Patents by Inventor Meng Fu

Meng Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260156029
    Abstract: A method includes: A cloud platform provides a network configuration interface for a user, where the network configuration interface prompts the user to enter network feature information, and the network feature information indicates a cloud service network needed for implementing a target cloud service. The cloud platform provides a network association interface for the user, where the network association interface prompts the user to enter association information, the association information indicates a plurality of service nodes associated with the cloud service network, the service node is used to deploy an application of the user, the application is used to implement the target cloud service, and the plurality of service nodes are deployed based on a resource in one or more resource deployment regions. The cloud platform establishes an association relationship between the plurality of service nodes based on the network feature information and the association information.
    Type: Application
    Filed: January 23, 2026
    Publication date: June 4, 2026
    Applicant: Huawei Cloud Computing Technologies Co., Ltd.
    Inventors: Meng Fu, Xuwei Yang, Zhonghua Gao, Haifei Zhao, Yongqiang Yang, Xiaoping Zhu, Chen Pan
  • Publication number: 20260150234
    Abstract: A radiator includes a first heat dissipating assembly, a second heat dissipating assembly, an inlet connector, and an outlet connector. The first heat dissipating assembly includes a first channel, a first inlet hole, and a first outlet hole. The first channel is connected to the first inlet hole and the first outlet hole. The second heat dissipating assembly is detachably connected to the first heat dissipating assembly. The second heat dissipating assembly includes a second channel, a second inlet hole, and a second outlet hole. The second channel communicates with the second inlet hole and the second outlet hole. The second inlet hole communicates with the first inlet hole. The second outlet hole communicates with the first outlet hole. The inlet connector communicates with the first inlet hole. The outlet connector communicates with the first outlet hole. The present disclosure further provides a terminal device.
    Type: Application
    Filed: February 28, 2025
    Publication date: May 28, 2026
    Inventors: Meng Fu, Jin-Rong Xie, Fu-Sheng Luo
  • Patent number: 12628315
    Abstract: An elastic member can connect a first component to a second component. The elastic member includes at least one curved portion, at least one inserting portion, at least one connecting portion, and at least one abutting portion. The curved portion can be clamped in a first slot of the first component. The inserting portion can be clamped in a second slot of the second component. The connecting portion connects the curved portion to the inserting portion. The abutting portion connects the inserting portion and can abut against a surface of the second component. The abutting portion can deform toward the connecting portion. The present disclosure further provides a heat dissipating structure and a terminal device.
    Type: Grant
    Filed: January 31, 2024
    Date of Patent: May 12, 2026
    Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.
    Inventors: Meng Fu, Sheng-Hua Qin
  • Publication number: 20250347543
    Abstract: The present disclosure provides a mixed-phase fluid mass flow measurement method and a throttling-type photon quantum mixed-phase flowmeter, after real-time acquisition of the actual pressure value, actual temperature value, and the actual photon quantum transmission quantity under the influence of the to-be-measured mixed-phase fluid for at least three photon quantum energy levels at the inlet pipe section of the throttling-type photon quantum mixed-phase flowmeter, and after the acquisition of the actual pressure difference between the inlet pipe section and the throat pipe section, the present disclosure will directly calculate the actual mass flow rate of the fluid media of each phase in the to-be-measured mixed-phase fluid based on the actual photon quantum transmission quantities for the at least three photon quantum energy levels, the photon quantum transmission quantity without medium, and the obtained actual pressure value, actual temperature value, and actual pressure difference.
    Type: Application
    Filed: May 8, 2025
    Publication date: November 13, 2025
    Inventors: Jige Chen, Bin Xu, Meng Fu, Chao Luo, Shan Sun, Haibo Liang
  • Publication number: 20250338389
    Abstract: A heating dissipation device comprising a cooling board and two confluence connectors, wherein the cooling board is configured to attach with a thermal element, and the cooling board absorbs heat from the thermal element, and the cooling board and the thermal element are spaced apart in a first direction; the two confluence connectors are respectively connected to two opposite ends of the cooling board along a second direction, the second direction is perpendicular to the first direction; the cooling board defines a first runner, and the first runner is passed through the cooling board in the second direction; each of the two confluence connectors defines a second runner, two opposite ends of the first runner are respectively connected to two second runners of the two confluence connectors to form a cooling runner.
    Type: Application
    Filed: March 28, 2025
    Publication date: October 30, 2025
    Inventors: MENG FU, JIN-RONG XIE
  • Publication number: 20250207960
    Abstract: A waist-shaped throttling photon quantum miscible phase flowmeter includes a photon quantum phase fraction device, a photon quantum source, and a photon quantum detector distributed opposite to the photon quantum source, for detecting an energy signal of a single photon quantum emitted by the photon quantum source. A flow channel inside the photon quantum phase fraction device includes a first variable-diameter section, a waist-shaped throat section having a waist-shaped-hole shaped cross section in a direction perpendicular to an axial direction of the flow channel, and a second variable-diameter section that are connected in sequence. Inner diameters of the first and second variable-diameter sections gradually decrease from an end away from the throat section to an end close to the throat section. The photon quantum source and the photon quantum detector are both provided on the photon quantum phase fraction device and located at the throat section.
    Type: Application
    Filed: July 23, 2024
    Publication date: June 26, 2025
    Inventors: Haibo LIANG, Meng FU, Chao LUO, Jige CHEN, Xianyi LI, Kaifu MI, Shengjie LU, Yu LEI, Juncheng WANG, Shan SUN
  • Publication number: 20250133702
    Abstract: An elastic member can connect a first component to a second component. The elastic member includes at least one curved portion, at least one inserting portion, at least one connecting portion, and at least one abutting portion. The curved portion can be clamped in a first slot of the first component. The inserting portion can be clamped in a second slot of the second component. The connecting portion connects the curved portion to the inserting portion. The abutting portion connects the inserting portion and can abut against a surface of the second component. The abutting portion can deform toward the connecting portion. The present disclosure further provides a heat dissipating structure and a terminal device.
    Type: Application
    Filed: January 31, 2024
    Publication date: April 24, 2025
    Inventors: MENG FU, SHENG-HUA QIN
  • Publication number: 20250126756
    Abstract: A heat dissipation mechanism comprises a carrier assembly, a heat dissipation assembly, and a buckle assembly, the carrier assembly comprises a base configured for assembling an electronic component with a heat-conductive adhesive sheet attached; the heat dissipation assembly comprises a top plate and a crimping unit, the top plate defines a penetration hole, the crimping unit comprises an extruded sheet, the extruded sheet is located on the side of the heat-conductive adhesive sheet away from the electronic component, the side of the extruded sheet away from the heat-conductive adhesive sheet has a protrusion provided thereon; the buckle assembly comprises a cover plate and a cladding unit, the cladding unit comprises a resist member, the side of the resist member which facing the extruded sheet has a stop portion provided thereon. An electronic device is also provided, which comprising the provided heat dissipation mechanism, an electronic component, and a case.
    Type: Application
    Filed: May 22, 2024
    Publication date: April 17, 2025
    Inventors: MENG FU, JIN-RONG XIE
  • Publication number: 20240334652
    Abstract: A heat dissipation device, comprising a heat-conducting component and a plurality of heat fins, wherein the heat-conducting component comprises a heat pipe, each heat fins comprises a heat dissipation plate and a folding edge, the heat dissipation plate defines on a through-hole, the folding edge is arranged around an edge of the through-hole, the folding edge protrudes from one side of the heat dissipation plate, an extension wall is provided at the folding edge far away from an end of the heat dissipation plate, the extension wall extends from the folding edge to a side away from the heat pipe, the folding edge is spaced from the heat pipe, a gap is defined between the heat pipe and a circumference of the heat pipe, the extension wall is spaced from the circumference of the heat pipe to form a first containment chamber.
    Type: Application
    Filed: November 20, 2023
    Publication date: October 3, 2024
    Inventors: MENG FU, WAN-HUA LEI, RUI-ZE WU
  • Patent number: 11893831
    Abstract: The present disclosure provides a method and device to process identity information based on a fundus image. An identity information comparison method includes: recognizing a fundus image by using a neural network to obtain a multi-dimensional feature vector representing the identity of a user; comparing the obtained multi-dimensional feature vector with each multi-dimensional feature vector stored in a database; and determining, according to a comparison result, whether there is a matching between the currently obtained multi-dimensional feature vector and a multi-dimensional feature vector pre-stored in the database.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: February 6, 2024
    Inventors: Andre Wang He, Jianhao Xiong, Meng Fu, Xiaopei Zhu, Xin Zhao, Chao He, Dalei Zhang
  • Publication number: 20230232576
    Abstract: A radiator with high-temperature performance includes a radiating pipe, a heat conducting pipe, an aluminum radiating plate, a main radiating part, and an auxiliary radiating part. The radiating pipe comprises a first end in contact with a heat-generating chip, and a second end. The heat conducting pipe is arranged on both sides of the first end of the heat radiating pipe. The first end and the heat conducting pipe are nested in the aluminum radiating plate. The first heat sink is arranged on the side of the heat dissipation pipe away from the chip. The auxiliary heat dissipation part is connected with the second end. The radiator disclosed improves all-round heat dissipation efficiency and meets the heat dissipation requirements of higher chip power through the heat conduction pipe arranged on the side of the heat dissipation pipe.
    Type: Application
    Filed: May 30, 2022
    Publication date: July 20, 2023
    Inventors: MENG FU, JIN-RONG XIE, WEI-DONG CHEN
  • Publication number: 20230209776
    Abstract: A compact heat dissipation device with an improved means of heat dissipation includes a heat conducting plate, a heat dissipating fin, and a plurality of U-shaped heat transferring tubes. The heat conducting plate defines a first through hole. The heat dissipating fin is fixed on the heat conducting plate. A first end of each of the plurality of heat transferring tubes is connected to the heat dissipating fin, a second end of each of the plurality of heat transferring tubes is arranged in the first through hole so as to be side by side with each other, and side surfaces of the second ends are in surface contact. The present disclosure also provides a heat dissipation device assembling method.
    Type: Application
    Filed: February 10, 2022
    Publication date: June 29, 2023
    Inventors: MENG FU, JIN-RONG XIE, WEI-DONG CHEN
  • Publication number: 20220358791
    Abstract: The present disclosure provides a method and device to process identity information based on a fundus image. An identity information comparison method includes: recognizing a fundus image by using a neural network to obtain a multi-dimensional feature vector representing the identity of a user; comparing the obtained multi-dimensional feature vector with each multi-dimensional feature vector stored in a database; and determining, according to a comparison result, whether there is a matching between the currently obtained multi-dimensional feature vector and a multi-dimensional feature vector pre-stored in the database.
    Type: Application
    Filed: April 8, 2020
    Publication date: November 10, 2022
    Applicant: SHANGHAI EAGLEVISION MEDICAL TECHNOLOGY CO., LTD.
    Inventors: Andre Wang HE, Jianhao XIONG, Meng FU, Xiaopei ZHU, Xin ZHAO, Chao HE, Dalei ZHANG
  • Patent number: 11094611
    Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: August 17, 2021
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Zhen-Quan Zhong, Qiao-Long Chen, Meng Fu
  • Publication number: 20210104450
    Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.
    Type: Application
    Filed: November 7, 2019
    Publication date: April 8, 2021
    Inventors: ZHEN-QUAN ZHONG, QIAO-LONG CHEN, MENG FU
  • Patent number: 10943757
    Abstract: Provided is a gas discharge tube, including at least two electrodes and an insulating tube body, which is connected in a sealing manner with the electrodes to form a discharge inner cavity. A low-temperature sealing adhesive for sealing the discharge inner cavity is arranged in the gas discharge tube. The low-temperature sealing adhesive is melted at a specific low temperature to cause gas leakage in the discharge inner cavity.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: March 9, 2021
    Assignee: SHENZHEN BENCENT TELECTRONICS CO., LTD.
    Inventors: Ji He, Meng Fu, Feilong Wang
  • Patent number: 10477731
    Abstract: A liquid-cooled radiator includes liquid-cooled boards, a condenser, a driver, a coolant conduit assembly, and a mounting bracket. The liquid-cooled boards and the condenser are mounted on the mounting bracket. The driver is coupled to the liquid-cooled boards and the condenser through the coolant conduit assembly. The coolant conduit assembly includes a main conduit, a diverting block, and a sub-conduit. The diverting block is mounted to the mounting bracket. The liquid-cooled boards are coupled to the diverting block in parallel through the sub-conduit. The condenser, the driver, and the diverting block are coupled together through the main conduit. The driver drives coolant from the condenser to flow through the diverting block and the sub-conduit to the liquid-cooled boards, flow through the sub-conduit and the diverting block to the main conduit, and then flow from the main conduit to the condenser to be condensed.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 12, 2019
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Meng Fu, Qiao-Long Chen, Lin-Wei Liu
  • Patent number: 10228194
    Abstract: An airtight structure includes a first plate, a second plate, a wick structure mounted between the first plate and the second plate. A middle portion of the second plate forms a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity. A portion of the first plate extends upwardly to form a first extending portion. The first extending portion is a hollow cylinder. A portion adjacent to an end of the second plate forms a through hole corresponding to the first extending portion. The first extending portion extends through the through hole, an inner surface of the through hole contacts the first extending portion.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: March 12, 2019
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Xiao-Yu Zhao, Chi-Yuan Lai, Meng Fu
  • Patent number: 10182492
    Abstract: An airtight structure includes a first plate having a first surface and a second surface opposite to the first surface, a second plate mounted on the second surface of the first plate, a wick structure mounted between the first plate and the second plate, a first fixed pin welded with the first plate and the second plate, and a second fixed pin welded with the first plate and the second plate. The second plate bonds to form a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity, a bottom surface of the cup portion forms a first through hole for receiving the first fixed pin therein. An outer periphery of the cup portion forms a second through hole. The second through hole is spaced apart from the first through hole.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: January 15, 2019
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Xiao-Yu Zhao, Chi-Yuan Lai, Meng Fu
  • Patent number: 10108237
    Abstract: A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: October 23, 2018
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Meng Fu, Qiao-Long Chen, Wu-Fei Xu