Patents by Inventor Meng Fu

Meng Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250133702
    Abstract: An elastic member can connect a first component to a second component. The elastic member includes at least one curved portion, at least one inserting portion, at least one connecting portion, and at least one abutting portion. The curved portion can be clamped in a first slot of the first component. The inserting portion can be clamped in a second slot of the second component. The connecting portion connects the curved portion to the inserting portion. The abutting portion connects the inserting portion and can abut against a surface of the second component. The abutting portion can deform toward the connecting portion. The present disclosure further provides a heat dissipating structure and a terminal device.
    Type: Application
    Filed: January 31, 2024
    Publication date: April 24, 2025
    Inventors: MENG FU, SHENG-HUA QIN
  • Publication number: 20250126756
    Abstract: A heat dissipation mechanism comprises a carrier assembly, a heat dissipation assembly, and a buckle assembly, the carrier assembly comprises a base configured for assembling an electronic component with a heat-conductive adhesive sheet attached; the heat dissipation assembly comprises a top plate and a crimping unit, the top plate defines a penetration hole, the crimping unit comprises an extruded sheet, the extruded sheet is located on the side of the heat-conductive adhesive sheet away from the electronic component, the side of the extruded sheet away from the heat-conductive adhesive sheet has a protrusion provided thereon; the buckle assembly comprises a cover plate and a cladding unit, the cladding unit comprises a resist member, the side of the resist member which facing the extruded sheet has a stop portion provided thereon. An electronic device is also provided, which comprising the provided heat dissipation mechanism, an electronic component, and a case.
    Type: Application
    Filed: May 22, 2024
    Publication date: April 17, 2025
    Inventors: MENG FU, JIN-RONG XIE
  • Publication number: 20240395571
    Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Ying-Hao Wang, Chien-Lung Chen, Chien-Chi Tzeng, Meng-Fu Shih, Hu-Wei Lin
  • Publication number: 20240334652
    Abstract: A heat dissipation device, comprising a heat-conducting component and a plurality of heat fins, wherein the heat-conducting component comprises a heat pipe, each heat fins comprises a heat dissipation plate and a folding edge, the heat dissipation plate defines on a through-hole, the folding edge is arranged around an edge of the through-hole, the folding edge protrudes from one side of the heat dissipation plate, an extension wall is provided at the folding edge far away from an end of the heat dissipation plate, the extension wall extends from the folding edge to a side away from the heat pipe, the folding edge is spaced from the heat pipe, a gap is defined between the heat pipe and a circumference of the heat pipe, the extension wall is spaced from the circumference of the heat pipe to form a first containment chamber.
    Type: Application
    Filed: November 20, 2023
    Publication date: October 3, 2024
    Inventors: MENG FU, WAN-HUA LEI, RUI-ZE WU
  • Patent number: 11893831
    Abstract: The present disclosure provides a method and device to process identity information based on a fundus image. An identity information comparison method includes: recognizing a fundus image by using a neural network to obtain a multi-dimensional feature vector representing the identity of a user; comparing the obtained multi-dimensional feature vector with each multi-dimensional feature vector stored in a database; and determining, according to a comparison result, whether there is a matching between the currently obtained multi-dimensional feature vector and a multi-dimensional feature vector pre-stored in the database.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: February 6, 2024
    Inventors: Andre Wang He, Jianhao Xiong, Meng Fu, Xiaopei Zhu, Xin Zhao, Chao He, Dalei Zhang
  • Publication number: 20230377910
    Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Inventors: Ying-Hao Wang, Chien-Lung Chen, Chien-Chi Tzeng, Meng-Fu Shih, Hu-Wei Lin
  • Publication number: 20230232576
    Abstract: A radiator with high-temperature performance includes a radiating pipe, a heat conducting pipe, an aluminum radiating plate, a main radiating part, and an auxiliary radiating part. The radiating pipe comprises a first end in contact with a heat-generating chip, and a second end. The heat conducting pipe is arranged on both sides of the first end of the heat radiating pipe. The first end and the heat conducting pipe are nested in the aluminum radiating plate. The first heat sink is arranged on the side of the heat dissipation pipe away from the chip. The auxiliary heat dissipation part is connected with the second end. The radiator disclosed improves all-round heat dissipation efficiency and meets the heat dissipation requirements of higher chip power through the heat conduction pipe arranged on the side of the heat dissipation pipe.
    Type: Application
    Filed: May 30, 2022
    Publication date: July 20, 2023
    Inventors: MENG FU, JIN-RONG XIE, WEI-DONG CHEN
  • Publication number: 20230209776
    Abstract: A compact heat dissipation device with an improved means of heat dissipation includes a heat conducting plate, a heat dissipating fin, and a plurality of U-shaped heat transferring tubes. The heat conducting plate defines a first through hole. The heat dissipating fin is fixed on the heat conducting plate. A first end of each of the plurality of heat transferring tubes is connected to the heat dissipating fin, a second end of each of the plurality of heat transferring tubes is arranged in the first through hole so as to be side by side with each other, and side surfaces of the second ends are in surface contact. The present disclosure also provides a heat dissipation device assembling method.
    Type: Application
    Filed: February 10, 2022
    Publication date: June 29, 2023
    Inventors: MENG FU, JIN-RONG XIE, WEI-DONG CHEN
  • Patent number: 11527504
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: December 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Publication number: 20220358791
    Abstract: The present disclosure provides a method and device to process identity information based on a fundus image. An identity information comparison method includes: recognizing a fundus image by using a neural network to obtain a multi-dimensional feature vector representing the identity of a user; comparing the obtained multi-dimensional feature vector with each multi-dimensional feature vector stored in a database; and determining, according to a comparison result, whether there is a matching between the currently obtained multi-dimensional feature vector and a multi-dimensional feature vector pre-stored in the database.
    Type: Application
    Filed: April 8, 2020
    Publication date: November 10, 2022
    Applicant: SHANGHAI EAGLEVISION MEDICAL TECHNOLOGY CO., LTD.
    Inventors: Andre Wang HE, Jianhao XIONG, Meng FU, Xiaopei ZHU, Xin ZHAO, Chao HE, Dalei ZHANG
  • Patent number: 11318844
    Abstract: An on-board charging device includes an AC connector, an AC to DC converter and a detection circuit. The AC connector is configured to be connected to an electric vehicle supply equipment (EVSE), so that a protective earth terminal of EVSE is electrically connected to a protective earth terminal of the on-board charging device. The AC to DC converter is electrically connected to the AC connector, and the AC to DC converter is configured to convert an AC voltage provided by the EVSE into a DC voltage. The AC to DC converter has a reference ground terminal. The detection circuit outputs a detection voltage based on the voltage difference between the protective earth terminal of the on-board charging device and the reference ground terminal of the AC to DC converter. The detection voltage reflects whether the protective earth terminal of the EVSE is abnormal or not.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: May 3, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Sheng-Nan Tsai, Chia-Cheng Yang, Meng-Fu Cho
  • Patent number: 11200258
    Abstract: A new approach is proposed to support grouping and storing a data stream based on the types of data items in the stream for efficient data batch processing and analysis. First, the data stream is uploaded to a cloud storage, wherein the stream of data includes a plurality of data items of different types generated by and collected from different users and/or devices. The data items are then retrieved, grouped and saved by a preprocessing unit into a plurality of batch data queues, wherein data items in each batch data queue are of the same type. One or more batch processing units are then configured to fetch and batch process data items from the batch data queues and store these data items of the same data type to one or more cloud storage files for further processing and analysis on the cloud storage one batch data queue at a time.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: December 14, 2021
    Assignee: Acer Cloud Technology (US), Inc.
    Inventors: Meng-Fu Hsieh, Jung-Hsuan Fan, Jim Chang
  • Patent number: 11094611
    Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: August 17, 2021
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Zhen-Quan Zhong, Qiao-Long Chen, Meng Fu
  • Publication number: 20210120834
    Abstract: This specification discloses a composition of vegan cheese and method of preparing the same. The mentioned composition of vegan cheese and method of preparing the same can provide vegan cheese having the characteristics of real cheese by the design of the food structure and the condition control in the preparation process of the vegan cheese. Moreover, according to this specification, the mentioned composition of vegan cheese and method of preparing the same can provide vegan cheese product more in line with health requirements by not adding any emulsifier.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 29, 2021
    Inventor: Meng Fu Hsieh
  • Publication number: 20210104450
    Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.
    Type: Application
    Filed: November 7, 2019
    Publication date: April 8, 2021
    Inventors: ZHEN-QUAN ZHONG, QIAO-LONG CHEN, MENG FU
  • Patent number: 10943757
    Abstract: Provided is a gas discharge tube, including at least two electrodes and an insulating tube body, which is connected in a sealing manner with the electrodes to form a discharge inner cavity. A low-temperature sealing adhesive for sealing the discharge inner cavity is arranged in the gas discharge tube. The low-temperature sealing adhesive is melted at a specific low temperature to cause gas leakage in the discharge inner cavity.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: March 9, 2021
    Assignee: SHENZHEN BENCENT TELECTRONICS CO., LTD.
    Inventors: Ji He, Meng Fu, Feilong Wang
  • Publication number: 20200373267
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 26, 2020
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Patent number: 10741513
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: August 11, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Patent number: 10477731
    Abstract: A liquid-cooled radiator includes liquid-cooled boards, a condenser, a driver, a coolant conduit assembly, and a mounting bracket. The liquid-cooled boards and the condenser are mounted on the mounting bracket. The driver is coupled to the liquid-cooled boards and the condenser through the coolant conduit assembly. The coolant conduit assembly includes a main conduit, a diverting block, and a sub-conduit. The diverting block is mounted to the mounting bracket. The liquid-cooled boards are coupled to the diverting block in parallel through the sub-conduit. The condenser, the driver, and the diverting block are coupled together through the main conduit. The driver drives coolant from the condenser to flow through the diverting block and the sub-conduit to the liquid-cooled boards, flow through the sub-conduit and the diverting block to the main conduit, and then flow from the main conduit to the condenser to be condensed.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 12, 2019
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Meng Fu, Qiao-Long Chen, Lin-Wei Liu
  • Publication number: 20190188315
    Abstract: A new approach is proposed to support grouping and storing a data stream based on the types of data items in the stream for efficient data batch processing and analysis. First, the data stream is uploaded to a cloud storage, wherein the stream of data includes a plurality of data items of different types generated by and collected from different users and/or devices. The data items are then retrieved, grouped and saved by a preprocessing unit into a plurality of batch data queues, wherein data items in each batch data queue are of the same type. One or more batch processing units are then configured to fetch and batch process data items from the batch data queues and store these data items of the same data type to one or more cloud storage files for further processing and analysis on the cloud storage one batch data queue at a time.
    Type: Application
    Filed: June 12, 2018
    Publication date: June 20, 2019
    Applicant: ACER CLOUD TECHNOLOGY (US), INC.
    Inventors: Meng-Fu HSIEH, Jung-Hsuan FAN, Jim CHANG