Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.

Abstract: A component for fastening wires in a solar module is disclosed. The component includes a fastener and an adhesive layer. The fastener includes a substrate, two hooks disposed on the substrate, and two bases. Two cavities are formed between the hooks and the substrate for receiving the wires. Each hook has an opening, and the bases connect to the substrate and are disposed corresponding to the openings. A surface of each of the bases facing away from the cavity is inclined relative to the substrate, and a surface of each of the bases facing the cavity is substantially vertical to the surface. The adhesive layer is disposed on a surface of the substrate which is opposite to the hooks. A solar module using the component is also disclosed.