Abstract: A packaging system for retaining an annular shaped unit in a vertically aligned position relative to a base plane, the packaging system may include a carrier base including a first receptacle, and a retaining member including a second receptacle and a wedge, the wedge being configured to retain the annular shaped unit in the second receptacle in the vertically aligned position, the retaining member being arranged in the first receptacle. The first receptacle may include a bottom surface having a concave shape corresponding to a shape of the annular shaped unit. The packaging system may also include a container including a base member and a top member. The base member being adapted to receive the carrier base therein, and the top member being configured to receive the base member therein, the container being configured to fully contain the carrier base, retaining member, and annular shaped unit therein.

Abstract: Disclosed is a compact electronic device configured to efficiently manage air circulation and prevent overheating. The device features an innovative cooling system comprising a fan module within a uniquely structured housing that includes a base portion, an inner casing, and a removable top cover. The inner casing features strategically placed windows that direct drawn airflow over specific power supply components, enhancing cooling performance. The enhanced cooling is also provided by an air gap formed between the base portion and the top cover, as well as sidewall intake paths of varying widths adjacent the windows. These features work together to draw in and distribute ambient air effectively across heat-generating components, leveraging negative pressure created by a fan module. The result is a highly efficient cooling mechanism for compact devices such as wireless access point configured to plug into electrical outlets.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: A smart ring includes a battery, memory, processing circuitry, a plurality of sensors, a plurality of antennas, and a battery, each coupled to one another and all enclosed in a casing, wherein the processing circuitry is configured to conserve the battery by any of sending data to the cloud service when an application is open on the user device, sending data to the cloud service when a threshold is crossed, waking up processing or communicating when there is a change in motion detected by the accelerometer.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.

Abstract: A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.

Abstract: The present invention relates to a substrate structure having a solder mask and a process for making the same. The process comprises: (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. Whereby, the substrate structure of the invention can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.

Abstract: A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.