Abstract: A method for fabricating a semiconductor device is provided. The method includes generating a redistribution layer (RDL) layout, wherein the RDL layout comprises a plurality of redistribution lines; determining a first dummy region in the RDL layout according to the redistribution lines; disposing a plurality of first dummy redistribution lines in the first dummy region; performing a first modification process to enlarge at least one of the first dummy redistribution lines; determining the enlarged one of the first dummy redistribution lines as a second dummy region in the RDL layout when an area of the enlarged one of the first dummy redistribution lines is greater than a threshold value; disposing a plurality of second dummy redistribution lines in the second dummy region; and patterning a metal layer according to the RDL layout after disposing the second dummy redistribution lines in the second dummy region.

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over and passing through the insulating layer. The conductive pillar is formed in one piece, the conductive pillar is in direct contact with the first conductive line, and a first sidewall of the first conductive line extends across a second sidewall of the conductive pillar in a top view of the first conductive line and the conductive pillar. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over the insulating layer. The conductive pillar is formed in one piece, the conductive pillar has a lower surface and a bottom protruding portion protruding from the lower surface, the bottom protruding portion passes through the insulating layer over the first conductive line, the bottom protruding portion is in direct contact with the first conductive line, and a first linewidth of a first portion of the first conductive line under the conductive pillar is less than a width of the conductive pillar. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over the insulating layer. The conductive pillar is formed in one piece, the conductive pillar has a lower surface and a bottom protruding portion protruding from the lower surface, the bottom protruding portion passes through the insulating layer over the first conductive line, the bottom protruding portion is in direct contact with the first conductive line, and a first linewidth of a first portion of the first conductive line under the conductive pillar is less than a width of the conductive pillar. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.

Abstract: A ceramic circuit board and a method of making are provided. The ceramic circuit board includes a substrate and a composite material layer. The composite material layer is formed on the substrate and comprises metal oxide powders and ceramic powders. The composite material layer has an interface layer which is transformed from the metal oxide powders by reduction and includes comprises zero-valent metal, lower-valent metal oxide and eutectic mixture reduced from the metal oxide powders of the composite material layer.

Abstract: A ceramic circuit board and a method of making are provided. The ceramic circuit board includes a substrate and a composite material layer. The composite material layer is formed on the substrate and comprises metal oxide powders and ceramic powders. The composite material layer has an interface layer which is transformed from the metal oxide powders by reduction and includes comprises zero-valent metal, lower-valent metal oxide and eutectic mixture reduced from the metal oxide powders of the composite material layer.

Abstract: A ceramic circuit board and a method of making are provided. The ceramic circuit board includes a substrate and a composite material layer. The composite material layer is formed on the substrate and comprises metal oxide powders and ceramic powders. The composite material layer has an interface layer which is transformed from the metal oxide powders by reduction and includes comprises zero-valent metal, lower-valent metal oxide and eutectic mixture reduced from the metal oxide powders of the composite material layer.

Abstract: A defrosting tray includes a metal substrate, a thermal conductive ceramic coating formed on the top surface of the metal substrate, and an inorganic nanocoating formed on a top surface of the thermal conductive ceramic coating. The thermal conductive ceramic coating is configured to enhance a heat transfer capability of the metal substrate. In particular, the first ceramic coating and the first inorganic nanocoating together define a defrosting surface with sub-micron pyramidal arrays.

Abstract: This invention relates to a suspended ceiling, comprising a metal grid structure and a plurality of drop-in ceiling panels supported by the metal grid structure. Each of the ceiling panels includes a thermal conductive metal substrate, a heat insulating coating formed on the top surface of the metal substrate, and a thermal conductive ceramic coating formed on the bottom surface of the metal substrate. The heat insulating coating is provided to prevent heat generated in a plenum space between the dropped ceiling and a actual ceiling from traveling down to the room below the dropped ceiling. And, the thermal conductive ceramic coating is provided to enhance a heat transfer capability of the metal substrate. As such, the ceiling panels can facilitate rapid cooling of an air-conditioned room.

Abstract: A ceramic circuit board and a method of making are provided. The ceramic circuit board includes a substrate and a composite material layer. The composite material layer is formed on the substrate and comprises metal oxide powders and ceramic powders. The composite material layer has an interface layer which is transformed from the metal oxide powders by reduction and includes comprises zero-valent metal, lower-valent metal oxide and eutectic mixture reduced from the metal oxide powders of the composite material layer.

Abstract: A method for making a ceramic heat sink is provided. In the first step of the method, a mixed material of nitrite-based ceramic powder, titanium powder and inorganic resin is prepared. The mixed material is then molded into a ceramic blank with a mold coated with titanium. Thereafter, the ceramic blank may be sintered to form the ceramic heat sink. Since the mixture and the mold both contain a common material of titanium, the molded ceramic blank can be easily removed from the mold in its integrity.

Abstract: A method for making a ceramic heat sink is provided. In the first step of the method, a mixed material of nitrite-based ceramic powder, titanium powder and inorganic resin is prepared. The mixed material is then molded into a ceramic blank with a mold coated with titanium. Thereafter, the ceramic blank may be sintered to form the ceramic heat sink. Since the mixture and the mold both contain a common material of titanium, the molded ceramic blank can be easily removed from the mold in its integrity.

Abstract: A heat dissipation apparatus includes a heat conductive plate, a heat-dissipating fin set and a fastener. The heat-dissipating fin set has a bottom surface attached to a top surface of the heat conductive plate. The fastener includes a curled section and two legs joined to opposite ends of the curled section. Basically, the curled section is elastically deformable and has a trough pressing against a top surface of the heat-dissipating fin set and a crest spaced apart from the top surface of the heat-dissipating fin set. Each of the legs of the fastener has a clasping member to be fastened on heat conductive plate. When the clasping members of the legs are fastened on the heat conductive plate, the curled section is tightened by the legs.