyimide over the opening and on the first polyimide coating.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: November 5, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Melissa Siow-Lui Lee
  • Stacked die design with supporting O-ring
    Patent number: 6448659
    Abstract: A circuit assembly is formed with a lower die and an upper die, offset and stacked on the lower die. A resilient, e.g., elastomeric, O-ring is disposed about the periphery and adjacent side surfaces of the lower die to support the overhanging parts of the upper die. The supporting O-ring prevents the generation of stress inducing cracks in the upper die during wire bonding to bond pads on the overhanging parts of the upper die.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: September 10, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Melissa Siow-Lui Lee
  • Lead frame design for reduced wire sweep having a defined gap between tie bars and lead pins
    Patent number: 6225685
    Abstract: Wire sweep/crossing during resin molding is significantly reduced or prevented by reducing the gap spacing between corner lead pins and the tie bars of a die-attach pad. Embodiments of the present invention include spacing the tie bars from the corner lead pins by a distance no greater than about 18 mils, e.g., about 4 to 12 mils. Embodiments of the present invention also comprise a lead frame wherein the inner ends of the lead pins are arranged in a substantially planar array to define a substantially circular region surrounding the die-attach pad.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: May 1, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Robert Newman, Chu-Chung Stephen Lee, Melissa Siow-Lui Lee