Abstract: An abnormality monitoring method includes obtaining multiple target machine process parameters that affect a measurement value of a preset product at a first measurement point of the preset product, constructing a measurement value prediction model corresponding to the first measurement point, calculating a degree of fit of the measurement value prediction model, aggregating the degree of fit of the measurement value prediction model, the estimated value of the first measurement point, the target machine process parameters corresponding to the first measurement point, and the parameter coefficients of the target machine process parameters, repeating the above steps for each of multiple measurement points, calculating an influence degree index value of each machine, process parameter, and outputting warning information of machine process parameters that exceed a first preset influence degree index value.

Abstract: A method for testing mass-produced PCBs and other electronic components more efficiently, the method includes setting testing parameters based on historical test data and a target decision index, obtaining a first specified number of the target objects to have the full test, and calculating a first yield based on the current test result. The method determine whether the first yield is less than the first yield threshold yield, and obtaining a second specified number of the target objects from the remaining target objects to have the full test, and calculate a second yield when the first yield is larger than or equal to the first yield threshold value. The method further determine whether the second yield is less than the second yield threshold value according to a second comparing command and select some of the remaining target objects to have a sampling test.

Abstract: A method for testing mass-produced PCBs and other electronic components more efficiently, the method includes setting testing parameters based on historical test data and a target decision index, obtaining a first specified number of the target objects to have the full test, and calculating a first yield based on the current test result. The method determine whether the first yield is less than the first yield threshold yield, and obtaining a second specified number of the target objects from the remaining target objects to have the full test, and calculate a second yield when the first yield is larger than or equal to the first yield threshold value. The method further determine whether the second yield is less than the second yield threshold value according to a second comparing command and select some of the remaining target objects to have a sampling test.