Abstract: A germ-repellent plastic for use in a gas pathway of a respiratory device contains an anti-biofouling compound, and a basic plastic. The anti-biofouling compound is optionally selected from the group of a polyol, a polyether polyol, a polyol derivative, and a combination thereof; or the anti-biofouling compound is selected from the group consisting of a polyether, a poly(ethylene glycol) ether, a polysorbate, and a combination thereof; or the anti-biofouling compound is selected from the group consisting of poly(ethylene glycol) sorbitan monolaurate, poly(ethylene glycol) sorbitan monooleate, poly(ethylene glycol) sorbitol hexaoleate, ceteareth, and a combination thereof. The basic plastic is selected from the group of a blend of a low-density polyethylene polymer and an ethyl vinyl acetate copolymer, a blend of a polypropylene polymer and an ethyl vinyl acetate copolymer, a blend of polyolefin elastomer polymers and a polyvinyl chloride polymer.

Abstract: An intelligent smog-penetrating optical imaging detection device and a method of thereof, and belongs to the technical field of photoelectric imaging. The intensity information, the spectrum information, and the polarization information of light are organically combined, the three functions of intensity imaging, spectrum imaging and polarization imaging can be achieved, traditional imaging detection is beneficially supplemented, smog can be penetrated, the image contrast of imaging is improved, and therefore the working distance is increased. The intensity information reflects the detection distance, the target shape, the target size and the like; the spectrum information reflects material components, surface morphology and the like of a space target; the polarization information reflects the material and roughness of the target and the contrast with the background; and the intensity, spectrum and polarization three-dimensional information is jointly applied, the image contrast can be increased by 2-3 times.

Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.

Abstract: A relay includes a contact container having a contact chamber, a pair of first through holes and a second through hole communicated with the contact chamber; a pair of static contact leading-out terminals passed through the first through holes and connected to the contact container; a connector passing through the second through hole and connected to the contact container; a first magnetizer provided in the contact chamber and connected to the connector; and a pushing rod assembly including a movable component with a movable contact piece. The movable component is movably provided in the contact chamber to make the movable contact piece come into contact with or separate from the pair of static contact leading-out terminals. The first magnetizer is arranged at a side of the movable contact piece facing the static contact leading-out terminals.

Abstract: A memory device and an operation method thereof are provided. The memory device includes memory cells, each having a static random access memory (SRAM) cell and a non-volatile memory cell. The SRAM cell is configured to store complementary data at first and second storage nodes. The non-volatile memory cell is configured to replicate and retain the complementary data before the SRAM cell loses power supply, and to rewrite the replicated data to the first and second storage nodes of the SRAM cell after the power supply of the SRAM cell is restored.

Abstract: A semiconductor structure includes a first transistor, a second transistor, a metal rail, and a first source/drain contact and a second source/drain contact. The first transistor has a gate structure, a first source/drain feature, and a second source/drain feature. The first source/drain feature and the second source/drain feature are on opposite sides of the gate structure. The second transistor has the gate structure, a third source/drain feature directly over the first source/drain feature, and a fourth source/drain feature directly over the second source/drain feature. The metal rail extends in an X-direction and adjacent to the gate structure in a Y-direction. The first source/drain contact and the second source/drain contact each has an L-shape in a Y-Z cross-sectional view. The first source/drain contact electrically connects the first source/drain feature to the metal rail. The second source/drain contact electrically connects the fourth source/drain feature to the metal rail.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: The present disclosure provides a method and device to process identity information based on a fundus image. An identity information comparison method includes: recognizing a fundus image by using a neural network to obtain a multi-dimensional feature vector representing the identity of a user; comparing the obtained multi-dimensional feature vector with each multi-dimensional feature vector stored in a database; and determining, according to a comparison result, whether there is a matching between the currently obtained multi-dimensional feature vector and a multi-dimensional feature vector pre-stored in the database.

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

Abstract: A radiator with high-temperature performance includes a radiating pipe, a heat conducting pipe, an aluminum radiating plate, a main radiating part, and an auxiliary radiating part. The radiating pipe comprises a first end in contact with a heat-generating chip, and a second end. The heat conducting pipe is arranged on both sides of the first end of the heat radiating pipe. The first end and the heat conducting pipe are nested in the aluminum radiating plate. The first heat sink is arranged on the side of the heat dissipation pipe away from the chip. The auxiliary heat dissipation part is connected with the second end. The radiator disclosed improves all-round heat dissipation efficiency and meets the heat dissipation requirements of higher chip power through the heat conduction pipe arranged on the side of the heat dissipation pipe.

Abstract: A compact heat dissipation device with an improved means of heat dissipation includes a heat conducting plate, a heat dissipating fin, and a plurality of U-shaped heat transferring tubes. The heat conducting plate defines a first through hole. The heat dissipating fin is fixed on the heat conducting plate. A first end of each of the plurality of heat transferring tubes is connected to the heat dissipating fin, a second end of each of the plurality of heat transferring tubes is arranged in the first through hole so as to be side by side with each other, and side surfaces of the second ends are in surface contact. The present disclosure also provides a heat dissipation device assembling method.

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

Abstract: The present disclosure provides a method and device to process identity information based on a fundus image. An identity information comparison method includes: recognizing a fundus image by using a neural network to obtain a multi-dimensional feature vector representing the identity of a user; comparing the obtained multi-dimensional feature vector with each multi-dimensional feature vector stored in a database; and determining, according to a comparison result, whether there is a matching between the currently obtained multi-dimensional feature vector and a multi-dimensional feature vector pre-stored in the database.

Abstract: An on-board charging device includes an AC connector, an AC to DC converter and a detection circuit. The AC connector is configured to be connected to an electric vehicle supply equipment (EVSE), so that a protective earth terminal of EVSE is electrically connected to a protective earth terminal of the on-board charging device. The AC to DC converter is electrically connected to the AC connector, and the AC to DC converter is configured to convert an AC voltage provided by the EVSE into a DC voltage. The AC to DC converter has a reference ground terminal. The detection circuit outputs a detection voltage based on the voltage difference between the protective earth terminal of the on-board charging device and the reference ground terminal of the AC to DC converter. The detection voltage reflects whether the protective earth terminal of the EVSE is abnormal or not.

Abstract: A new approach is proposed to support grouping and storing a data stream based on the types of data items in the stream for efficient data batch processing and analysis. First, the data stream is uploaded to a cloud storage, wherein the stream of data includes a plurality of data items of different types generated by and collected from different users and/or devices. The data items are then retrieved, grouped and saved by a preprocessing unit into a plurality of batch data queues, wherein data items in each batch data queue are of the same type. One or more batch processing units are then configured to fetch and batch process data items from the batch data queues and store these data items of the same data type to one or more cloud storage files for further processing and analysis on the cloud storage one batch data queue at a time.

Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.

Abstract: This specification discloses a composition of vegan cheese and method of preparing the same. The mentioned composition of vegan cheese and method of preparing the same can provide vegan cheese having the characteristics of real cheese by the design of the food structure and the condition control in the preparation process of the vegan cheese. Moreover, according to this specification, the mentioned composition of vegan cheese and method of preparing the same can provide vegan cheese product more in line with health requirements by not adding any emulsifier.

Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.

Abstract: Provided is a gas discharge tube, including at least two electrodes and an insulating tube body, which is connected in a sealing manner with the electrodes to form a discharge inner cavity. A low-temperature sealing adhesive for sealing the discharge inner cavity is arranged in the gas discharge tube. The low-temperature sealing adhesive is melted at a specific low temperature to cause gas leakage in the discharge inner cavity.

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.