Patents by Inventor Melissa WETTE

Melissa WETTE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective deposition of embedded thin-film resistors for semiconductor packaging
    Patent number: 11728265
    Abstract: Embodiments include package substrates and a method of forming the package substrates. A package substrate includes a dielectric having a cavity that has a footprint, a resistor embedded in the cavity of the dielectric, and a plurality of traces on the resistor, where a plurality of surfaces of the resistor are activated surfaces. The resistor may also have a plurality of sidewalls which may be activated sidewalls and tapered. The dielectric may include metallization particles/ions. The resistor may include resistive materials, such as nickel-phosphorus (NiP), aluminum-nitride (AlN), and/or titanium-nitride (TiN). The package substrate may further include a first resistor embedded adjacently to the resistor. The first resistor may have a first footprint of a first cavity that is different than the footprint of the cavity of the resistor. The resistor may have a resistance value that is thus different than a first resistance value of the first resistor.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventors: Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li, Sameer Paital, Darko Grujicic, Rengarajan Shanmugam, Melissa Wette, Srinivas Pietambaram
  • SELECTIVE DEPOSITION OF EMBEDDED THIN-FILM RESISTORS FOR SEMICONDUCTOR PACKAGING
    Publication number: 20200083164
    Abstract: Embodiments include package substrates and a method of forming the package substrates. A package substrate includes a dielectric having a cavity that has a footprint, a resistor embedded in the cavity of the dielectric, and a plurality of traces on the resistor, where a plurality of surfaces of the resistor are activated surfaces. The resistor may also have a plurality of sidewalls which may be activated sidewalls and tapered. The dielectric may include metallization particles/ions. The resistor may include resistive materials, such as nickel-phosphorus (NiP), aluminum-nitride (AlN), and/or titanium-nitride (TiN). The package substrate may further include a first resistor embedded adjacently to the resistor. The first resistor may have a first footprint of a first cavity that is different than the footprint of the cavity of the resistor. The resistor may have a resistance value that is thus different than a first resistance value of the first resistor.
    Type: Application
    Filed: September 12, 2018
    Publication date: March 12, 2020
    Inventors: Brandon C. MARIN, Frank TRUONG, Shivasubramanian BALASUBRAMANIAN, Dilan SENEVIRATNE, Yonggang LI, Sameer PAITAL, Darko GRUJICIC, Rengarajan SHANMUGAM, Melissa WETTE, Srinivas PIETAMBARAM