Patents by Inventor MENG-HAN YEH

MENG-HAN YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION AND METAL CLAD SUBSTRATE
    Publication number: 20240017525
    Abstract: A resin composition and a metal clad substrate are provided. The resin composition includes: 20 phr to 40 phr of an epoxy resin, 40 phr to 60 phr of a modified benzoxazine resin, 2 phr to 10 phr of a maleimide resin, and 25 phr to 50 phr of fillers. The modified benzoxazine resin contains a DOPO group. Based on a total weight of the modified benzoxazine resin being 100 wt %, an amount of the DOPO group ranges from 10 wt % to 20 wt %.
    Type: Application
    Filed: December 25, 2022
    Publication date: January 18, 2024
    Inventors: SHENG-YEN WU, KAI-YANG CHEN, MENG-HAN YEH, LI-CHUNG LU