Patents by Inventor Melvin J. Dela Pena

Melvin J. Dela Pena has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8213121
    Abstract: A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: July 3, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Melvin J. A. Dela Pena, Edmar C. Escober, Sandy E. Joson, Teddy T. Tabarangao
  • Publication number: 20090109593
    Abstract: The present invention provides a tubular wrist-strap cord holder that retains a wrist-strap cord used by an operator to install components during the manufacturing of hard disk drives in order to provide grounding to the operator as the operator handles electrically sensitive components and also to provide mobility to the operator within the assembly floor. In one embodiment. The tubular wrist-strap cord holder is made of polyurethane material and comprises of a plurality of apertures for allowing for the insertion of a grounding cord, a retaining hole that allows the tubular wrist-strap cord holder to be attached to a surface work space and a slit or opening that runs the length of the tubular wrist-strap cord holder to enable the operator to insert and remove the grounding cord as needed.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Inventors: Melvin J.A. Dela Pena, Mary Jane Frial, Lorna M. Sayco, Madona B. Tolentino
  • Publication number: 20090091860
    Abstract: A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the said base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.
    Type: Application
    Filed: October 9, 2007
    Publication date: April 9, 2009
    Inventors: Melvin J. Dela Pena, Edmar C. Escober, Sandy E. Joson, Teddy T. Tabarangao