Patents by Inventor Melvin Khoo
Melvin Khoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8344748Abstract: A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle between ?90 degrees and 90 degrees, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.Type: GrantFiled: January 25, 2010Date of Patent: January 1, 2013Assignee: Advantest America, Inc.Inventors: Melvin Khoo, Ting Hu, Matthew Losey
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Patent number: 8278956Abstract: A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion.Type: GrantFiled: April 8, 2010Date of Patent: October 2, 2012Assignee: Advantest America, IncInventors: Matt Losey, Melvin Khoo, Yohannes Desta, Chang Huang
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Publication number: 20120032697Abstract: A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle between ?90 degrees and 90 degrees, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.Type: ApplicationFiled: January 25, 2010Publication date: February 9, 2012Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Melvin Khoo, Ting Hu, Matthew Losey
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Publication number: 20110248735Abstract: A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion.Type: ApplicationFiled: April 8, 2010Publication date: October 13, 2011Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Matt Losey, Melvin Khoo, Yohannes Desta, Chang Huang
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Patent number: 7922888Abstract: The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.Type: GrantFiled: April 27, 2007Date of Patent: April 12, 2011Assignee: Touchdown Technologies, Inc.Inventors: Salleh Ismail, Nim Tea, Yang Hsu, Weilong Tang, Raffi Garabedian, Melvin Khoo
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Patent number: 7772859Abstract: A novel probe design is presented that increases a probe tolerance to stress fractures. The probe includes a base, a torsion element connected to the base, and a second element connected to the torsion element through a union angle. The union angle includes an interface between the torsion element and the second element, and the edge of the interface is shaped to diffuse stress. What is further-disclosed are three features that increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.Type: GrantFiled: March 4, 2008Date of Patent: August 10, 2010Assignee: Touchdown Technologies, Inc.Inventors: Melvin Khoo, Nim Tea, Ting Hu, Zhiyong An
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Patent number: 7724010Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.Type: GrantFiled: November 9, 2007Date of Patent: May 25, 2010Assignee: Touchdown Technologies, Inc.Inventors: Melvin Khoo, Nim Tea, Salleh Ismail, Yang Hsu, Weilong Tang, Raffi Garabedian
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Patent number: 7589542Abstract: A hybrid probe design is presented that includes a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The probe includes a base, a torsion element, a bending element, and a tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Adjusting the position of a pivot can alter the probe's energy absorption characteristics. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.Type: GrantFiled: April 12, 2007Date of Patent: September 15, 2009Assignee: Touchdown Technologies Inc.Inventors: Melvin Khoo, Nim Tea, Zhiyong An, Ting Hu
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Patent number: 7538567Abstract: A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.Type: GrantFiled: July 12, 2006Date of Patent: May 26, 2009Assignee: Touchdown Technologies, Inc.Inventors: Shaoning Lu, Melvin Khoo, Nim Tea
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Publication number: 20080252328Abstract: A novel probe design is presented that increases a probe tolerance to stress fractures. Specifically, what is disclosed are three features increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.Type: ApplicationFiled: March 4, 2008Publication date: October 16, 2008Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Zhiyong An, Melvin Khoo, Nim Tea, Ting Hu
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Publication number: 20080252310Abstract: A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.Type: ApplicationFiled: April 12, 2007Publication date: October 16, 2008Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Nim Tea, Zhiyong An, Melvin Khoo
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Publication number: 20080106289Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.Type: ApplicationFiled: November 9, 2007Publication date: May 8, 2008Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Melvin Khoo, Nim Tea, Salleh Ismail, Yang Hsu, Weilong Tang, Raffi Garabedian
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Patent number: 7362119Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.Type: GrantFiled: August 1, 2005Date of Patent: April 22, 2008Assignee: Touchdown Technologies, IncInventors: Melvin Khoo, Nim Tea, Salleh Ismail, Yang Hsu, Weilong Tang, Raffi Garabedian
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Publication number: 20080012594Abstract: A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.Type: ApplicationFiled: July 12, 2006Publication date: January 17, 2008Inventors: Shaoning Lu, Melvin Khoo, Nim Tea
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Publication number: 20070240306Abstract: The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.Type: ApplicationFiled: April 27, 2007Publication date: October 18, 2007Inventors: Salleh Ismail, Nim Tea, Yang Hsu, Weilong Tang, Raffi Garabedian, Melvin Khoo
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Patent number: 7245135Abstract: The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.Type: GrantFiled: August 1, 2005Date of Patent: July 17, 2007Assignee: Touchdown Technologies, Inc.Inventors: Salleh Ismail, Nim Tea, Yang Hsu, Weilong Tang, Raffi Garabedian, Melvin Khoo
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Publication number: 20070024298Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.Type: ApplicationFiled: August 1, 2005Publication date: February 1, 2007Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Melvin Khoo, Nim Tea, Salleh Ismail, Yang Hsu, Weilong Tang, Raffi Garabedian
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Publication number: 20070024297Abstract: The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.Type: ApplicationFiled: August 1, 2005Publication date: February 1, 2007Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Salleh Ismail, Nim Tea, Yang Hsu, Weilong Tang, Raffi Garabedian, Melvin Khoo
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Publication number: 20060134820Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.Type: ApplicationFiled: April 11, 2005Publication date: June 22, 2006Inventors: Weilong Tang, Tseng-Yang Hsu, Salleh Ismail, Nim Tea, Melvin Khoo, Raffi Garabedian, Lakshmikanth Namburi
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Publication number: 20060134819Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.Type: ApplicationFiled: December 21, 2004Publication date: June 22, 2006Applicant: Integrated Micromachines, Inc.Inventors: Weilong Tang, Tseng-Yang Hsu, Salleh Ismail, Nim Tea, Melvin Khoo, Raffi Garabedian