Abstract: A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor assembly includes a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side. The insulator is formed on the second side and an end of the conductive via. The method includes forming a polymer layer on the insulator layer, removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer, and forming a conductive contact on the polymer layer and the end of the conductive via.

Abstract: A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor assembly includes a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side. The insulator is formed on the second side and an end of the conductive via. The method includes forming a polymer layer on the insulator layer, removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer, and forming a conductive contact on the polymer layer and the end of the conductive via.

Abstract: A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor assembly includes a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side. The insulator is formed on the second side and an end of the conductive via. The method includes forming a polymer layer on the insulator layer, removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer, and forming a conductive contact on the polymer layer and the end of the conductive via.

Abstract: A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor assembly includes a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side. The insulator is formed on the second side and an end of the conductive via. The method includes forming a polymer layer on the insulator layer, removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer, and forming a conductive contact on the polymer layer and the end of the conductive via.

Abstract: The present invention relates to polyimide photo alignment films for liquid crystal display devices comprising an aromatic tetracarboxylic dianhydride component containing 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and an aromatic diamine component containing at least one diamine of the group of fofmulae AI to AIII as given in the text. Further display devices and methods of their fabrication employing a photo alignment process are disclosed.

Abstract: The present invention relates to polyimide photo alignment films for liquid crystal display devices comprising an aromatic tetracarboxylic dianhydride component containing 3,3',4,4'-benzophenone tetracarboxylic dianhydride and an aromatic diamine component containing at least one diamine of the group of formulae AI to AIII as given in the text. Further display devices and methods of their fabrication employing a photo alignment process are disclosed.

Abstract: A poly(2,6-piperazinedione) liquid crystal alignment film providing high voltage holding ratio and high tilt angle when used in active matrix and super twisted nematic liquid crystal displays.

Abstract: Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per .degree. C, a basis weight of from 0.8 to 4.0 oz/yd.sup.2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.

Abstract: Disclosed is a method of making a printed circuit board by exposing in a circuit pattern the polymeric surface of a conductive substrate coated with a polymer selected from the group consisting of polyimides, polyamide-imides, polyester-amide-imides, polysulfones, polyphenylene sulfides, and polyphenylene oxides, to an ion beam at an energy of about 50 KeV to about 2 MeV and a fluence of about 10.sup.15 to 10.sup.18 ions/cm.sup.2. The surface is then wet blasted and the portions of the polymeric surface that have been exposed to the ion beam are electrolessly plated with a metal such as nickel or copper. Also disclosed is a coated substrate comprising a metal or conductive surface and an imide polymeric coating on the surface which can be electrophoretically deposited, a portion of which has been exposed to an ion beam.

Abstract: Disclosed is a composition that includes a liquid prepolymer that is the reaction product of a monoanhydride, a cycloaliphatic epoxy, and an alcohol. Also included in the composition is a maleated polybutadiene that is a reaction product of butadiene, maleic anhydride, and an oxygen scavenger. The composition also includes a tertiary amine accelerator, a free-radical initiator, and a solvent. A prepreg is prepared from the composition by immersing a porous substrate into the composition, drying and curing to the B-stage. A laminate is prepared by forming a stack of prepregs and heating under pressure to the C-stage.