Patents by Inventor Meng-Chun HSIEH

Meng-Chun HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for performing semiconductor processes with coated bell jar
    Patent number: 11939664
    Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Chun Hsieh, Tsung-Yu Tsai, Hsing-Yuan Huang, Chih-Chang Wu, Szu-Hua Wu, Chin-Szu Lee
  • SYSTEM AND METHOD FOR PERFORMING SEMICONDUCTOR PROCESSES WITH COATED BELL JAR
    Publication number: 20230062902
    Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Meng-Chun HSIEH, Tsung-Yu TSAI, Hsing-Yuan HUANG, Chih-Chang WU, Szu-Hua WU, Chin-Szu LEE