Patents by Inventor Melvin Norris Turetzky

Melvin Norris Turetzky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 3968193
    Abstract: A process for forming a glass interconnection package for semiconductor chips including the steps of depositing a first layer of glass material on a supporting substrate and then heating the layer in a first gaseous ambient which is soluble in the glass material. Immediately thereafter, the first gaseous ambient is replaced by a second gaseous ambient which is insoluble in the glass material and the glass layer is heated and then cooled down to ambient atmosphere.
    Type: Grant
    Filed: August 27, 1971
    Date of Patent: July 6, 1976
    Assignee: International Business Machines Corporation
    Inventors: Perry Robert Langston, Jr., Melvin Norris Turetzky