Patents by Inventor Meng-Hung Hsieh

Meng-Hung Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11983479
    Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung-Chan Yang, Ting-Wei Chiang, Jerry Chang-Jui Kao, Hui-Zhong Zhuang, Lee-Chung Lu, Li-Chun Tien, Meng-Hung Shen, Shang-Chih Hsieh, Chi-Yu Lu
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 10951191
    Abstract: Provided is a low-leakage automatic adjustable diplexer including a body, a thin plate and two resonant regulators. The body has therein cuboid waveguide channels each having a feeding portion, a reception port portion, a transmission port portion, a fitting portion, a first filtering portion, a second filtering portion, first E/H conversion units connected to two ends of the first filtering portion, respectively, and second E/H conversion units connected to two ends of the second filtering portion, respectively. The thin plate is clamped inside the body. The resonant regulators each have a plurality of frequency disturbance elements adjustably protruding into the first and second filtering portions.
    Type: Grant
    Filed: December 25, 2019
    Date of Patent: March 16, 2021
    Inventors: Jen-Ti Peng, Chien-Chih Lee, Cheng-Lung Wu, Meng-Hung Hsieh, You-Hua Wu
  • Patent number: 7990236
    Abstract: A low-pass filter (10) includes an input portion (100) for input of an electromagnetic signal, an output portion (120) for output of the electromagnetic signal, a high impedance transmission portion (140) electrically connecting the input portion and the output portion, a pair of low impedance transmission portions (160, 180) arranged on either side of the high impedance transmission portion, and a capacitor. One of the low impedance transmission portions electrically connects the input portion and one end portion of the high impedance transmission portion. The other low impedance transmission portion electrically connects the output portion and the other end portion of the high impedance transmission portion. One end of the capacitor is electrically connected to the high impedance transmission portion. The high impedance transmission portion is symmetrical about the capacitor.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: August 2, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Ping Chen, Meng-Hung Hsieh
  • Patent number: 7986751
    Abstract: A carrier frequency offset estimating device for estimating frequency offsets of a multi-carrier signal includes a transforming circuit, a cosine effect eliminating circuit, a model creating circuit, and an estimating circuit. The transforming circuit receives the multi-carrier signal and transforms the multi-carrier signal to single-carrier signals. The cosine effect eliminating circuit eliminates cosine effects in the single-carrier signals to form single-carrier signals without the cosine effects. The model creating circuit creates linear data models according to the single-carrier signals without the cosine effects. The estimating circuit estimates the frequency offsets of the multi-carrier signal according to the linear data models. A carrier frequency offset estimating system is also provided.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: July 26, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Meng-Hung Hsieh, Chun-Fa Liao
  • Publication number: 20100330916
    Abstract: An interference eliminating circuit for removing an interference signal from a multi-carrier signal includes a training sequence generator, a first multiplier, a second multiplier, a phase shift circuit, a buffer, and an adder. The multi-carrier signal includes a first training sequence. The training sequence generator generates a second training sequence orthogonal to the first training sequence. The first multiplier attaches the second training sequence to the multi-carrier signal to obtain a new multi-carrier signal. The second multiplier attaches the second training sequence to the new multi-carrier signal to obtain the interference signal. The phase shift circuit shifts phase of the interference signal to obtain an adverse signal of the interference signal. The buffer buffers the multi-carrier signals. The adder adds the adverse signal of the interference signal to the buffered multi-carrier signals to remove the interference signal.
    Type: Application
    Filed: July 24, 2009
    Publication date: December 30, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MENG-HUNG HSIEH, CHUN-FA LIAO
  • Patent number: 7766676
    Abstract: An electronic device includes an enclosure, a protecting member, and a power plug. The enclosure includes a top wall, a bottom wall, sidewalls, a socket, and a slot to receive an electronic card. The socket and the slot are defined in one of the sidewalls. The protecting member includes a receiving portion bounding the socket and the slot and a sliding plate capable of sliding to an open position and a closed position in the receiving portion. Movement of the sliding plate in the open position does not allow insertion of the power plug into the socket and allows the electronic card to be inserted into or removed from the slot, and movement of the sliding plate in the closed position allows insertion of the power plug into the socket and does not allow the electronic card to be inserted into or removed from the slot.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: August 3, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Meng-Hung Hsieh, Chun-Fa Liao
  • Publication number: 20090263994
    Abstract: An electronic device includes an enclosure, a protecting member, and a power plug. The enclosure includes a top wall, a bottom wall, sidewalls, a socket, and a slot to receive an electronic card. The socket and the slot are defined in one of the sidewalls. The protecting member includes a receiving portion bounding the socket and the slot and a sliding plate capable of sliding to an open position and a closed position in the receiving portion. Movement of the sliding plate in the open position does not allow insertion of the power plug into the socket and allows the electronic card to be inserted into or removed from the slot, and movement of the sliding plate in the closed position allows insertion of the power plug into the socket and does not allow the electronic card to be inserted into or removed from the slot.
    Type: Application
    Filed: March 25, 2009
    Publication date: October 22, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MENG-HUNG HSIEH, CHUN-FA LIAO
  • Publication number: 20090262865
    Abstract: A carrier frequency offset estimating device for estimating frequency offsets of a multi-carrier signal includes a transforming circuit, a cosine effect eliminating circuit, a model creating circuit, and an estimating circuit. The transforming circuit receives the multi-carrier signal and transforms the multi-carrier signal to single-carrier signals. The cosine effect eliminating circuit eliminates cosine effects in the single-carrier signals to form single-carrier signals without the cosine effects. The model creating circuit creates linear data models according to the single-carrier signals without the cosine effects. The estimating circuit estimates the frequency offsets of the multi-carrier signal according to the linear data models. A carrier frequency offset estimating system is also provided.
    Type: Application
    Filed: August 12, 2008
    Publication date: October 22, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MENG-HUNG HSIEH, CHUN-FA LIAO
  • Publication number: 20090243759
    Abstract: A low-pass filter (10) includes an input portion (100) for input of an electromagnetic signal, an output portion (120) for output of the electromagnetic signal, a high impedance transmission portion (140) electrically connecting the input portion and the output portion, a pair of low impedance transmission portions (160, 180) arranged on either side of the high impedance transmission portion, and a capacitor. One of the low impedance transmission portions electrically connects the input portion and one end portion of the high impedance transmission portion. The other low impedance transmission portion electrically connects the output portion and the other end portion of the high impedance transmission portion. One end of the capacitor is electrically connected to the high impedance transmission portion. The high impedance transmission portion is symmetrical about the capacitor.
    Type: Application
    Filed: August 19, 2008
    Publication date: October 1, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HSIN-PING CHEN, MENG-HUNG HSIEH