Patents by Inventor Melvin Norris

Melvin Norris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11772715
    Abstract: A composite panel for a storage container and method for producing a composite panel is provided. The composite panel includes a composite assembly and a metallic connecting strip. The composite assembly includes a first polymer skin, a second polymer skin, and a core disposed between the first polymer skin and the second polymer skin. The metallic connecting strip is bonded to the composite assembly.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: October 3, 2023
    Assignee: Wabash National, L.P.
    Inventor: Melvin Norris
  • Publication number: 20200307723
    Abstract: A composite panel for a storage container and method for producing a composite panel is provided. The composite panel includes a composite assembly and a metallic connecting strip. The composite assembly includes a first polymer skin, a second polymer skin, and a core disposed between the first polymer skin and the second polymer skin. The metallic connecting strip is bonded to the composite assembly.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Inventor: Melvin Norris
  • Patent number: 6415971
    Abstract: An apparatus and methods for handling and texturing yarn are provided. The apparatus preferably includes a yarn supply positioned to supply a plurality of strands of yarn, a false twister positioned downstream from the yarn supply for imparting a false twist to the plurality of strands of yarn, a yarn undulation former positioned downstream from the false twister for forming undulations in each of the plurality of strands of yarn, and a conveyor positioned to receive the plurality of yarn strands having undulations formed therein and for conveying the undulated strands of yarn downstream.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: July 9, 2002
    Assignee: American Linc Corporation
    Inventors: Donald Lynn Hoover, Ronnie Wayne Dye, Johnny Melvin Norris, Jr., Everett Lee Carswell
  • Publication number: 20020027149
    Abstract: An apparatus and methods for handling and texturing yarn are provided. The apparatus preferably includes a yarn supply positioned to supply a plurality of strands of yarn, a false twister positioned downstream from the yarn supply for imparting a false twist to the plurality of strands of yarn, a yarn undulation former positioned downstream from the false twister for forming undulations in each of the plurality of strands of yarn, and a conveyor positioned to receive the plurality of yarn strands having undulations formed therein and for conveying the undulated strands of yarn downstream.
    Type: Application
    Filed: August 29, 2001
    Publication date: March 7, 2002
    Applicant: American Linc Corporation
    Inventors: Donald Lynn Hoover, Ronnie Wayne Dye, Johnny Melvin Norris, Everett Lee Carswell
  • Patent number: 6302308
    Abstract: An apparatus and methods for handling and texturing yarn are provided. The apparatus preferably includes a yarn supply positioned to supply a plurality of strands of yarn, a false twister positioned downstream from the yarn supply for imparting a false twist to the plurality of strands of yarn, a yarn undulation former positioned downstream from the false twister for forming undulations in each of the plurality of strands of yarn, and a conveyor positioned to receive the plurality of yarn strands having undulations formed therein and for conveying the undulated strands of yarn downstream.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: October 16, 2001
    Assignee: American Linc Corporation
    Inventors: Donald Lynn Hoover, Ronnie Wayne Dye, Johnny Melvin Norris, Jr., Everett Lee Carswell
  • Patent number: 3968193
    Abstract: A process for forming a glass interconnection package for semiconductor chips including the steps of depositing a first layer of glass material on a supporting substrate and then heating the layer in a first gaseous ambient which is soluble in the glass material. Immediately thereafter, the first gaseous ambient is replaced by a second gaseous ambient which is insoluble in the glass material and the glass layer is heated and then cooled down to ambient atmosphere.
    Type: Grant
    Filed: August 27, 1971
    Date of Patent: July 6, 1976
    Assignee: International Business Machines Corporation
    Inventors: Perry Robert Langston, Jr., Melvin Norris Turetzky