Patents by Inventor Melvin Levardo

Melvin Levardo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method Of Manufacturing A Package Using A Clip Having At Least One Locking Recess
    Publication number: 20230387068
    Abstract: A method of manufacturing a package includes: connecting an electronic component with a carrier by a clip having at least one locking recess; partially encapsulating the clip by an encapsulant so that at least part of a main surface of the clip remains partially exposed with respect to the encapsulant; and locking the encapsulant and the clip by accommodating material of the encapsulant in the at least one locking recess.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Inventors: Melvin Levardo, Ryan Ross Agbay Alinea, Markus Dinkel
  • Clip having locking recess for connecting an electronic component with a carrier in a package
    Patent number: 11728309
    Abstract: A clip for connecting an electronic component with a carrier in a package is provided. The clip includes a clip body having a component connection portion configured to be connected with the electronic component to be mounted on the carrier, and a carrier connection portion configured to be connected with the carrier. The clip further includes at least one locking recess in a surface portion of the clip body, the surface portion being configured to face the carrier. The at least one locking recess is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip. A corresponding method of manufacturing the package is also provided.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Melvin Levardo, Ryan Ross Agbay Alinea, Markus Dinkel
  • Clip Having Locking Recess
    Publication number: 20200365549
    Abstract: A clip for connecting an electronic component with a carrier in a package is provided. The clip includes a clip body having a component connection portion configured to be connected with the electronic component to be mounted on the carrier, and a carrier connection portion configured to be connected with the carrier. The clip further includes at least one locking recess in a surface portion of the clip body, the surface portion being configured to face the carrier. The at least one locking recess is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip. A corresponding method of manufacturing the package is also provided.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 19, 2020
    Inventors: Melvin Levardo, Ryan Ross Agbay Alinea, Markus Dinkel