Abstract: A electrical connection element includes a planar mating surface adapted for mating with a metal bonding surface, a rim that forms an enclosed shape around the planar mating surface, and a plurality of outgassing grooves formed in the planar mating surface, wherein each of the outgassing grooves comprises a proximal end that is spaced apart from the rim and a distal end that intersects the rim, and wherein a cross-sectional area of each of the outgassing grooves increases along a lengthwise direction going from the proximal end to the distal end.

Abstract: A electrical connection element includes a planar mating surface adapted for mating with a metal bonding surface, a rim that forms an enclosed shape around the planar mating surface, and a plurality of outgassing grooves formed in the planar mating surface, wherein each of the outgassing grooves comprises a proximal end that is spaced apart from the rim and a distal end that intersects the rim, and wherein a cross-sectional area of each of the outgassing grooves increases along a lengthwise direction going from the proximal end to the distal end.

Abstract: A method of manufacturing a package includes: connecting an electronic component with a carrier by a clip having at least one locking recess; partially encapsulating the clip by an encapsulant so that at least part of a main surface of the clip remains partially exposed with respect to the encapsulant; and locking the encapsulant and the clip by accommodating material of the encapsulant in the at least one locking recess.

Abstract: A clip for connecting an electronic component with a carrier in a package is provided. The clip includes a clip body having a component connection portion configured to be connected with the electronic component to be mounted on the carrier, and a carrier connection portion configured to be connected with the carrier. The clip further includes at least one locking recess in a surface portion of the clip body, the surface portion being configured to face the carrier. The at least one locking recess is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip. A corresponding method of manufacturing the package is also provided.

Abstract: A clip for connecting an electronic component with a carrier in a package is provided. The clip includes a clip body having a component connection portion configured to be connected with the electronic component to be mounted on the carrier, and a carrier connection portion configured to be connected with the carrier. The clip further includes at least one locking recess in a surface portion of the clip body, the surface portion being configured to face the carrier. The at least one locking recess is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip. A corresponding method of manufacturing the package is also provided.