Patents by Inventor Meng Hsueh Tsai

Meng Hsueh Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200312421
    Abstract: A memory test array and a test method thereof are provided. The memory test array includes a first memory array, a second memory array, and a plurality of first common conductive pads. The first memory array includes a plurality of first bit lines and a plurality of first word lines. The second memory array is adjacent to the first memory array and includes a plurality of second bit lines and a plurality of second word lines. Each of the first common conductive pads has a first end and a second end, and the first ends and the second ends are respectively coupled to the first bit lines and the second bit lines, or respectively coupled to the first word lines and the second word lines. The memory test array of the present disclosure can effectively save the area of the memory test chip and make the test process more efficient.
    Type: Application
    Filed: July 22, 2019
    Publication date: October 1, 2020
    Inventors: Hsiung-Shih CHANG, Yu-Cheng LIAO, Meng-Hsueh TSAI
  • Patent number: 8570234
    Abstract: An assembly of a chip antenna and a circuit board includes a chip antenna and a circuit board. The circuit board includes a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna includes input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: October 29, 2013
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Meng Hsueh Tsai, Chih Ming Su, Lee Ting Hsieh
  • Patent number: 8400360
    Abstract: A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: March 19, 2013
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Yueh-Lin Tsai, Meng Hsueh Tsai, Chin Huang Cheng
  • Publication number: 20110291910
    Abstract: An assembly of a chip antenna and a circuit board includes a chip antenna and a circuit board. The circuit board includes a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna includes input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy.
    Type: Application
    Filed: March 31, 2011
    Publication date: December 1, 2011
    Applicant: INPAO TECHNOLOGY CO., LTD.
    Inventors: MENG HSUEH TSAI, CHIH MING SU, LEE TING HSIEH
  • Publication number: 20100007575
    Abstract: A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application.
    Type: Application
    Filed: January 16, 2009
    Publication date: January 14, 2010
    Inventors: Yueh-Lin TSAI, Meng Hsueh TSAI, Chin Huang CHENG