Abstract: One embodiment of the present invention includes a method for aligning a wafermap with a semiconductor wafer. The method may comprise assigning a location code to each of a plurality of dies on the wafermap. Each of the plurality of dies on the wafermap can correspond to each of a plurality of dies on the semiconductor wafer. The method may also comprise scanning an approximate location of a reference die on the semiconductor wafer with a die detection sensor based on the location code corresponding to a location of the reference die on the wafermap and determining a physical location of the reference die on the semiconductor wafer using the die detection sensor. The method may further comprise correlating the physical location of the reference die on the semiconductor wafer with the respective location code corresponding to the reference die on the wafermap.

Abstract: Disclosed herein is a warp detection system (200) for determining warping in a carrier (110) configured to carry substrates (120) for processing. In one embodiment, the system (200) includes a guide plate (210) configured to guide a path of the carrier (110) during the processing, where the guide plate (210) is positioned underneath the carrier (110). In addition, the system (220) includes a plurality of sensors (230) positioned within the guide plate (210), wherein each of the plurality of sensors (230) is configured to measure a distance of a respective area of the carrier (110) from the guide plate (210). Also in this embodiment, the system (200) includes a processing device (310) configured to receive the measured distances and determine warping in the carrier (110) based on differences between the measured distances.

Abstract: A conveyor system (30) comprises: a boat (20), a feed belt (36), a feed pulley (38), and improved railings (34). The boat (20) is adapted to carry a component or components, such as semiconductor chips (32), therein. The feed belt (36) is driven by the feed pulley (38). The feed belt (36) is adapted to move the boat (20) along the conveyor system (30). The improved railings (34) are adapted to retain the boat (20) and to define a path for the boat (20). A set of bearings (44) are coupled to each of the improved railings (34) in locations such that the boat (20) will contact the bearings (44) rather than the railings (34) for at least part of the path as the boat (20) moves along the conveyor system (30).

Abstract: A work station for a chip bonder, and/or for a wire bonder includes a clampless, porous ceramic vacuum chuck where the substrate under assembly is securely and uniformly held by vacuum applied through many tiny pores distributed across the work surface. Porous ceramic work stations are applicable to a family of packages, or to a substrate outline, and may include one or more chips within the same indexing operation. Reliability and yield of the assembled semiconductor devices is enhanced by avoiding uneven or warped substrates. In addition, the porous ceramic work holder provides a cost effective apparatus by eliminating device specific clamps and work holders, the time required for change-out and set-up.

Abstract: A work station for a chip bonder, and/or for a wire bonder includes a clampless, porous ceramic vacuum chuck where the substrate under assembly is securely and uniformly held by vacuum applied through many tiny pores distributed across the work surface. Porous ceramic work stations are applicable to a family of packages, or to a substrate outline, and may include one or more chips within the same indexing operation. Reliability and yield of the assembled semiconductor devices is enhanced by avoiding uneven or warped substrates. In addition, the porous ceramic work holder provides a cost effective apparatus by eliminating device specific clamps and work holders, the time required for change-out and set-up.

Abstract: A conveyor system (30) comprises: a boat (20), a feed belt (36), a feed pulley (38), and improved railings (34). The boat (20) is adapted to carry a component or components, such as semiconductor chips (32), therein. The feed belt (36) is driven by the feed pulley (38). The feed belt (36) is adapted to move the boat (20) along the conveyor system (30). The improved railings (34) are adapted to retain the boat (20) and to define a path for the boat (20). A set of bearings (44) are coupled to each of the improved railings (34) in locations such that the boat (20) will contact the bearings (44) rather than the railings (34) for at least part of the path as the boat (20) moves along the conveyor system (30).