Patents by Inventor MEMC ELECTRONIC MATERIALS, SPA

MEMC ELECTRONIC MATERIALS, SPA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130174828
    Abstract: Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid that comes in contact with the ingot. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.
    Type: Application
    Filed: December 7, 2012
    Publication date: July 11, 2013
    Applicant: MEMC ELECTRONIC MATERIALS, SPA
    Inventor: MEMC ELECTRONIC MATERIALS, SPA