Patents by Inventor Meng Heng

Meng Heng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170133330
    Abstract: A semiconductor device has a substrate with a stiffening layer disposed over the substrate. The substrate has a circular shape or rectangular shape. A plurality of semiconductor die is disposed over a portion of the substrate while leaving an open area of the substrate devoid of the semiconductor die. The open area of the substrate devoid of the semiconductor die includes a central area or interstitial locations among the semiconductor die. The semiconductor die are disposed around a perimeter of the substrate. An encapsulant is deposited over the semiconductor die and substrate. The substrate is removed and an interconnect structure is formed over the semiconductor die. By leaving the predetermined areas of the substrate devoid of semiconductor die, the warping effect of any mismatch between the CTE of the semiconductor die and the CTE of the encapsulant on the reconstituted wafer after removal of the substrate is reduced.
    Type: Application
    Filed: January 25, 2017
    Publication date: May 11, 2017
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin
  • Patent number: 9607965
    Abstract: A semiconductor device has a substrate with a stiffening layer disposed over the substrate. The substrate has a circular shape or rectangular shape. A plurality of semiconductor die is disposed over a portion of the substrate while leaving an open area of the substrate devoid of the semiconductor die. The open area of the substrate devoid of the semiconductor die includes a central area or interstitial locations among the semiconductor die. The semiconductor die are disposed around a perimeter of the substrate. An encapsulant is deposited over the semiconductor die and substrate. The substrate is removed and an interconnect structure is formed over the semiconductor die. By leaving the predetermined areas of the substrate devoid of semiconductor die, the warping effect of any mismatch between the CTE of the semiconductor die and the CTE of the encapsulant on the reconstituted wafer after removal of the substrate is reduced.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: March 28, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin
  • Publication number: 20160333499
    Abstract: The present invention provides a fabricating method for meltblown nonwoven from natural cellulose fiber blended with nano silver, which comprises following steps. Firstly, prepare nano silver colloidal sol by reduction titration for mixture of polyvinyl alcohol (PVA), silver nitrate (AgNO3) and sodium borohydride (NaBH4). Secondly, prepare mixing cellulose serum by blending agitation for mixture of wood pulp, N-methylmorpholine N-oxide (NMMO) and stabilizer. Thirdly, prepare blending mucilage from mixing cellulose serum via blending process. Fourthly, produce spinning dope by blending and dehydrating the nano silver colloidal sol and mixing cellulose serum. Fifthly, produce molten filament tow by meltblown spinning method in association with coagulation, regeneration in coagulation bath, and water rinse.
    Type: Application
    Filed: November 10, 2015
    Publication date: November 17, 2016
    Inventors: Wen-Tung CHOU, Ming-Yi LAI, Kun-Shan HUANG, Shao-Hua CHOU, Meng-Heng HSIEH
  • Publication number: 20160333498
    Abstract: The present invention provides a fabricating method for natural cellulose fiber blended with nano silver. The fabricating method comprises following steps: Firstly, prepare nano silver colloidal sol by reduction titration for mixture of polyvinyl alcohol (PVA), silver nitrate (AgNO3) and sodium borohydride (NaBH4). Secondly, prepare mixing cellulose serum by blending agitation for mixture of wood pulp, N-methylmorpholine N-oxide (NMMO) and stabilizer. Thirdly, produce spinning dope by blending and dehydrating the nano silver colloidal sol and mixing cellulose serum. Fourthly, produce fibrous tow by Dry-Jet Wet Spinning method in association with coagulation, regeneration in coagulation bath, and water rinse. Finally, obtain final product of natural cellulose fiber blended with nano silver by post treatments of dry, oil and coil in proper order.
    Type: Application
    Filed: November 9, 2015
    Publication date: November 17, 2016
    Inventors: Wen-Tung CHOU, Ming-Yi LAI, Kun-Shan HUANG, Shao-Hua CHOU, Meng-Heng HSIEH
  • Publication number: 20160333508
    Abstract: The present invention provides a fabricating method for spunbond nonwoven from natural cellulose fiber blended with nano silver, which comprises following steps. Firstly, prepare nano silver colloidal sol by reduction titration for mixture of polyvinyl alcohol (PVA), silver nitrate (AgNO3) and sodium borohydride (NaBH4). Secondly, prepare mixing cellulose serum by blending agitation for mixture of wood pulp, N-methylmorpholine N-oxide (NMMO) and stabilizer. Thirdly, prepare blending mucilage from mixing cellulose serum via blending process. Fourthly, produce spinning dope by blending and dehydrating the nano silver colloidal sol and mixing cellulose serum. Fifthly, produce molten filament tow by spunbond spinning method in association with coagulation, regeneration, water rinse and high-speed stretching process.
    Type: Application
    Filed: November 12, 2015
    Publication date: November 17, 2016
    Inventors: Wen-Tung CHOU, Ming-Yi LAI, Kun-Shan HUANG, Shao-Hua CHOU, Meng-Heng HSIEH
  • Publication number: 20160148684
    Abstract: A high-reliability resistive random access memory (RRAM). A memory cell of a memory cell array is controlled via a word line, a bit line and a source line. The control unit of the RRAM has a word line decoder, a bit line decoder, and a source line decoder and switch circuit. The word line decoder, the bit line decoder and the source line decoder respectively control the voltage applied to the word line, the voltage applied to the bit line, and the voltage applied to the source line. The switch circuit is switched between a first state and a second state to operate the bit line decoder to apply a voltage to the bit line to read the memory cell and to operate the source line decoder to apply a voltage to the source line to read the memory cell alternately.
    Type: Application
    Filed: November 24, 2015
    Publication date: May 26, 2016
    Inventors: Meng-Heng LIN, Bo-Lun WU, Chien-Min WU
  • Patent number: 9231208
    Abstract: A method includes forming a resistance-switching layer and a second electrode over a first electrode. The method includes applying a forming voltage to the resistance-switching layer such that the resistance of the resistance-switching layer is decreased. The method includes applying an initial reset voltage to the first electrode or the second electrode such that the resistance of the resistance-switching layer is increased. The method includes applying a first set voltage to the first electrode or the second electrode such that the resistance of the resistance-switching layer is decreased. The method includes applying a second reset voltage to first electrode or the second electrode such that the resistance of the resistance-switching layer is increased. The method includes applying a second set voltage to first electrode or the second electrode such that the resistance of the resistance-switching layer is decreased. The second set voltage is lower than the first set voltage.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: January 5, 2016
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Meng-Heng Lin, Bo-Lun Wu
  • Publication number: 20150287919
    Abstract: A method includes forming a resistance-switching layer and a second electrode over a first electrode. The method includes applying a forming voltage to the resistance-switching layer such that the resistance of the resistance-switching layer is decreased. The method includes applying an initial reset voltage to the first electrode or the second electrode such that the resistance of the resistance-switching layer is increased. The method includes applying a first set voltage to the first electrode or the second electrode such that the resistance of the resistance-switching layer is decreased. The method includes applying a second reset voltage to first electrode or the second electrode such that the resistance of the resistance-switching layer is increased. The method includes applying a second set voltage to first electrode or the second electrode such that the resistance of the resistance-switching layer is decreased. The second set voltage is lower than the first set voltage.
    Type: Application
    Filed: September 2, 2014
    Publication date: October 8, 2015
    Inventors: Meng-Heng LIN, Bo-Lun WU
  • Publication number: 20150084213
    Abstract: A semiconductor device has a substrate with a stiffening layer disposed over the substrate. The substrate has a circular shape or rectangular shape. A plurality of semiconductor die is disposed over a portion of the substrate while leaving an open area of the substrate devoid of the semiconductor die. The open area of the substrate devoid of the semiconductor die includes a central area or interstitial locations among the semiconductor die. The semiconductor die are disposed around a perimeter of the substrate. An encapsulant is deposited over the semiconductor die and substrate. The substrate is removed and an interconnect structure is formed over the semiconductor die. By leaving the predetermined areas of the substrate devoid of semiconductor die, the warping effect of any mismatch between the CTE of the semiconductor die and the CTE of the encapsulant on the reconstituted wafer after removal of the substrate is reduced.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Applicant: STATS ChipPAC, Ltd.
    Inventors: Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin
  • Publication number: 20070267349
    Abstract: The present invention provides methods for separating one or more components of interest from a sample containing particulates and soluble materials. The method comprises the steps of: (a) filtering a sample through silica filter media whose surface silanol groups have reacted with one or more silanes, and (b) simultaneously capturing particulates and binding a soluble component to the silica filter media. The bound soluble component of interest is subsequently eluted from the silica filter media. In one embodiment of the invention, unwanted soluble materials are captured by the treated silica filter media and desired component of interest is recovered from the flow-through. In another embodiment, different components of interest are recovered from both the eluate and the flow-through. Preferred treated silica filter media are silane-treated rice hull ash or diatomaceous earth with functional quarternary ammonium group or functional sulphonate group.
    Type: Application
    Filed: July 25, 2007
    Publication date: November 22, 2007
    Inventors: Gary GIBSON, Keith Hayes, Meng Heng, Csilla Kollar, Thomas Lane, Anthony Revis, Landon Steele
  • Publication number: 20070246406
    Abstract: The invention relates to apparatuses, machines, systems and methods for the recovery and purification of proteins, peptides, nucleic acids, biologically produced polymers and other compounds from aqueous fluids. The aqueous fluids can comprise enzyme concentrates and or a fermentation broth with or without cells or other starting material. The fermentation broth can be produced by fermentations of fungal, yeast, bacterial, mammalian, insect or plant cells.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 25, 2007
    Inventors: Kevin Dibel, Robin Fong, Meng Heng, Glenn Rozeboom
  • Publication number: 20070191594
    Abstract: Described herein are methods for purifying a protein of interest from a mixture of proteins wherein the mixture comprises the protein of interest and a fusion analog thereof. The method begins with a recovery in which filtration is used to remove cells and concentrate the protein of interest. Liquid chromatography is then used to remove fusion analogs and other contaminants resulting in a composition substantially free of contaminants. Substantially pure compositions of the protein of interest find use in therapeutic preparations.
    Type: Application
    Filed: March 13, 2007
    Publication date: August 16, 2007
    Applicant: Genencor International, Inc.
    Inventors: Robin Fong, Meng Heng
  • Publication number: 20050029195
    Abstract: The present invention provides methods for separating one or more components of interest from a sample containing particulates and soluble materials. The method comprises the steps of: (a) filtering a sample through silica filter media whose surface silanol groups have reacted with one or more silanes, and (b) simultaneously capturing particulates and binding a soluble component to the silica filter media. The bound soluble component of interest is subsequently eluted from the silica filter media. In one embodiment of the invention, unwanted soluble materials are captured by the treated silica filter media and desired component of interest is recovered from the flow-through. In another embodiment of the invention, different components of interest are recovered from both the eluate and the flow-through. Preferred treated silica filter media are silane-treated rice hull ash or diatomaceous earth with functional quaternary ammonium group or functional sulphonate group.
    Type: Application
    Filed: April 23, 2004
    Publication date: February 10, 2005
    Inventors: Gary Gibson, Keith Hayes, Meng Heng, Csilla Kollar, Thomas Lane, Anthony Revis, Landon Steele
  • Patent number: 6141987
    Abstract: An absorption refrigeration system which utilizes absorption with a double separating effect where the pressure of the condenser (K2) is offset relative to the pressure of the second generator (G2). In this system, absorption of the working mixture is achieved using methanol as the refrigerating agent and a compound having a methylphenol group as a solvent. The system is useful for producing cold or heat, particularly for the air conditioning of elementary units of a building.
    Type: Grant
    Filed: December 2, 1999
    Date of Patent: November 7, 2000
    Assignee: Gaz de France
    Inventors: Meng Heng Huor, Gilles Le Halpere, Michel Prevost, Isabelle Soide