Patents by Inventor Meng-Chiao Tsai

Meng-Chiao Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FORCE SENSING APPARATUS WITH BRIDGE PORTION
    Publication number: 20240183735
    Abstract: A force sensing apparatus with bridge portion comprises a first case, a second case, and a force sensing module. The first case comprises a first annular portion, a first bridge portion, and an inner wall portion. The first bridge portion is connected to an outer periphery of the first annular portion. The inner wall portion is connected to an inner periphery of the first annular portion. The second case comprises a second annular portion, a second bridge portion, and an outer wall portion. The second bridge portion is connected to an inner periphery of the second annular portion. The outer wall portion is connected to an outer periphery of the second annular portion. A stiffness of the second annular portion along an axial direction is greater than a stiffness of the second bridge portion along the axial direction. The second case is disposed on the first case along the axial direction to form a space. The force sensing module is disposed in the space.
    Type: Application
    Filed: April 27, 2023
    Publication date: June 6, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Nan YEH, Meng-Chiao TSAI, Shih-Ting LIN, Chao-Ta HUANG
  • Sensing module
    Patent number: 11148336
    Abstract: A sensing module includes a hollow body, a first photo sensor, and a second photo sensor. The hollow body includes a cavity portion and an insertion portion connected to each other. The insertion portion has a first channel and a second channel. The first photo sensor is disposed in the cavity portion of the hollow body and corresponds to the first channel to sense an ambient temperature and a test object temperature. The second photo sensor is disposed in the cavity portion of the hollow body and corresponds to the second channel to sense the ambient temperature.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: October 19, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Chiao Tsai, Feng-Chia Hsu, Chung-Yuan Su, Peng-Jen Chen
  • SENSING MODULE
    Publication number: 20200206999
    Abstract: A sensing module includes a hollow body, a first photo sensor, and a second photo sensor. The hollow body includes a cavity portion and an insertion portion connected to each other. The insertion portion has a first channel and a second channel. The first photo sensor is disposed in the cavity portion of the hollow body and corresponds to the first channel to sense an ambient temperature and a test object temperature. The second photo sensor is disposed in the cavity portion of the hollow body and corresponds to the second channel to sense the ambient temperature.
    Type: Application
    Filed: February 27, 2019
    Publication date: July 2, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Meng-Chiao Tsai, Feng-Chia Hsu, Chung-Yuan Su, Peng-Jen Chen