Patents by Inventor Meng-Hsin CHIANG

Meng-Hsin CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical system
    Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Semiconductor integrated circuit device
    Patent number: 10581414
    Abstract: A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: March 3, 2020
    Assignee: MediaTek Inc.
    Inventors: Chun-Neng Liao, Meng-Hsin Chiang, Chun-Wei Chang, Chee-Kong Ung, Ching-Chih Li
  • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    Publication number: 20170111032
    Abstract: A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.
    Type: Application
    Filed: September 23, 2016
    Publication date: April 20, 2017
    Inventors: Chun-Neng LIAO, Meng-Hsin CHIANG, Chun-Wei CHANG, Chee-Kong UNG, Ching-Chih LI