Patents by Inventor Meng-Hsun Wu

Meng-Hsun Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10249357
    Abstract: A semiconductor device includes a substrate having a memory region and a peripheral region defined thereon, wherein the peripheral region comprises at least one transistor, the memory region comprises a plurality of memory cells, each memory cell comprises at least one gate structure and a capacitor structure, a mask layer disposed on the capacitor structure in the memory region, and a dielectric layer disposed on the substrate within the peripheral region, wherein a top surface of the dielectric layer is aligned with a top surface of the mask layer.
    Type: Grant
    Filed: November 23, 2017
    Date of Patent: April 2, 2019
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Wen-Chin Lin, Jhih-Yuan Chen, Syue-Ren Wu, Meng-Hsun Wu
  • Patent number: 9514786
    Abstract: An electronic device and a music visualization method thereof are provided. The electronic device is configured to display music visualization in response to music and change the music visualization in response to music lyrics of the music. The music visualization method is applied to the electronic device to implement the operations.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: December 6, 2016
    Assignee: HTC CORPORATION
    Inventors: Sheng-Hsin Huang, Fang-Ju Lin, Jye Rong, Meng-Hsun Wu, Chung-Hao Huang, Ching-Chun Huang, Wei-Yi Ho, Wei-Hua Wu
  • Publication number: 20140210812
    Abstract: An electronic device and a music visualization method thereof are provided. The electronic device is configured to display music visualization in response to music and change the music visualization in response to music lyrics of the music. The music visualization method is applied to the electronic device to implement the operations.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 31, 2014
    Applicant: HTC CORPORATION
    Inventors: Sheng-Hsin Huang, Fang-Ju Lin, Jye Rong, Meng-Hsun Wu, Chung-Hao Huang, Ching-Chun Huang, Wei-Yi Ho, Wei-Hua Wu
  • Patent number: 8472185
    Abstract: An assembly includes an article, and a computer housing including left and right sidewalls cooperatively defining an accommodating space and an opening for communicating the accommodating space with an external environment, and a positioning member provided on one of the sidewalls. Each sidewall includes a slide rail. A package is mounted removably in the accommodating space via the opening, is connected slidably to the slide rails of the sidewalls, and is positioned within the accommodating space through the positioning member. The package includes two interconnected cover parts cooperatively defining a receiving space for receiving the article and a communicating hole for communicating the receiving space with the external environment, and a handgrip to mount removably the package in the accommodating space. Each cover part includes a stop member abutting against the article to prevent escape of the article from the receiving space via the communicating hole.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: June 25, 2013
    Assignee: Wistron Corporation
    Inventors: Meng-Hsun Wu, Fu-Jen Yang, Yang-Chieh Ma
  • Publication number: 20110255241
    Abstract: An assembly includes an article, and a computer housing including left and right sidewalls cooperatively defining an accommodating space and an opening for communicating the accommodating space with an external environment, and a positioning member provided on one of the sidewalls. Each sidewall includes a slide rail. A package is mounted removably in the accommodating space via the opening, is connected slidably to the slide rails of the sidewalls, and is positioned within the accommodating space through the positioning member. The package includes two interconnected cover parts cooperatively defining a receiving space for receiving the article and a communicating hole for communicating the receiving space with the external environment, and a handgrip to mount removably the package in the accommodating space. Each cover part includes a stop member abutting against the article to prevent escape of the article from the receiving space via the communicating hole.
    Type: Application
    Filed: April 18, 2011
    Publication date: October 20, 2011
    Applicant: Wistron Corporation
    Inventors: Meng-Hsun Wu, Fu-Jen Yang, Yang-Chieh Ma
  • Patent number: D689874
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: September 17, 2013
    Assignee: HTC Corporation
    Inventors: David Brinda, Micah Shotel, Sheng-Hsin Huang, Hsu-Jung Chen, Jye Rong, Peter Chin, Meng-Hsun Wu
  • Patent number: D711921
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: August 26, 2014
    Assignee: HTC Corporation
    Inventors: Jesse John Penico, David Brinda, Jye Rong, Meng-Hsun Wu, Ching-Chun Huang, Chung-Hao Huang
  • Patent number: D736792
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: August 18, 2015
    Assignee: HTC Corporation
    Inventors: David Brinda, Micah Shotel, Sheng-Hsin Huang, Hsu-Jung Chen, Jye Rong, Peter Chin, Meng-Hsun Wu
  • Patent number: D743442
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: November 17, 2015
    Assignee: HTC Corporation
    Inventors: Jesse John Penico, David Brinda, Jye Rong, Meng-Hsun Wu, Ching-Chun Huang, Chung-Hao Huang
  • Patent number: D890205
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: July 14, 2020
    Assignee: KAI OS TECHNOLOGIES (HONG KONG) LIMITED
    Inventors: Yi-Lung Tsai, Meng-Hsun Wu, Wei-Chi Yen
  • Patent number: D927511
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: August 10, 2021
    Assignee: KAI OS TECHNOLOGIES (HONG KONG) LIMITED
    Inventors: Yi-Lung Tsai, Meng-Hsun Wu
  • Patent number: D944851
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: March 1, 2022
    Assignee: KAI OS TECHNOLOGIES (HONG KONG) LIMITED
    Inventor: Meng-Hsun Wu
  • Patent number: D948546
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 12, 2022
    Assignee: KAI OS TECHNOLOGIES (HONG KONG) LIMITED
    Inventor: Meng-Hsun Wu