Abstract: A circuit includes local computing cells. Each of the local computing cells can provide, in response to identifying that the input data elements and weight data elements are in a first data type, a first sum including (i) a first product of a first input data element and a first weight data element; and (ii) a second product of a second input data element and a second weight data element. Each of the local computing cells can provide, in response to identifying that the input data elements and weight data elements are in a second data type, (i) a second sum of a first portion of a third input data element and a first portion of a third weight data element; and (ii) a third product of a second portion of the third input data element and a second portion of the third weight data element.

Abstract: A memory test circuit is provided. The memory test circuit is disposed in a memory array and including: a test array, including test cells out of memory cells of the memory array; a write multiplexer, configured to selectively output one of a test signal and a reference voltage based on a write measurement signal, wherein the test signal is output to write into at least one test cell and the reference voltage is output to a sense amplifier; and a read multiplexer, configured to selectively receive and output one of a readout signal corresponding to the test signal and an amplified signal based on a read measurement signal, wherein the readout signal is read from the at least one test cell and the amplified signal is obtained for a read margin evaluation from the sense amplifier by amplifying a voltage difference between the readout signal and the reference voltage.

Abstract: In some aspects of the present disclosure, a memory array structure is disclosed. In some embodiments, the memory array structure includes a word array. In some embodiments, the word array stores an N-bit word. In some embodiments, the word array includes a plurality of first memory structures and a plurality of second memory structures. In some embodiments, each first memory structure includes a first transistor and a first memory element. In some embodiments, each second memory structure includes a second transistor and a plurality of second memory elements, each second memory element includes a first end and a second end, the first end of each second memory element is coupled to a corresponding bit line, and the second end of each second memory element is coupled to a first end of the second transistor.

Abstract: A sense amplifier of a memory device that includes sense amplifier circuits and a reference sharing circuit is introduced. The sense amplifier circuits are configured to sense the plurality of bit lines according to an enable signal. The reference sharing circuit includes first switches and second switches that are coupled to the reference nodes and second reference nodes of the sense amplifier circuits, respectively. The first switches and second switches are controlled according to a control signal to control a first electrical connection among the first reference nodes, and to control a second electrical connection among the second reference nodes. An operation method of the sense amplifier and a memory device including the sense amplifier are also introduced.

Abstract: The sense amplifier circuit includes a differential amplifier, a first switch, and a second switch. The differential amplifier includes a first input node, a second input node, a first output node, and a second output node. The differential amplifier amplifies a voltage difference of the first output node and the second output node according to a first input voltage of the first input node and a second input voltage of the second input node. A control node of the first (second) switch is coupled to a control line, the first (second) switch is coupled to the first (second) input node, and the first (second) switch is coupled to the first (second) output node. The first (second) switch pre-charges the first (second) input node by a first (second) output voltage of the first (second) output node while the control line is received a select signal.

Abstract: Embodiment described herein provide systems, apparatuses and methods for convoluting a filter (“kernel”) to input data in the form of an input array by reusing computations of repeated data entries in the input array due to convolution movements from one convolution step to the next. In one embodiment, to compute a convolution of an input matrix and a filter matrix, instead of unrolling data entries from the input matrix of each convolution step into an input vector, only non-repeated new data entries at each convolution step may be added to the input vector. An input mapping circuit that implements an input parameter mapping matrix may then iteratively map data entries of the input vector to different weight registers that corresponds to weights in the filter matrix.

Abstract: A memory includes a memory device, a reading device and a feedback device. The memory device stores a plurality of bits. The reading device includes first and second reading circuits coupled to the memory device. The second reading circuit is coupled to the first reading circuit at a first node. The first and second reading circuits cooperates with each other to generate a first voltage signal at the first node based on at least one first bit of the plurality of bits. The feedback device adjusts at least one of the first reading circuit or the second reading circuit based on the first voltage signal. The first and second reading circuits generate a second voltage signal, different from the first voltage signal, corresponding to the bits, after the at least one of the first reading circuit or the second reading circuit is adjusted by the feedback device.

Abstract: A memory device including a plurality of memory cells, at least one of the plurality of memory cells includes a first transistor, a second transistor, and a third transistor. The first transistor includes a first drain/source path and a first gate structure electrically coupled to a write word line. The second transistor includes a second drain/source path and a second gate structure electrically coupled to the first drain/source path of the first transistor. The third transistor includes a third drain/source path electrically coupled to the second drain/source path of the second transistor and a third gate structure electrically coupled to a read word line. Where, the first transistor, and/or the second transistor, and/or the third transistor is a ferroelectric field effect transistor or a negative capacitance field effect transistor.

Abstract: Memory systems and operating method of a memory system are provided. The memory system utilized for performing a computing-in-memory (CiM) operation comprises a memory array and a processing circuit. The memory array comprises a plurality of memory cells. The processing circuit is coupled to the memory array and comprises a programming circuit and a control circuit. The programming circuit is coupled to the memory array and configured to perform a write operation for programming electrical characteristics of the memory cells. The control circuit is coupled to the programming circuit and configured to: receive a plurality of weight data corresponding to a plurality of weight values; and control the write operation performed by the programming circuit, so the electrical characteristics of the memory cells are programmed following a sequential order of the weight values.

Abstract: A memory test circuit is provided. The memory test circuit is disposed in a memory array and including: a test array, including test cells out of memory cells of the memory array; a write multiplexer, configured to selectively output one of a test signal and a reference voltage based on a write measurement signal, wherein the test signal is output to write into at least one test cell and the reference voltage is output to a sense amplifier; and a read multiplexer, configured to selectively receive and output one of a readout signal corresponding to the test signal and an amplified signal based on a read measurement signal, wherein the readout signal is read from the at least one test cell and the amplified signal is obtained for a read margin evaluation from the sense amplifier by amplifying a voltage difference between the readout signal and the reference voltage.

Abstract: A sense amplifier of a memory device that includes sense amplifier circuits and a reference sharing circuit is introduced. The sense amplifier circuits are configured to sense the plurality of bit lines according to an enable signal. The reference sharing circuit includes first switches and second switches that are coupled to the reference nodes and second reference nodes of the sense amplifier circuits, respectively. The first switches and second switches are controlled according to a control signal to control a first electrical connection among the first reference nodes, and to control a second electrical connection among the second reference nodes. An operation method of the sense amplifier and a memory device including the sense amplifier are also introduced.

Abstract: Memory systems and operating method of a memory system are provided. The memory system utilized for performing a computing-in-memory (CiM) operation comprises a memory array and a processing circuit. The memory array comprises a plurality of memory cells. The processing circuit is coupled to the memory array and comprises a programming circuit and a control circuit. The programming circuit is coupled to the memory array and configured to perform a write operation for programming electrical characteristics of the memory cells. The control circuit is coupled to the programming circuit and configured to: receive a plurality of weight data corresponding to a plurality of weight values; and control the write operation performed by the programming circuit, so the electrical characteristics of the memory cells are programmed following a sequential order of the weight values.

Abstract: A memory cell includes a write access transistor, a storage transistor, and a read access transistor. A gate of the write access transistor is connected to a write word line, a source of the write access transistor is connected to a write bit line, and a drain of the write access transistor is connected to a gate of the storage transistor. A source of the storage transistor is connected to a source line and a drain of the storage transistor is connected to a source of the read access transistor. A gate of the read access transistor is connected to a read bit line and a drain of the read access transistor is connected to read bit line. The memory cell further includes a capacitive element having a first connection to the gate of the storage transistor and a second connection to a reference voltage source.

Abstract: A resistive memory device includes a bottom electrode, a switching layer including a first horizontal portion, a second horizontal portion over an upper surface of the bottom electrode, and a first vertical portion over a side surface of the bottom electrode, a top electrode including a first horizontal portion over the first horizontal portion of the switching layer, a second horizontal portion over the second horizontal portion of the switching layer, and a first vertical portion over the first vertical portion of the switching layer, and a conductive via contacting the first horizontal portion, the second horizontal portion and the first vertical portion of the top electrode. By providing a switching layer and a top electrode which conform to a non-planar profile of the bottom electrode, charge crowding and a localized increase in electric field may facilitate resistance-state switching and provide a reduced operating voltage.

Abstract: A resistive random access memory (ReRAM) apparatus is provided. The ReRAM apparatus includes a plurality of memory cells, each of the memory cells comprises a transistor and a resistor; a bit line connected to a first terminal of the resistor of each of the memory cells; a local source line connected to a source electrode of the transistor of each of the memory cells; and a driving cell connected between the local source line and a global source line. A method for operating the ReRAM apparatus is also provided.

Abstract: An integrated circuit includes a memory storage having bit cells, a write path switch configured to have a connection state determined by a reliability indicator, and a write driver having an input configured to receive an input data from a write terminal through either a first write path or a second write path. The input data received through the first write path is configured to be equal to the data at the write terminal, and the input data received through the second write path is configured to be a bitwise complement of the data at the write terminal. The reliability indicator is configured to be set based on a majority bit value in the data or based on a minority bit value in the data.

Abstract: A system includes a memory cell array including multi-level cells, an input data scramble circuit configured to receive input data and match lower error tolerant bits with higher error tolerant bits to provide matched bit sets, wherein each of the matched bit sets includes at least one lower error tolerant bit and at least one higher error tolerant bit, and a write driver configured to receive the matched bit sets and store each of the matched bit sets into one memory cell of the multi-level cells.

Abstract: A memory device includes a set of word lines, first and second sets of bit lines, a first source line having first and second source line contacts, first and second strings of transistors electrically coupled in parallel between the first and second source line contacts of the source line, and first and second sets of data storage elements. Each word line in the set of word lines is electrically coupled to gates of a transistor in the first string and a corresponding transistor in the second string. The first set of data storage elements is electrically coupled between the first string of transistors and the first set of bit lines. The second set of data storage elements is electrically coupled between the second string of transistors and the second set of bit lines.

Abstract: The disclosure provides a memory device, a memory array, and an N-bit memory unit. The memory device includes a memory array including an N-bit memory unit, wherein N is a positive integer. The N-bit memory unit includes a first memory cell, used to characterize at least two first bits of a plurality of least significant bits of the N-bit memory unit.

Abstract: A device includes a write bit line and a read bit line extending in a first direction, and a write word line and a read word line extending in a second direction perpendicular to the first direction. The device further includes a memory cell including a write transistor and a read transistor. The write transistor includes a first gate connected to the write word line, a first source/drain connected to the write bit line, and a second source/drain connected to a data storage node. The read transistor includes a second gate connected to the data storage node, a third source/drain connected to the read bit line, and a fourth source/drain connected to the read word line.