Patents by Inventor Meng Chan

Meng Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier facilitating radio-frequency identification (RFID) operation in a semiconductor fabrication system
    Publication number: 20060043197
    Abstract: A carrier for radio-frequency identification (RFID) operation in a fab. A carrier body comprises a plate inscribed with permanent information corresponding to the carrier. A RFID tag is mounted on the carrier body, and stores the permanent information.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 2, 2006
    Inventors: Yung Chang, Hsieh Fu, Hung Hsieh, Meng Chan
  • Integrated circuit package with transparent encapsulant and method for making thereof
    Publication number: 20050167790
    Abstract: IC package with transparent encapsulant and method for making thereof. The IC package includes a die pad including a pad bottom surface, a die disposed on the die pad and including an integrated circuit, a plurality of leads including a plurality of lead bottom surfaces, a plurality of conductive wires connecting the die and the plurality of leads, and an encapsulant material. The encapsulant material is transparent for visible wavelengths. The pad bottom surface is exposed without being covered by the encapsulant material, and the plurality of lead bottom surfaces each are exposed without being covered by the encapsulant material.
    Type: Application
    Filed: December 29, 2004
    Publication date: August 4, 2005
    Applicant: Carsem (M) Sdn.Bhd.
    Inventors: Lek Khor, Huat Lee, Meng Chan, Kong Thum, Mun Tung, Tuck Cheong