Patents by Inventor Meng-Hua TSAI

Meng-Hua TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154629
    Abstract: A 24 GHz band-pass filter includes a step impedance resonator, a first U-shape feeding portion, a second U-shape feeding portion, short-circuit stubs and open-circuit stubs. The step impedance resonator includes a first main portion, a second main portion, and a connection portion for connecting the main portions to each other. The first main portion and the second main portion are electrically connected to a first signal input/output port and a second signal input/output port. The first U-shape feeding portion is electrically connected between the first main portion and the first signal input/output port. The second U-shape feeding portion is electrically connected between the second main portion and the second signal input/output port. The short-circuit stubs are electrically connected to coupling segments of the step impedance resonator. The open-circuit stubs are electrically connected to the first U-shape feeding portion and the second U-shape feeding portion.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Inventors: Kun Yen TU, Meng-Hua TSAI, Wei Ting LEE, Sin-Siang WANG
  • Patent number: 11973260
    Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: April 30, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Ruo-Lan Chang, Mei-Ju Lee, Cheng-Hua Tsai, Meng-Hsuan Chen, Wei-Chung Chen
  • Patent number: 11967762
    Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member, a signal feeding via and a plurality of conductive vias. The substrate has opposite first and second surfaces and comprises liquid crystal polymer. The reflective plates are arrayed on the first surface of the substrate. The grounding plate is disposed on the second surface of the substrate and overlapped with the reflective plates in a normal direction of the substrate. The grounding plate further includes an opening. The radiating member is disposed on the first surface of the substrate and physically separated from the reflective plates. The signal feeding via is coupled with the radiating member and penetrates through the substrate to be exposed in the opening of the grounding plate. The conductive vias penetrate through the substrate and respectively connect the reflective plates and the grounding plate.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: April 23, 2024
    Assignee: QuantumZ Inc.
    Inventors: Gang-Lin Zhang, Meng-Hua Tsai, Weiting Lee, Sin-Siang Wang
  • Publication number: 20240120656
    Abstract: A light-transmitting antenna includes a substrate, a first conductive pattern, and a second conductive pattern. The first conductive pattern has a first feeder unit, a first radiation unit, a second radiation unit, and a first connection unit. The first feeder unit and the first connection unit are connected to two sides of the first radiation unit. The first connection unit connects the first radiation unit and the second radiation unit. The second conductive pattern has a second feeder unit, a third radiation unit, a fourth radiation unit, and a second connection unit. The second feeder unit and the second connection unit are connected to two sides of the third radiation unit. The second connection unit connects the third radiation unit and the fourth radiation unit. An orthogonal projection of the second feeder unit on a first surface of the substrate at least partially overlaps the first feeder unit.
    Type: Application
    Filed: December 22, 2022
    Publication date: April 11, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Meng-Hsuan Chen, Cheng-Hua Tsai, Mei-Ju Lee, Ruo-Lan Chang, Wei-Chung Chen
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 11939664
    Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Chun Hsieh, Tsung-Yu Tsai, Hsing-Yuan Huang, Chih-Chang Wu, Szu-Hua Wu, Chin-Szu Lee
  • Publication number: 20240097300
    Abstract: A multi-band filter includes a circuit board, a first resonator, a second resonator, and a coupling element configured to couple the first resonator with the second resonator. The coupling element includes a first coupling capacitor, a second coupling capacitor, a first short-circuited stub and a second short-circuited stub. The first coupling capacitor has two terminals electrically connected to the first portion of the first resonator and the first portion of the second resonator respectively. The second coupling capacitor has two terminals electrically connected to the second portion of the first resonator and the second portion of the second resonator respectively. The first short-circuited stub is electrically connected to the first coupling capacitor and a ground plane. The second short-circuited stub is electrically connected to the second coupling capacitor and a ground plane.
    Type: Application
    Filed: June 20, 2023
    Publication date: March 21, 2024
    Inventors: Kun Yen TU, Meng-Hua TSAI, Weiting LEE, Sin-Siang WANG
  • Patent number: 11916313
    Abstract: An appressed antenna includes an antenna housing and a metal shell. The antenna housing comprising a housing and a planar antenna, where the planar antenna is bent with one part folded onto the inner surface of the housing and other part pressed onto the outer surface of the housing. The antenna housing is sleeve fitted to the metal shell with a gap between for the planar antenna to radiate. In this all-metal environment, the position of the antenna is close to the gap opening will increase radiation efficiency. By having at least a branch at the tail end of the appressed antenna, the appressed antenna can have a good return loss and antenna gain.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: February 27, 2024
    Assignee: QuantumZ Inc.
    Inventors: Kun-Yen Tu, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang
  • Patent number: 11862869
    Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member and a plurality of conductive vias. The substrate contains liquid crystal polymer and has opposite first and second surfaces. The reflective plates are arranged in an array on the first surface of the substrate. The grounding plate is arranged on the second surface of the substrate and overlaps with the reflective plates in a normal direction of the substrate. The radiating member is on the second surface of the substrate and does not overlap with the reflective plates in the normal direction of the substrate. The radiating member has an open slot which is defined by a first radiating branch and a second radiating branch that generate at least two different operating frequency bands. The conductive vias respectively penetrate the substrate and connect with the reflective plates and the grounding plate.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: January 2, 2024
    Assignee: QuantumZ Inc.
    Inventors: Gang-Lin Zhang, Meng-Hua Tsai, Weiting Lee, Sin-Siang Wang
  • Patent number: 11843176
    Abstract: An array antenna of a radar includes a liquid crystal polymer (LCP) substrate with antenna transceiver circuits embedded. A plurality of patch array antennas are disposed on the LCP substrate and connected to the antenna transceiver circuit. Each patch array antenna includes a plurality of patch antennas connected in series, and the foremost patch antenna has a concave slot on the radiating surface by each side of respective feed line. By use of a LCP substrate can ensure stable material characteristics in different environments. Compared with a single patch antenna, the gain may be improved by 6 dB by connecting four patch antennas in series. A concave slot is formed on a radiating surface of a patch antenna to optimize a feed impedance, thereby to improve a working bandwidth of the antenna to alleviate an excessively narrow bandwidth of a patch antenna.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: December 12, 2023
    Assignee: QUANTUMZ INC.
    Inventors: Wei-Huang Chen, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang
  • Patent number: 11843172
    Abstract: A patch antenna includes a dielectric substrate formed by a high dielectric coefficient material covered with a soft material. The dielectric substrate has a first surface, an opposite second surface, and surrounding side surfaces there between. The patch antenna further includes a radiating metal arm formed on at least the first surface with a thin metal layer in a specific shape, a grounding metal plate disposed on the second surface, and a parasitic metal arm extending from the grounding metal plate towards the first surface via at least one of the side surfaces. The parasitic metal arm is approximate but not connected to the radiating metal arm. The radiation metal arm further includes an enclosed slot, together with the parasitic metal arm, improve the working bandwidth and high directivity of the antenna.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: December 12, 2023
    Assignee: QUANTUMZ INC.
    Inventors: Chih-Yang Lou, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang
  • Publication number: 20230366918
    Abstract: An antenna test system includes a box body, a supporting device, at least one probe device, a signal measuring device, and a moving device. The box body has at least an operation side configured to be opened to allow access to devices inside the box body. The supporting device is disposed in the box body and the antenna circuit to be tested is arranged thereon. The probe device is disposed in the box body and configured to apply an antenna testing signal to the antenna circuit to emit an antenna working signal. The signal measuring device is disposed in the box body to receive the antenna working signal emitted from the antenna circuit. The moving device is disposed in the box body and configured to carry the signal measuring device to maneuver in three directions of X-axis, Y-axis, and Z-axis to receive the antenna working signal in different positions.
    Type: Application
    Filed: May 10, 2023
    Publication date: November 16, 2023
    Inventors: Meng-Hua TSAI, Wei-Ting LEE, Chun-Yen WANG, Wei-Cheng LIN
  • Publication number: 20230299450
    Abstract: A three-dimensional (3D) filter and a fabrication method thereof are provided. The 3D filter includes a circuit board, a first ring-type resonator, a second ring-type resonator and a via structure. The circuit board includes a first circuit layer, a second circuit layer and a third circuit layer. The third circuit layer is located between the first circuit board and the second circuit board. The first ring-type resonator is disposed in the first circuit layer and has a first surrounding area corresponding to a first cut-off frequency band. The second ring-type resonator is disposed in the second circuit layer and has a second surrounding area corresponding to a second cut-off frequency band. The via structure passes through the first circuit layer, the second circuit layer and the third circuit layer, and is electrically connected to the first ring-type resonator and the second ring-type resonator.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 21, 2023
    Inventors: Gang-Lin ZHANG, Meng-Hua TSAI, Weiting LEE, Sin-Siang WANG
  • Publication number: 20230231320
    Abstract: An array antenna includes a flexible substrate formed by stacked liquid crystal polymer (LCP) layers and has at least one feed point. At least one serial antenna is arranged on the flexible substrate, and a microstrip is extended from the feed point to connect a plurality of radiating elements in series to form the serial antenna. The tail end one of the radiating elements of the serial antenna is connected to one end of a ground microstrip, and another end of the ground microstrip is short-circuited to the ground. The length of the ground microstrip is approximately one fourth of the wavelength of the center frequency of the array antenna. Feeding sections where microstrips feeding to the radiating elements are in a horn and/or groove shape. Desired frequency and bandwidth may be obtained by adjusting lengths and widths of feeding sections respectively.
    Type: Application
    Filed: October 24, 2022
    Publication date: July 20, 2023
    Inventors: Chih-Yang LOU, Meng-Hua TSAI, Wei-Ting LEE, Sin-Siang WANG
  • Patent number: 11705636
    Abstract: A composite antenna and array antenna using the same. The antenna has a three-layer structure including a patch antenna, a slot antenna and a transmission line. A first layer includes a patch antenna resonating at half a wavelength, a second layer includes a slot antenna resonating at half the wavelength, and a third layer includes a transmission line and a feed point. The three layers are coupled and the entire composite antenna unit satisfies a resonance condition. A signal is fed through the transmission line and coupled to the slot antenna, and the signal from the slot antenna is further coupled to the patch antenna. This composition antenna has a desirable antenna gain, and an increased antenna bandwidth compared to a single patch antenna or slot antenna.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: July 18, 2023
    Assignee: QUANTUMZ INC.
    Inventors: Kun-Yen Tu, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang
  • Publication number: 20230054657
    Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member and a plurality of conductive vias. The substrate contains liquid crystal polymer and has opposite first and second surfaces. The reflective plates are arranged in an array on the first surface of the substrate. The grounding plate is arranged on the second surface of the substrate and overlaps with the reflective plates in a normal direction of the substrate. The radiating member is on the second surface of the substrate and does not overlap with the reflective plates in the normal direction of the substrate. The radiating member has an open slot which is defined by a first radiating branch and a second radiating branch that generate at least two different operating frequency bands. The conductive vias respectively penetrate the substrate and connect with the reflective plates and the grounding plate.
    Type: Application
    Filed: June 8, 2022
    Publication date: February 23, 2023
    Inventors: Gang-Lin ZHANG, Meng-Hua TSAI, Weiting LEE, Sin-Siang WANG
  • Publication number: 20230059332
    Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member, a signal feeding via and a plurality of conductive vias. The substrate has opposite first and second surfaces and comprises liquid crystal polymer. The reflective plates are arrayed on the first surface of the substrate. The grounding plate is disposed on the second surface of the substrate and overlapped with the reflective plates in a normal direction of the substrate. The grounding plate further includes an opening. The radiating member is disposed on the first surface of the substrate and physically separated from the reflective plates. The signal feeding via is coupled with the radiating member and penetrates through the substrate to be exposed in the opening of the grounding plate. The conductive vias penetrate through the substrate and respectively connect the reflective plates and the grounding plate.
    Type: Application
    Filed: August 10, 2022
    Publication date: February 23, 2023
    Inventors: Gang-Lin ZHANG, Meng-Hua TSAI, Weiting LEE, Sin-Siang WANG
  • Publication number: 20230058196
    Abstract: An array antenna of a radar includes a liquid crystal polymer (LCP) substrate with antenna transceiver circuits embedded. A plurality of patch array antennas are disposed on the LCP substrate and connected to the antenna transceiver circuit. Each patch array antenna includes a plurality of patch antennas connected in series, and the foremost patch antenna has a concave slot on the radiating surface by each side of respective feed line. By use of a LCP substrate can ensure stable material characteristics in different environments. Compared with a single patch antenna, the gain may be improved by 6 dB by connecting four patch antennas in series. A concave slot is formed on a radiating surface of a patch antenna to optimize a feed impedance, thereby to improve a working bandwidth of the antenna to alleviate an excessively narrow bandwidth of a patch antenna.
    Type: Application
    Filed: February 25, 2022
    Publication date: February 23, 2023
    Inventors: Wei-Huang CHEN, Meng-Hua TSAI, Wei-Ting LEE, Sin-Siang WANG
  • Publication number: 20230030634
    Abstract: A millimeter wave radio frequency (RF) structure uses a substrate including a liquid-crystal polymer material, at least one dual-polarized antenna, a RF transceiver module, and a switching module electrically connected to the at least one dual-polarized antenna and the RF transceiver module, where the switching module includes a first switching element and a second switching element electrically connected to the at least one dual-polarized antenna, and a third switching element electrically connected to the first switching element and the second switching element, to enhance characteristics of a liquid-crystal polymer (LCP) substrate for millimeter waves, and implement high-frequency, high-speed transmission while ensuring high reliability.
    Type: Application
    Filed: July 25, 2022
    Publication date: February 2, 2023
    Inventors: Kun-Yen TU, Meng-Hua TSAI, Wei-Ting LEE, Sin-Siang WANG, Gang-Lin ZHANG
  • Publication number: 20230033007
    Abstract: A patch antenna includes a dielectric substrate formed by a high dielectric coefficient material covered with a soft material. The dielectric substrate has a first surface, an opposite second surface, and surrounding side surfaces there between. The patch antenna further includes a radiating metal arm formed on at least the first surface with a thin metal layer in a specific shape, a grounding metal plate disposed on the second surface, and a parasitic metal arm extending from the grounding metal plate towards the first surface via at least one of the side surfaces. The parasitic metal arm is approximate but not connected to the radiating metal arm. The radiation metal arm further includes an enclosed slot, together with the parasitic metal arm, improve the working bandwidth and high directivity of the antenna.
    Type: Application
    Filed: March 8, 2022
    Publication date: February 2, 2023
    Inventors: Chih-Yang LOU, Meng-Hua TSAI, Wei-Ting LEE, Sin-Siang WANG