Patents by Inventor Meng-Chin Lin

Meng-Chin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147718
    Abstract: Some embodiments of the present application are directed towards an integrated circuit (IC). The integrated circuit includes a semiconductor substrate including a logic region and a memory cell region. A logic device is arranged on the logic region. A memory device is arranged on the memory cell region. An isolation structure extends into a top surface of the semiconductor substrate, and laterally separates the logic region from the memory cell region. The isolation structure includes dielectric material and has an uppermost surface and a slanted upper surface extending from the uppermost surface to an edge of the isolation structure proximate to memory cell region.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Meng-Han Lin, Chih-Ren Hsieh, Chen-Chin Liu, Chih-Pin Huang
  • Patent number: 6991497
    Abstract: An earphone jack includes a dielectric housing, a conductive first contact set, and a conductive second contact set. The housing has a first housing portion formed with a cylindrical first plug receiving hole, and a second housing portion connected to the first housing portion and formed with a rectangular second plug receiving hole. The first contact set includes first, second and third resilient contacts, each of which has a resilient plug contacting portion that extends into the first plug receiving hole. The second contact set includes a pair of first terminals and a pair of second terminals. The first terminals extend into the second plug receiving hole, and are disposed proximate to a lower side of the second housing portion. The second terminals extend into the second plug receiving hole, and are disposed proximate to an upper side of the second housing portion.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: January 31, 2006
    Assignee: Excel Cell Electronic Co., Ltd.
    Inventor: Meng-Chin Lin
  • Publication number: 20060009082
    Abstract: An earphone jack includes a dielectric housing, a conductive first contact set, and a conductive second contact set. The housing has a first housing portion formed with a cylindrical first plug receiving hole, and a second housing portion connected to the first housing portion and formed with a rectangular second plug receiving hole. The first contact set includes first, second and third resilient contacts, each of which has a resilient plug contacting portion that extends into the first plug receiving hole. The second contact set includes a pair of first terminals and a pair of second terminals. The first terminals extend into the second plug receiving hole, and are disposed proximate to a lower side of the second housing portion. The second terminals extend into the second plug receiving hole, and are disposed proximate to an upper side of the second housing portion.
    Type: Application
    Filed: September 3, 2004
    Publication date: January 12, 2006
    Applicant: EXCEL CELL ELECTRONIC CO., LTD
    Inventor: Meng-Chin Lin
  • Patent number: D534123
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: December 26, 2006
    Assignee: Excel Cell Electronic Co., Ltd.
    Inventor: Meng-Chin Lin
  • Patent number: D534493
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: January 2, 2007
    Assignee: Excel Cell Electronic Co., Ltd.
    Inventor: Meng-Chin Lin