Abstract: An electronic device has a peripheral region and includes a substrate, a first metal layer, and a protrusion structure. The first metal layer is disposed on the substrate and comprises a first portion and a second portion. The protrusion structure is disposed on the substrate and in the peripheral region. The first portion is not overlapped with the protrusion structure, the second portion is overlapped with the protrusion structure, and an end of the second portion is located in the protrusion structure and higher than the first portion in a normal direction of the substrate.

Abstract: An electronic device has a peripheral region and includes a substrate, a first metal layer, and a protrusion structure. The first metal layer is disposed on the substrate. The protrusion structure is disposed on the substrate and in the peripheral region. The first metal layer extends into and ends in the protrusion structure.

Abstract: An electronic device and a display panel are provided. The display panel includes a substrate, a light-emitting unit, a blocking structure and an encapsulation layer. The substrate has a through hole, a display area, and a non-display area disposed between the through hole and the display area. The light-emitting unit is arranged on the display area. The blocking structure is arranged on the non-display area. The encapsulation layer extends from the display area to the non-display area, and includes an organic layer and a first inorganic layer. A portion of the organic layer is disposed between the blocking structure and the first inorganic layer.

Abstract: An electronic device has a peripheral region and includes a substrate, a first metal layer, and a protrusion structure. The first metal layer is disposed on the substrate. The protrusion structure is disposed on the substrate and in the peripheral region. The first metal layer extends into and ends in the protrusion structure.

Abstract: The invention, the manufacturing process and operation method for forming the streptavidin surface acoustic wave (SAW) immunosensor apparatus is disclosed. Firstly, the PZT film is formed on silicon substrate by using the micro-powder-sol-gel method. Then, the metal transducer electrodes are coated on the PZT film using semiconductor process technology to produce the SAW. Finally, the sensing area of the SAW element is modified by streptavidin to form the streptavidin SAW immunosensor. The invention could be used for examining the ligand decorated by biotin, also for examining antibody.