Abstract: A wafer picking and placing apparatus includes a platform and a hooking unit. The platform is adapted to support a wafer. The hooking unit includes a driving device and a hooking structure, and the hooking structure is connected to the driving device and has at least one hooking end. The driving device is adapted to drive the hooking structure to move between a first position and a second position in a horizontal direction. The driving device is adapted to drive the hooking structure to move between the second position and a third position above the second position in a vertical direction. When the hooking structure is located at the first position, the hooking end is away from the platform. When the hooking structure is located at the second position, the hooking end inserts between a lower side of an edge of the wafer and the platform to hook the wafer.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An integrated circuit is disclosed. The integrated circuit is coupled to a circuit board. The circuit board includes several signal pair channels. The integrated circuit includes several output terminals and a control circuit. The control circuit is configured to configure several output signals output to several signal pair channels by several output terminals, so that a first signal pair channel and a second signal pair channel of several signal pair channels receive and output several output signals, so that a third signal pair channel of several signal pair channels shields an interference between the first signal pair channel and the second signal pair channel. The third signal pair channel is adjacent to the first signal pair channel and the second signal pair channel, and the third signal pair channel is located between the first signal pair channel and the second signal pair channel.

Abstract: A light-emitting diode includes an epitaxial structure and a first metal electrode. The epitaxial structure has a first surface and a second surface opposite thereto, and includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer. The first-type semiconductor layer includes an ohmic contact layer which at least partially defines the first surface. The first metal electrode is disposed on the first surface, and includes a main electrode and auxiliary electrodes which are disposed on and electrically connected to the ohmic contact layer. The ohmic contact layer is made of AlxGayInP, where 0?x?1 or 0?y?1. In a top view of the light-emitting layer, a projection of each auxiliary electrode on the first surface is smaller than or equal to that of the ohmic contact layer on the first surface. A light-emitting divide including the light-emitting diode, and a method for manufacturing the light-emitting diode are also provided.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A test method is configured to test a chip on a circuit under test, wherein the circuit under test further includes a DC-DC converter. The test method includes the operations of: generating a test pulse signal; filtering the test pulse signal to generate a first test DC voltage to the DC-DC converter, wherein the DC-DC converter transforms the first test DC voltage to a second test DC voltage and transmits the second test DC voltage to the chip; and extracting an output signal of the chip to determine a performance of the chip, wherein the chip generates the output signal according to the second test DC voltage.

Abstract: A signal transmission device is installed on a motherboard and is electrically connected to a signal control unit and a display output interface. The signal transmission device includes a signal receiving port, a signal output port, and a printed circuit connecting port. The signal receiving port is used for receiving a signal transmitted from the signal control unit. The signal output port is used for single output of the signal to the display output interface. The printed circuit connecting port is used for transmitting the signal from the signal receiving port to the signal output port. Thus, the signal transmission device may be used for single signal output so as to replace a switch integrated circuit of selective signal output. In such a manner, related circuit redesign and manufacturing cost may be reduced accordingly when the motherboard signal output design is changed from selective signal output to single signal output.

Abstract: A signal transmission device is installed on a motherboard and is electrically connected to a signal control unit and a display output interface. The signal transmission device includes a signal receiving port, a signal output port, and a printed circuit connecting port. The signal receiving port is used for receiving a signal transmitted from the signal control unit. The signal output port is used for single output of the signal to the display output interface. The printed circuit connecting port is used for transmitting the signal from the signal receiving port to the signal output port. Thus, the signal transmission device may be used for single signal output so as to replace a switch integrated circuit of selective signal output. In such a manner, related circuit redesign and manufacturing cost may be reduced accordingly when the motherboard signal output design is changed from selective signal output to single signal output.