Patents by Inventor Meng-Ju Chiang
Meng-Ju Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20230067657Abstract: An acoustic feature extraction (AFE) circuit includes a plurality of band-pass filters (BPFs) adaptable to a plurality of channels with different band-pass frequency ranges respectively for switchably receiving an amplified signal, thereby generating corresponding filtered signals, the plurality of BPFs including an operational amplifier that is shared among the plurality of channels; and a rectifier switchably coupled to receive the filtered signals, thereby generating a rectified signal. The amplified signal is time-division demultiplexed onto the BPFs in different phases, and the filtered signals are time-division multiplexed onto the rectifier in different phases.Type: ApplicationFiled: August 25, 2021Publication date: March 2, 2023Inventors: Meng-Ju Chiang, Soon-Jyh Chang
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Patent number: 8183961Abstract: The present invention provides a complementary-conducting-strip (CCS) structure for miniaturizing microwave transmission line. The CCS structure comprises a substrate; a transmission part formed on the substrate, the transmission part consisted of M metal layers and at least one connecting arm extending from the metal layers to connect to an adjacent CCS structure, the M metal layers interlaminated M?1 dielectric layer(s) perforating a plurality of first metal vias to connect the M metal layers, wherein M?2 and M is a nature number; and a frame part formed on the substrate, the frame part surrounding the transmission part and consisted of M?1 metal frame(s), the M?1 metal frame(s) interlaminated M?2 dielectric frame(s) perforating a plurality of second metal vias to connect the metal frames.Type: GrantFiled: December 5, 2008Date of Patent: May 22, 2012Assignees: National Taiwan University, CMSC, Inc.Inventors: Ching-Kuang Tzuang, Meng-Ju Chiang, Shian-Shun Wu
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Patent number: 8106729Abstract: This invention discloses a complementary-conducting-strip transmission line (CCS TL) structure. The CCS TL structure includes a substrate, at least one first mesh ground plane, m second mesh ground planes having m first inter-media-dielectric (IMD) layers interlaced with and stacked among each other and the first mesh ground plane to form a stack structure on the substrate, a second IMD layer being on the stack structure, and a signal transmission line being on the second IMD layer. Wherein, each first IMD layer has a plurality of vias to correspondingly connect the first and the m second mesh ground planes, therein, m?2 and m is a natural number, and the m second mesh ground planes under the signal transmission line have at least one slit structure.Type: GrantFiled: July 24, 2009Date of Patent: January 31, 2012Assignees: National Taiwan University, CMSC, Inc.Inventors: Ching-Kuang Tzuang, Meng-Ju Chiang, Shian-Shun Wu
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Patent number: 8106721Abstract: A multilayer complementary-conducting-strip transmission line (CCS TL) structure is disclosed herein. The multilayer CCS TL structure includes a substrate, and n signal transmission lines being parallel and interlacing with n-1 mesh ground plane(s), therein a plurality of inter-media-dielectric (IMD) layers are correspondingly stacked with among the n signal transmission lines and the n-1 mesh ground plane(s) to form a stack structure on the substrate, therein n?2 and n is a natural number. Whereby, a multilayer CCS TL with independent of each layer and complete effect on signal shield is formed to provide more flexible for circuit design, reduce the circuit area and also diminish the transmission loss.Type: GrantFiled: July 23, 2009Date of Patent: January 31, 2012Assignees: National Taiwan University, CMSC, Inc.Inventors: Ching-Kuang Tzuang, Meng-Ju Chiang, Shian-Shun Wu
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Patent number: 8085113Abstract: This invention discloses a complementary-conducting-strip coupled-line (CCS CL). The CCS CL includes a substrate, m layers of mesh ground planes interlacing with m?1 layer(s) of first inter-media-dielectric (IMD) to form a stack structure on the substrate, a second IMD layer being on the stack structure, and n metal lines being on the second IMD layer and being edge-coupled with each other. Wherein, the m?1 first IMD layer(s) has(have) a plurality of vias to connect matching mesh ground planes, therein, m?2 and m is a natural number, n?2 and n is a natural number.Type: GrantFiled: June 15, 2009Date of Patent: December 27, 2011Assignees: National Taiwan University, CMSC, Inc.Inventors: Ching-Kuang Tzuang, Meng-Ju Chiang, Shian-Shun Wu
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Publication number: 20100148885Abstract: This invention discloses a complementary-conducting-strip coupled-line (CCS CL). The CCS CL includes a substrate, m layers of mesh ground planes interlacing with m?1 layer(s) of first inter-media-dielectric (IMD) to form a stack structure on the substrate, a second IMD layer being on the stack structure, and n metal lines being on the second IMD layer and being edge-coupled with each other. Wherein, the m?1 first IMD layer(s) has(have) a plurality of vias to connect matching mesh ground planes, therein, m?2 and m is a nature number, n?2 and n is a nature number.Type: ApplicationFiled: June 15, 2009Publication date: June 17, 2010Applicants: NATIONAL TAIWAN UNIVERSITY, CMSC, INC.Inventors: Ching-Kuang Tzuang, Meng-Ju Chiang, Shian-Shun Wu
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Publication number: 20100141359Abstract: The present invention provides a complementary-conducting-strip (CCS) structure for miniaturizing microwave transmission line. The CCS structure comprises a substrate; a transmission part formed on the substrate, the transmission part consisted of M metal layers and at least one connecting arm extending from the metal layers to connect to an adjacent CCS structure, the M metal layers interlaminated M-1 dielectric layer(s) perforating a plurality of first metal vias to connect the M metal layers, wherein M?=2 and M is a nature number; and a frame part formed on the substrate, the frame part surrounding the transmission part and consisted of M-1 metal frame(s), the M-1 metal frame(s) interlaminated M-2 dielectric frame(s) perforating a plurality of second metal vias to connect the metal frames.Type: ApplicationFiled: December 5, 2008Publication date: June 10, 2010Inventors: Ching-Kuang Tzuang, Meng-Ju Chiang, Shian-Shun Wu
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Publication number: 20100109816Abstract: This invention discloses a complementary-conducting-strip transmission line (CCS TL) structure. The CCS TL structure includes a substrate, at least one first mesh ground plane, m second mesh ground planes having m first inter-media-dielectric (IMD) layers interlaced with and stacked among each other and the first mesh ground plane to form a stack structure on the substrate, a second IMD layer being on the stack structure, and a signal transmission line being on the second IMD layer. Wherein, each first IMD layer has a plurality of vias to correspondingly connect the first and the m second mesh ground planes, therein, m?2 and m is a nature number, and the m second mesh ground planes under the signal transmission line have at least one slit structure.Type: ApplicationFiled: July 24, 2009Publication date: May 6, 2010Applicants: National Taiwan University, CMSC, INC.Inventors: Ching-Kuang Tzuang, Meng-Ju Chiang, Shian-Shun Wu
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Publication number: 20100109790Abstract: A multilayer complementary-conducting-strip transmission line (CCS TL) structure is disclosed herein. The multilayer CCS TL structure includes a substrate, and n signal transmission lines being parallel and interlacing with n-1 mesh ground plane(s), therein a plurality of inter-media-dielectric (IMD) layers are correspondingly stacked with among the n signal transmission lines and the n-1 mesh ground plane(s) to form a stack structure on the substrate, therein n?2 and n is a natural number. Whereby, a multilayer CCS TL with independent of each layer and complete effect on signal shield is formed to provide more flexible for circuit design, reduce the circuit area and also diminish the transmission loss.Type: ApplicationFiled: July 23, 2009Publication date: May 6, 2010Applicants: NATIONAL TAIWAN UNIVERSITY, CMSC, INC.Inventors: Ching-Kuang Tzuang, Meng-Ju Chiang, Shian-Shun Wu