Patents by Inventor Meng-Huan Jao
Meng-Huan Jao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240030301Abstract: Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a gate structure formed over a substrate, and a source/drain (S/D) structure formed adjacent to the gate structure. The semiconductor structure includes a gate spacer formed adjacent to the gate structure, and an etching stop layer adjacent to the gate spacer. The semiconductor structure also includes a gate mask layer formed over the gate structure, and a topmost surface of the gate mask layer is higher than a top surface of the etching stop layer.Type: ApplicationFiled: July 21, 2022Publication date: January 25, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Huan JAO, Lin-Yu HUANG, Huan-Chieh SU, Chih-Hao WANG
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Publication number: 20240006482Abstract: A device includes a channel layer, a gate structure, a first source/drain epitaxial structure, a second source/drain epitaxial structure, a front-side interconnection structure, and a backside via. The gate structure is across the channel layer. The first source/drain epitaxial structure and the second source/drain epitaxial structure are on opposite sides of the gate structure and are connected to the channel layer. The front-side interconnection structure is on a front-side of the first source/drain epitaxial structure. The backside via is connected to a backside of the first source/drain epitaxial structure. A backside surface of the first source/drain epitaxial structure is at a height between a height of a backside surface of the backside via and a height of a backside surface of the gate structure.Type: ApplicationFiled: June 29, 2022Publication date: January 4, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Li-Zhen YU, Lin-Yu HUANG, Huan-Chieh SU, Lo-Heng CHANG, Meng-Huan JAO, Chih-Hao WANG
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Publication number: 20230420566Abstract: A method includes providing a structure having gate structures, source/drain electrodes, a first etch stop layer (ESL), a first interlayer dielectric (ILD) layer, a second ESL, and a second ILD layer. The method includes forming a first etch mask; performing a first etching to the second ILD layer, the second ESL, and the first ILD layer through the first etch mask to form first trenches; depositing a third dielectric layer into the first trenches; forming a second etch mask; and performing a second etching to the second ILD layer, the second ESL, the first ILD layer, and the first ESL through the second etch mask, thereby forming second trenches, wherein the second trenches expose some of the source/drain electrodes, and the third dielectric layer resists the second etching. The method further includes depositing a metal layer into the second trenches.Type: ApplicationFiled: August 22, 2022Publication date: December 28, 2023Inventors: Meng-Huan Jao, Lin-Yu Huang, Huan-Chieh Su
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Publication number: 20230387220Abstract: A method includes providing a structure having source/drain electrodes and a first dielectric layer over the source/drain electrodes; forming a first etch mask covering a first area of the first dielectric layer; performing a first etching process to the first dielectric layer, resulting in first trenches over the source/drain electrodes; filling the first trenches with a second dielectric layer that has a different material than the first dielectric layer; removing the first etch mask; performing a second etching process including isotropic etching to the first area of the first dielectric layer, resulting in a second trench above a first one of the source/drain electrodes; depositing a metal layer into at least the second trench; and performing a chemical mechanical planarization (CMP) process to the metal layer.Type: ApplicationFiled: July 28, 2023Publication date: November 30, 2023Inventors: Meng-Huan Jao, Lin-Yu Huang, Sheng-Tsung Wang, Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang
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Publication number: 20230369468Abstract: A device includes a channel layer, a gate structure, a first source/drain epitaxial structure, a second source/drain epitaxial structure, a dummy fin structure, a mask layer, a first source/drain contact, and an isolation plug. The gate structure crosses the channel layer. The first source/drain epitaxial structure and the second source/drain epitaxial structure are on opposite sides of the channel layer. The dummy fin structure is in contact with the first source/drain epitaxial structure. The mask layer is over the dummy fin structure. The first source/drain contact is over and electrically connected to the first source/drain epitaxial structure. The isolation plug is over the mask layer and in contact with the first source/drain contact. The isolation plug is directly over the first source/drain contact and the mask layer.Type: ApplicationFiled: May 11, 2022Publication date: November 16, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chun-Yuan CHEN, Meng-Huan JAO, Huan-Chieh SU, Cheng-Chi CHUANG, Chih-Hao WANG
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Patent number: 11784228Abstract: A method includes providing a structure having source/drain electrodes and a first dielectric layer over the source/drain electrodes; forming a first etch mask covering a first area of the first dielectric layer; performing a first etching process to the first dielectric layer, resulting in first trenches over the source/drain electrodes; filling the first trenches with a second dielectric layer that has a different material than the first dielectric layer; removing the first etch mask; performing a second etching process including isotropic etching to the first area of the first dielectric layer, resulting in a second trench above a first one of the source/drain electrodes; depositing a metal layer into at least the second trench; and performing a chemical mechanical planarization (CMP) process to the metal layer.Type: GrantFiled: June 3, 2021Date of Patent: October 10, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Meng-Huan Jao, Lin-Yu Huang, Sheng-Tsung Wang, Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang
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Publication number: 20230260797Abstract: A method for manufacturing a semiconductor device includes: forming a feature in a dielectric layer disposed on a semiconductor substrate, the dielectric layer including silicon oxide, the feature extending downwardly from a top surface of the dielectric layer and including silicon, a nitride compound, a low-k dielectric material other than silicon oxide, or combinations thereof; and selectively etching the dielectric layer using an etchant composition to form a trench extending downwardly from the top surface of the dielectric layer, the etchant composition including a hydrogen halide and a nitrogen-containing compound represented by Formula (A), wherein R1, R2, R3 are each independently hydrogen, methyl, or ethyl.Type: ApplicationFiled: February 17, 2022Publication date: August 17, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Chien KUANG, Fang-Wei LEE, Meng-Huan JAO, Huan-Chieh SU
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Publication number: 20230039440Abstract: A device includes a substrate. A channel region of a transistor overlies the substrate and a source/drain region is in contact with the channel region. The source/drain region is adjacent to the channel region along a first direction. A source/drain contact is disposed on the source/drain region. A gate electrode is disposed on the channel region and a gate contact is disposed on the gate electrode. A first low-k dielectric layer is disposed between the gate contact and the source/drain contact along the first direction.Type: ApplicationFiled: March 15, 2022Publication date: February 9, 2023Inventors: Meng-Huan JAO, Huan-Chieh SU, Yi-Bo LIAO, Cheng-Chi CHUANG, Jin CAI, Chih-Hao WANG
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Publication number: 20220359677Abstract: A device includes a substrate and a gate structure wrapping around at least one vertical stack of nanostructure channels. The device includes a source/drain region abutting the gate structure, and a source/drain contact over the source/drain region. The device includes an etch stop layer laterally between the source/drain contact and the gate structure and having a first sidewall in contact with the source/drain contact, and a second sidewall opposite the first sidewall. The device includes a source/drain contact isolation structure embedded in the source/drain contact and having a third sidewall substantially coplanar with the second sidewall of the etch stop layer.Type: ApplicationFiled: September 23, 2021Publication date: November 10, 2022Inventors: Meng-Huan JAO, Lin-Yu HUANG, Sheng-Tsung WANG, Huan-Chieh SU, Cheng-Chi CHUANG, Chih-Hao WANG
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Publication number: 20220328637Abstract: A method includes providing a structure having source/drain electrodes and a first dielectric layer over the source/drain electrodes; forming a first etch mask covering a first area of the first dielectric layer; performing a first etching process to the first dielectric layer, resulting in first trenches over the source/drain electrodes; filling the first trenches with a second dielectric layer that has a different material than the first dielectric layer; removing the first etch mask; performing a second etching process including isotropic etching to the first area of the first dielectric layer, resulting in a second trench above a first one of the source/drain electrodes; depositing a metal layer into at least the second trench; and performing a chemical mechanical planarization (CMP) process to the metal layer.Type: ApplicationFiled: June 3, 2021Publication date: October 13, 2022Inventors: Meng-Huan Jao, Lin-Yu Huang, Sheng-Tsung Wang, Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang