Patents by Inventor Meng-Hung Hsieh
Meng-Hung Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11983479Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.Type: GrantFiled: August 10, 2022Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jung-Chan Yang, Ting-Wei Chiang, Jerry Chang-Jui Kao, Hui-Zhong Zhuang, Lee-Chung Lu, Li-Chun Tien, Meng-Hung Shen, Shang-Chih Hsieh, Chi-Yu Lu
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Patent number: 11955460Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.Type: GrantFiled: October 5, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
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Patent number: 10951191Abstract: Provided is a low-leakage automatic adjustable diplexer including a body, a thin plate and two resonant regulators. The body has therein cuboid waveguide channels each having a feeding portion, a reception port portion, a transmission port portion, a fitting portion, a first filtering portion, a second filtering portion, first E/H conversion units connected to two ends of the first filtering portion, respectively, and second E/H conversion units connected to two ends of the second filtering portion, respectively. The thin plate is clamped inside the body. The resonant regulators each have a plurality of frequency disturbance elements adjustably protruding into the first and second filtering portions.Type: GrantFiled: December 25, 2019Date of Patent: March 16, 2021Inventors: Jen-Ti Peng, Chien-Chih Lee, Cheng-Lung Wu, Meng-Hung Hsieh, You-Hua Wu
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Patent number: 7990236Abstract: A low-pass filter (10) includes an input portion (100) for input of an electromagnetic signal, an output portion (120) for output of the electromagnetic signal, a high impedance transmission portion (140) electrically connecting the input portion and the output portion, a pair of low impedance transmission portions (160, 180) arranged on either side of the high impedance transmission portion, and a capacitor. One of the low impedance transmission portions electrically connects the input portion and one end portion of the high impedance transmission portion. The other low impedance transmission portion electrically connects the output portion and the other end portion of the high impedance transmission portion. One end of the capacitor is electrically connected to the high impedance transmission portion. The high impedance transmission portion is symmetrical about the capacitor.Type: GrantFiled: August 19, 2008Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Hsin-Ping Chen, Meng-Hung Hsieh
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Patent number: 7986751Abstract: A carrier frequency offset estimating device for estimating frequency offsets of a multi-carrier signal includes a transforming circuit, a cosine effect eliminating circuit, a model creating circuit, and an estimating circuit. The transforming circuit receives the multi-carrier signal and transforms the multi-carrier signal to single-carrier signals. The cosine effect eliminating circuit eliminates cosine effects in the single-carrier signals to form single-carrier signals without the cosine effects. The model creating circuit creates linear data models according to the single-carrier signals without the cosine effects. The estimating circuit estimates the frequency offsets of the multi-carrier signal according to the linear data models. A carrier frequency offset estimating system is also provided.Type: GrantFiled: August 12, 2008Date of Patent: July 26, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Meng-Hung Hsieh, Chun-Fa Liao
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Publication number: 20100330916Abstract: An interference eliminating circuit for removing an interference signal from a multi-carrier signal includes a training sequence generator, a first multiplier, a second multiplier, a phase shift circuit, a buffer, and an adder. The multi-carrier signal includes a first training sequence. The training sequence generator generates a second training sequence orthogonal to the first training sequence. The first multiplier attaches the second training sequence to the multi-carrier signal to obtain a new multi-carrier signal. The second multiplier attaches the second training sequence to the new multi-carrier signal to obtain the interference signal. The phase shift circuit shifts phase of the interference signal to obtain an adverse signal of the interference signal. The buffer buffers the multi-carrier signals. The adder adds the adverse signal of the interference signal to the buffered multi-carrier signals to remove the interference signal.Type: ApplicationFiled: July 24, 2009Publication date: December 30, 2010Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: MENG-HUNG HSIEH, CHUN-FA LIAO
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Patent number: 7766676Abstract: An electronic device includes an enclosure, a protecting member, and a power plug. The enclosure includes a top wall, a bottom wall, sidewalls, a socket, and a slot to receive an electronic card. The socket and the slot are defined in one of the sidewalls. The protecting member includes a receiving portion bounding the socket and the slot and a sliding plate capable of sliding to an open position and a closed position in the receiving portion. Movement of the sliding plate in the open position does not allow insertion of the power plug into the socket and allows the electronic card to be inserted into or removed from the slot, and movement of the sliding plate in the closed position allows insertion of the power plug into the socket and does not allow the electronic card to be inserted into or removed from the slot.Type: GrantFiled: March 25, 2009Date of Patent: August 3, 2010Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Meng-Hung Hsieh, Chun-Fa Liao
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Publication number: 20090263994Abstract: An electronic device includes an enclosure, a protecting member, and a power plug. The enclosure includes a top wall, a bottom wall, sidewalls, a socket, and a slot to receive an electronic card. The socket and the slot are defined in one of the sidewalls. The protecting member includes a receiving portion bounding the socket and the slot and a sliding plate capable of sliding to an open position and a closed position in the receiving portion. Movement of the sliding plate in the open position does not allow insertion of the power plug into the socket and allows the electronic card to be inserted into or removed from the slot, and movement of the sliding plate in the closed position allows insertion of the power plug into the socket and does not allow the electronic card to be inserted into or removed from the slot.Type: ApplicationFiled: March 25, 2009Publication date: October 22, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: MENG-HUNG HSIEH, CHUN-FA LIAO
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Publication number: 20090262865Abstract: A carrier frequency offset estimating device for estimating frequency offsets of a multi-carrier signal includes a transforming circuit, a cosine effect eliminating circuit, a model creating circuit, and an estimating circuit. The transforming circuit receives the multi-carrier signal and transforms the multi-carrier signal to single-carrier signals. The cosine effect eliminating circuit eliminates cosine effects in the single-carrier signals to form single-carrier signals without the cosine effects. The model creating circuit creates linear data models according to the single-carrier signals without the cosine effects. The estimating circuit estimates the frequency offsets of the multi-carrier signal according to the linear data models. A carrier frequency offset estimating system is also provided.Type: ApplicationFiled: August 12, 2008Publication date: October 22, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: MENG-HUNG HSIEH, CHUN-FA LIAO
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Publication number: 20090243759Abstract: A low-pass filter (10) includes an input portion (100) for input of an electromagnetic signal, an output portion (120) for output of the electromagnetic signal, a high impedance transmission portion (140) electrically connecting the input portion and the output portion, a pair of low impedance transmission portions (160, 180) arranged on either side of the high impedance transmission portion, and a capacitor. One of the low impedance transmission portions electrically connects the input portion and one end portion of the high impedance transmission portion. The other low impedance transmission portion electrically connects the output portion and the other end portion of the high impedance transmission portion. One end of the capacitor is electrically connected to the high impedance transmission portion. The high impedance transmission portion is symmetrical about the capacitor.Type: ApplicationFiled: August 19, 2008Publication date: October 1, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: HSIN-PING CHEN, MENG-HUNG HSIEH