Abstract: Disclosed is a compact electronic device configured to efficiently manage air circulation and prevent overheating. The device features an innovative cooling system comprising a fan module within a uniquely structured housing that includes a base portion, an inner casing, and a removable top cover. The inner casing features strategically placed windows that direct drawn airflow over specific power supply components, enhancing cooling performance. The enhanced cooling is also provided by an air gap formed between the base portion and the top cover, as well as sidewall intake paths of varying widths adjacent the windows. These features work together to draw in and distribute ambient air effectively across heat-generating components, leveraging negative pressure created by a fan module. The result is a highly efficient cooling mechanism for compact devices such as wireless access point configured to plug into electrical outlets.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: New layered double hydroxide materials useful as intermediates in the formation of catalysts are described, as well as methods of preparing the layered double hydroxides. Also described are catalysts suitable for catalysing the hydrogenation of CO2 to methanol, as well as methods for preparing the catalysts. The LDH-derived catalysts of the invention are active in the hydrogenation of CO2 to methanol, and show improved activity with respect to Cu/ZnO catalysts derived from copper-zinc hydroxycarbonate precursors.

Abstract: A circuit check method and an electronic apparatus applicable to a to-be-tested circuit are provided. The to-be-tested circuit has one or more first nodes related to a gate voltage of one or more transistor devices and a plurality of second nodes. The circuit check method includes: setting endpoint voltages of a plurality of input interface ports of the to-be-tested circuit; obtaining a first node voltage of the first node according to a conduction path of the to-be-tested circuit and the gate voltage of the transistor device; obtaining a second node voltage of each second node according to the conduction path, the endpoint voltages, and the first node voltage; and performing circuit static check on the to-be-tested circuit by applying the first node voltage and the second node voltage.

Abstract: A method for evaluation of thin film non-uniform stress using high order wafer warpage, the steps including measuring a net wafer warpage across a wafer area due to thin film deposition, fitting a two dimensional low-order polynomial to the wafer warpage measurements and subtracting the low-order polynomial from the net wafer warpage across the wafer area.

Abstract: An energy storage system is provided for an electric vehicle. The energy storage system comprises a first energy storage source. The first energy storage source includes an ammonia tank configured to hold ammonia, an ammonia converter configured to receive ammonia from the ammonia tank and convert the received ammonia into hydrogen, and a fuel cell system communicating with the ammonia converter and configured to generate output power from hydrogen that is received from the ammonia converter.

Abstract: A processing system is adapted to execute a method for testing power leakage of a circuit. The method includes: obtaining a plurality of undefined nets according to a netlist and power mode information; obtaining a trace path according to the undefined nets and the power mode information; and determining whether there is a risk of power leakage in the trace path, and outputting a testing result.

Abstract: A smart ring includes a battery, memory, processing circuitry, a plurality of sensors, a plurality of antennas, and a battery, each coupled to one another and all enclosed in a casing, wherein the processing circuitry is configured to conserve the battery by any of sending data to the cloud service when an application is open on the user device, sending data to the cloud service when a threshold is crossed, waking up processing or communicating when there is a change in motion detected by the accelerometer.

Abstract: A method for evaluation of thin film non-uniform stress using high order wafer warpage, the steps including measuring a net wafer warpage across a wafer area due to thin film deposition, fitting a two dimensional low-order polynomial to the wafer warpage measurements and subtracting the low-order polynomial from the net wafer warpage across the wafer area.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: A circuit check method and an electronic apparatus applicable to a to-be-tested circuit are provided. The to-be-tested circuit has one or more first nodes related to a gate voltage of one or more transistor devices and a plurality of second nodes. The circuit check method includes: setting endpoint voltages of a plurality of input interface ports of the to-be-tested circuit; obtaining a first node voltage of the first node according to a conduction path of the to-be-tested circuit and the gate voltage of the transistor device; obtaining a second node voltage of each second node according to the conduction path, the endpoint voltages, and the first node voltage; and performing circuit static check on the to-be-tested circuit by applying the first node voltage and the second node voltage.

Abstract: A method of detecting the relations between the pins of a circuit and a computer program product thereof are provided. The method includes: retrieving a circuit description file describing a circuit; retrieving at least one data pin and at least one clock pin of the circuit; converting the circuit to a cell level; and tracing the circuit in the cell level to identify multiple flip-flops coupled to the clock pin; tracing the circuit in the cell level to identify a target flip-flop coupled to the data pin; and determining whether the data pin is related to the clock pin according to the data signal and the clock signal of the target flip-flop.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: A method for evaluation of thin film non-uniform stress using high order wafer warpage, the steps including measuring a net wafer warpage across a wafer area due to thin film deposition, fitting a two dimensional low-order polynomial to the wafer warpage measurements and subtracting the low-order polynomial from the net wafer warpage across the wafer area.

Abstract: A method of detecting the relations between the pins of a circuit and a computer program product thereof are provided. The method includes: retrieving a circuit description file describing a circuit; retrieving at least one data pin and at least one clock pin of the circuit; converting the circuit to a cell level; and tracing the circuit in the cell level to identify multiple flip-flops coupled to the clock pin; tracing the circuit in the cell level to identify a target flip-flop coupled to the data pin; and determining whether the data pin is related to the clock pin according to the data signal and the clock signal of the target flip-flop.

Abstract: A checking method for checking whether a signal in a chip is interference-free, and the checking method includes the following operations: analyzing, by a processor, a netlist file to acquire a first node for outputting the signal in the chip, in which the netlist file is configured to describe a circuit architecture of the chip; searching, by the processor, candidate nodes associated with the signal according to the netlist file and the first node; and determining, by the processor, whether a first candidate node of the candidate nodes is connected to an anti-interference circuit, in order to check whether the signal is interference-free.