Patents by Inventor Meng Da Liu

Meng Da Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: D787013
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: May 16, 2017
    Assignee: Rapala VMC Corp.
    Inventors: Stephen Gibson, Jeremy Grayson, Meng Da Liu
  • Patent number: D787014
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: May 16, 2017
    Assignee: Rapala VMC Corp.
    Inventors: Stephen Gibson, Jeremy Grayson, Meng Da Liu
  • Patent number: D787015
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: May 16, 2017
    Assignee: Rapala VMC Corporation
    Inventors: Stephen Gibson, Jeremy Grayson, Meng Da Liu
  • Patent number: D803977
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: November 28, 2017
    Assignee: Rapala VMC Corporation
    Inventors: Jeremy Grayson, Meng Da Liu
  • Patent number: D803978
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: November 28, 2017
    Assignee: Rapala VMC Corporation
    Inventors: Jeremy Grayson, Meng Da Liu
  • Patent number: D803979
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: November 28, 2017
    Assignee: Rapala VMC Corporation
    Inventors: Jeremy Grayson, Meng Da Liu
  • Patent number: D835484
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: December 11, 2018
    Assignee: Rapala VMC Corporation
    Inventor: Meng Da Liu
  • Patent number: D868559
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: December 3, 2019
    Assignee: Rapala VMC Corporation
    Inventor: Meng Da Liu
  • Patent number: D928910
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: August 24, 2021
    Assignee: Rapala VMC Oyj
    Inventors: Cyrille Mathieu, Meng Da Liu
  • Patent number: D936116
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 16, 2021
    Assignee: Rapala VMC Oyj
    Inventors: Meng Da Liu, Bart Rosen
  • Patent number: D946693
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: March 22, 2022
    Assignee: RAPALA VMC CORPORATION
    Inventors: Cyrille Mathieu, Meng Da Liu
  • Patent number: D947985
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: April 5, 2022
    Assignee: Rapala VMC Corporation
    Inventors: Cyrille Mathieu, Meng Da Liu
  • Patent number: D950004
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: April 26, 2022
    Assignee: Rapala VMC Oyj
    Inventor: Meng Da Liu
  • Patent number: D970994
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: November 29, 2022
    Assignee: Rapala VMC Oyj
    Inventor: Meng Da Liu
  • Patent number: D996952
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: August 29, 2023
    Assignee: Rapala VMC Oyj
    Inventor: Meng Da Liu
  • Patent number: D998021
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: September 5, 2023
    Assignee: Rapala VMC Oyj
    Inventors: Meng Da Liu, Benjamin John Miller
  • Patent number: D998447
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: September 12, 2023
    Assignee: Rapala VMC Oyj
    Inventor: Meng Da Liu