Abstract: A microelectronic package including a first microelectronic die and a second microelectronic die with a plurality of standoffs extending therebetween and an encapsulation material disposed between the first microelectronic die and the second microelectronic die, which extends between at least two the plurality of standoffs.

Abstract: A microelectronic package including a first microelectronic die and a second microelectronic die with a plurality of standoffs extending therebetween and an encapsulation material disposed between the first microelectronic die and the second microelectronic die, which extends between at least two the plurality of standoffs.

Abstract: A microelectronic assembly including a flexible substrate with a first and a second surface, and with a microelectronic die portion and an external interconnect portion. The substrate has conductive traces integrated therewith. A first microelectronic die has an active surface electrically connected to the substrate first surface in the substrate microelectronic die portion. A second microelectronic die is electrically connected by its active surface to the substrate second surface in the substrate microelectronic die portion. External interconnect pads are disposed on the substrate second surface in the substrate external interconnect portion, wherein at least one conductive trace is in electrical contact with at least one external interconnect pad and with either the first microelectronic die, the second microelectronic die, or both. The substrate is folded and a portion of the first surface in the external interconnect portion is attached to a back surface of the first microelectronic die.