Patents by Inventor Meng-Hung Lee

Meng-Hung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973027
    Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Tze-Liang Lee, Meng-Han Chou, Kuo-Ju Chen, Huicheng Chang, Tsai-Jung Ho, Tzu-Yang Ho
  • Publication number: 20230298299
    Abstract: A video conference device may include at least one camera, at least one processor, and an interface. The at least one camera may be arranged to capture an image of a scene. The at least one processor may be arranged to: if a trigger occurs, detect a display region in the image based on a location of a pattern in the image, wherein in response to the display region being detected, the display region is excluded from the image; detect at least one specific object in the image; and extract the at least one detected specific object in the image as at least one local image. The interface may be arranged to transmit the at least one local image.
    Type: Application
    Filed: November 3, 2022
    Publication date: September 21, 2023
    Applicant: HIMAX TECHNOLOGIES LIMITED
    Inventors: Kuei-Hsiang Chen, Yu-Chun Huang, Meng-Hung Lee, Lung-Chou Chang