Patents by Inventor Meng How Chong

Meng How Chong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package lead design with grooves for improved dambar separation
    Patent number: 11362023
    Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Jayaganasan Narayanasamy, Meng How Chong, Elmer Senorin Holgado, Chee Ming Lam, Sanjay Kumar Murugan, Arivindran Navaretnasinggam, Kai Yang Tan, Lee Shuang Wang
  • POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE
    Publication number: 20220115245
    Abstract: A method for fabricating a power semiconductor package includes: providing a leadframe having a die pad and a frame, wherein the die pad is connected to the frame by at least one tie bar; attaching a semiconductor die to the die pad; laser cutting through the at least one tie bar, thereby forming a cut surface; and after the laser cutting, molding over the die pad and the semiconductor die, wherein the cut surface is completely covered by molding compound.
    Type: Application
    Filed: October 4, 2021
    Publication date: April 14, 2022
    Inventors: Jayaganasan Narayanasamy, Syahir Abd Hamid, Meng How Chong, Michael Reyes Godoy, Chee Ming Lam, Adbul Rahman Mohamed, Sanjay Kumar Murugan, Thomas Stoek
  • Package Lead Design with Grooves for Improved Dambar Separation
    Publication number: 20210013135
    Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.
    Type: Application
    Filed: July 12, 2019
    Publication date: January 14, 2021
    Inventors: Jayaganasan Narayanasamy, Meng How Chong, Elmer Senorin Holgado, Chee Ming Lam, Sanjay Kumar Murugan, Arivindran Navaretnasinggam, Kai Yang Tan, Lee Shuang Wang