Patents by Inventor Melvin B Khoo

Melvin B Khoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming microstructures
    Patent number: 7271022
    Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: September 18, 2007
    Assignee: Touchdown Technologies, Inc.
    Inventors: Weilong Tang, Tseng-Yang Hsu, Salleh Ismail, Nim Hak Tea, Melvin B Khoo, Raffi Garabedian, Lakshimikanth Namburi
  • Process for forming MEMS
    Patent number: 7264984
    Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: September 4, 2007
    Assignee: Touchdown Technologies, Inc.
    Inventors: Raffi Garabedian, Salleh Ismail, Nim Hak Tea, Tseng-Yang Hsu, Melvin B Khoo, Weilong Tang