Patents by Inventor Meng-Da Chou

Meng-Da Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating conductive bump of circuit board
    Patent number: 7341934
    Abstract: A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first surface and the second surface, and conductive structures are formed in the circuit board for electrically connecting the circuit structures. Also, an insulating layer having a plurality of openings penetrating therethrough is formed on the circuit board for exposing the conductive pad. Then, a conductive layer is formed on a surface of the insulating layer having the opening formed on the first surface of the circuit board. An electroplating process is performed via the conductive layer and the conductive structure, such that a conductive bump is formed on the conductive pad located on the second surface of the circuit board.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: March 11, 2008
    Assignee: Phoenix Precision Technology Corporation
    Inventors: Shih-Ping Hsu, Sao-Hsia Tang, Ying-Tung Wang, Wen-Hung Hu, Chao-Wen Shih, Meng-Da Chou
  • Method for fabricating conductive bump of circuit board
    Publication number: 20060051952
    Abstract: A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first surface and the second surface, and conductive structures are formed in the circuit board for electrically connecting the circuit structures. Also, an insulating layer having a plurality of openings penetrating therethrough is formed on the circuit board for exposing the conductive pad. Then, a conductive layer is formed on a surface of the insulating layer having the opening formed on the first surface of the circuit board. An electroplating process is performed via the conductive layer and the conductive structure, such that a conductive bump is formed on the conductive pad located on the second surface of the circuit board.
    Type: Application
    Filed: March 15, 2005
    Publication date: March 9, 2006
    Inventors: Shih-Ping Hsu, Sao-Hsia Tang, Ying-Tung Wang, Wen-Hung Hu, Chao-Wen Shih, Meng-Da Chou
  • Method for releasing stress of embedded chip and chip embedded structure
    Publication number: 20050239269
    Abstract: A method for releasing stress of an embedded chip and a chip embedded structure are proposed. Cutting processes are performed to a semiconductor chip before it is embedded in a circuit board to form cut-way portions at edges of the chip so as to allow stress to be released when the chip is subsequently embedded in the circuit board and a filler material is filled between the chip and the circuit board.
    Type: Application
    Filed: September 23, 2004
    Publication date: October 27, 2005
    Inventors: Chu-Chin Hu, Chung-Cheng Lien, Chi-Ming Chen, Sheng-Hsiang Yang, Meng-Da Chou