Patents by Inventor Meng KONG
Meng KONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250257274Abstract: Additives, and methods of making and using the additives are described. The additives may be provided as concentrates for addition to one or more hydrocarbons in crude oil refining and processing facilities to inhibit corrosion of corrodible metal parts in contact with the process streams. The additives may be made by reacting glycerol-restricted vegetable oil fatty acid with amine, wherein the glycerol-restricted vegetable oil fatty acid may be a hydrolyzed vegetable oil that is at least partially purified with respect to glycerol. The additives may be further reacted to provide ammonium salts that may be added to aqueous compositions to provide corrosion protection of corrodible surfaces in contact with the aqueous compositions.Type: ApplicationFiled: November 3, 2022Publication date: August 14, 2025Inventors: Kameswara R. Vyakaranam, Meng Kong, Ashish DHAWAN
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Publication number: 20240374609Abstract: The present disclosure discloses nitrosamine impurities, a varenicline pharmaceutical composition capable of reducing the generation of nitrosamine impurities, and the preparation and use thereof. By means of adding a pharmaceutically acceptable acid to a secondary amine compound or a composition thereof, the pharmaceutical composition of the present disclosure can effectively inhibit and reduce the generation of nitrosamine impurities, improve the stability of the secondary amine compound or the composition thereof, and control the content of genotoxic nitrosamine impurities to be at a relatively low level, so as to comply with safety requirements.Type: ApplicationFiled: October 8, 2021Publication date: November 14, 2024Inventors: Yanjun WEI, Shidagonnavar BASAVARAJ, Feng LI, Zhongya SUN, Hui PEI, Wenfeng DU, Jian WANG, Meng KONG, Xiwang LIU, Yanping XING, Qingjing XU
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Patent number: 12065606Abstract: The present disclosure provides methods of treating industrial processes with compositions, methods of manufacturing the compositions, and various anti-freezing compositions suitable for use in the industrial processes. The anti-freezing dispersant compositions may include, for example, sulfonated dispersants and winterization solvents. The anti-freezing dispersant compositions may prevent fouling in the industrial processes.Type: GrantFiled: January 20, 2022Date of Patent: August 20, 2024Assignee: ECOLAB USA Inc.Inventors: Shiguang Li, Meng Kong, Qing Qing Yuan
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Patent number: 12051642Abstract: A Quad Flat No-Lead (QFN) package comprises a semiconductor die, a lead frame and molding compound. The lead frame comprises a die pad having a substantially rectangular inner part and a plurality of protrusions around the periphery thereof and contiguous therewith and extending outwardly therefrom, and a plurality of leads around the four sides of the die-pad. The molding compound encapsulates the semiconductor die and forming the package. The molding compound has a respective moat therein between each side of the die pad and a respective set of leads. The die pad has a plurality of trenches extending from the second surface of the die pad towards the first surface at least in the inner part of the die pad. The plurality of the trenches each extend across a protrusion to the moat.Type: GrantFiled: July 28, 2021Date of Patent: July 30, 2024Assignee: NXP USA, Inc.Inventors: You Ge, Zhijie Wang, Meng Kong Lye
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Publication number: 20240229391Abstract: A snow blower includes a body; and an operation assembly connected to the body. The body includes a snow throwing system, and the snow throwing system includes: a snow throwing member; a deflector connected to the snow throwing member and disposed on the snow throwing member; a first motor configured to drive the snow throwing member to rotate relative to the body about a first axis; and a second motor configured to drive the deflector to rotate relative to the snow throwing member about a second axis. When the snow throwing member is at an intermediate position, the first motor and the second motor are each in a first circular region which uses a point on the second axis as a center, and the radius of the first circular region is less than or equal to 800 mm.Type: ApplicationFiled: March 26, 2024Publication date: July 11, 2024Inventors: Meng Kong, Toshinari Yamaoka, Huixing Fu, Yongqing Fang, Jifeng Feng, Peng Wang, Zengbing Guo
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Publication number: 20240150275Abstract: Antifouling compositions are provided. The antifouling compositions include a dispersing agent including an imidazoline, a solvator including a phthalate, and a promoter agent including an acylamide. Methods of mitigating fouling caused by the polymerization of monomers using the compositions of the disclosure are also provided. The methods of mitigating fouling of monomers include a step of adding a composition of the disclosure to the monomer. In some instances, the monomer is an ethylenically unsaturated monomer, such as (meth)acrylic acid, methyl methacrylate, an acrylic acid ester, methacrylamide sulfate, vinyl acetate, acrylonitrile, acrolein, an acrylate, a methacrylate, 1,3-butadiene, styrene, isoprene, and any combination thereof. Methods of preparing the antifouling compositions are also provided.Type: ApplicationFiled: October 20, 2023Publication date: May 9, 2024Applicant: ECOLAB USA Inc.Inventor: Meng KONG
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Publication number: 20240010916Abstract: Polymerization inhibitor compositions are provided. The polymerization inhibitor compositions include at least a first inhibitor compound having a stable nitroxide radical or a derivative thereof, a second inhibitor compound having a phenothiazine or a derivative thereof, and a functional solvent. Methods of inhibiting the polymerization of monomers using the compositions of the disclosure are also provided. The methods of inhibiting polymerization of monomers include a step of adding a composition of the disclosure to the monomer. In some instances, the monomer is an ethylenically unsaturated monomer. Such ethylenically unsaturated monomers include, but are not limited to, (meth)acrylic acid, methyl methacrylate, acrylic acid, acrylic acid esters, methacrylamide sulfate, vinyl acetate, acrylonitrile, acrolein, acrylates, methacrylates, 1,3-butadiene, styrene, isoprene, and combinations thereof. Methods of preparing the polymerization inhibitors and compositions of the disclosure are also provided.Type: ApplicationFiled: July 6, 2023Publication date: January 11, 2024Applicant: Ecolab USA Inc.Inventors: Meng KONG, Kameswara VYAKARANAM
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Publication number: 20240010758Abstract: Polymerization inhibitor compositions are provided. The polymerization inhibitor compositions include at least a first inhibitor compound having a phenothiazine or a derivative thereof, a second inhibitor compound having a phenylenediamine or a derivative thereof, and a solvent. Methods of inhibiting the polymerization of monomers using the compositions of the disclosure are also provided. The methods of inhibiting polymerization of monomers include a step of adding a composition of the disclosure to the monomer. In some instances, the monomer is an ethylenically unsaturated monomer. Such ethylenically unsaturated monomers include, but are not limited to, (meth)acrylic acid, methyl methacrylate, acrylic acid, acrylic acid esters, methacrylamide sulfate, vinyl acetate, acrylonitrile, acrolein, acrylates, methacrylates, 1,3-butadiene, styrene, isoprene, and combinations thereof. Methods of preparing the polymerization inhibitors and compositions of the disclosure are also provided.Type: ApplicationFiled: July 6, 2023Publication date: January 11, 2024Applicant: Ecolab USA Inc.Inventors: Meng KONG, Kameswara VYAKARANAM
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Publication number: 20230110402Abstract: A method of packaging a semiconductor device includes: bonding a ball at an end of a bond wire to a bond pad of a semiconductor device die in an aperture of a shielding layer of the semiconductor device; and sealing the part of the bond pad exposed by the aperture of the shielding layer by deforming the ball of the bond wire to fill the aperture of the shielding layer. The aperture of the shielding layer includes an edge wall, and exposes a part of the bond pad. The shielding layer covers a remaining part of the bond pad. The aperture of the shielding layer is completely filled with the ball of the bond wire, thereby deforming the edge wall of the shielding layer.Type: ApplicationFiled: October 6, 2022Publication date: April 13, 2023Inventors: You Ge, Meng Kong Lye, Zhijie Wang
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Publication number: 20230115182Abstract: According to a first aspect of the present invention there is provided a quad-flat-no-leads (QFN) packaged semiconductor device having a QFN bottom surface and QFN side faces, wherein the QFN side faces each comprise an upper portion and a recessed lower portion, the QFN packaged semiconductor device comprising: a die pad within or on the QFN bottom surface; a plurality of I/O terminals spaced apart from the die pad and around a periphery of the bottom surface, each having a bottom face extending from an inner end to a peripheral end, an exposed side face on a QFN side face and extending above the recessed lower portion of the QFN side face; wherein the QFN bottom surface includes at least one trench therein, parallel to a one of the QFN side faces and exposing at least a part of a side face of the inner end of the I/O terminals. The trench may provide for additional surface area, and provide a stronger solder joint when the QFN packaged semiconductor device is soldered to a substrate or circuit board.Type: ApplicationFiled: September 15, 2022Publication date: April 13, 2023Inventors: Meng Kong Lye, Zhijie Wang, You Ge, Zhiming Li
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Patent number: 11515238Abstract: A power die package includes a lead frame having a flag with power leads on one lateral side and signal leads on one or more other lateral sides. A power die is attached to a bottom surface of the flag and electrically connected to the power leads with a conductive epoxy. A control die is attached to a top surface of the flag and electrically connected to the signal leads with bond wires. A mold compound is provided that encapsulates the dies, the bond wires, and proximal parts of the leads, while distal ends of the leads are exposed, forming a PQFN package.Type: GrantFiled: June 17, 2020Date of Patent: November 29, 2022Assignee: NXP USA, INC.Inventors: You Ge, Meng Kong Lye, Zhijie Wang, Kabir Mirpuri
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Patent number: 11456188Abstract: A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.Type: GrantFiled: May 14, 2020Date of Patent: September 27, 2022Assignee: NXP USA, INC.Inventors: You Ge, Meng Kong Lye, Zhijie Wang
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Publication number: 20220235273Abstract: The present disclosure provides methods of treating industrial processes with compositions, methods of manufacturing the compositions, and various anti-freezing compositions suitable for use in the industrial processes. The anti-freezing dispersant compositions may include, for example, sulfonated dispersants and winterization solvents. The anti-freezing dispersant compositions may prevent fouling in the industrial processes.Type: ApplicationFiled: January 20, 2022Publication date: July 28, 2022Applicant: ECOLAB USA INC.Inventors: Shiguang LI, Meng KONG, Qing Qing YUAN
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Publication number: 20220077052Abstract: A Quad Flat No-Lead (QFN) package comprises a semiconductor die, a lead frame and molding compound. The lead frame comprises a die pad having a substantially rectangular inner part and a plurality of protrusions around the periphery thereof and contiguous therewith and extending outwardly therefrom, and a plurality of leads around the four sides of the die-pad. The molding compound encapsulates the semiconductor die and forming the package. The molding compound has a respective moat therein between each side of the die pad and a respective set of leads. The die pad has a plurality of trenches extending from the second surface of the die pad towards the first surface at least in the inner part of the die pad. The plurality of the trenches each extend across a protrusion to the moat.Type: ApplicationFiled: July 28, 2021Publication date: March 10, 2022Inventors: You Ge, Zhijie Wang, Meng Kong Lye
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Patent number: 11171077Abstract: A semiconductor device is assembled using a lead frame having leads that surround a central opening. The leads have proximal ends near to the central opening and distal ends spaced from the central opening. A heat sink is attached to a bottom surface of the leads and a semiconductor die is attached to a top surface of the leads, where the die is supported on the proximal ends of the leads and spans the central opening. Bond wires electrically connect electrodes on an active surface of the die and the leads. An encapsulant covers the bond wires and at least the top surface of the leads and the die. The distal ends of the leads are exposed to allow external electrical communication with the die.Type: GrantFiled: June 22, 2020Date of Patent: November 9, 2021Assignee: NXP USA, INC.Inventors: You Ge, Meng Kong Lye, Zhijie Wang
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Publication number: 20210013137Abstract: A semiconductor device is assembled using a lead frame having leads that surround a central opening. The leads have proximal ends near to the central opening and distal ends spaced from the central opening. A heat sink is attached to a bottom surface of the leads and a semiconductor die is attached to a top surface of the leads, where the die is supported on the proximal ends of the leads and spans the central opening. Bond wires electrically connect electrodes on an active surface of the die and the leads. An encapsulant covers the bond wires and at least the top surface of the leads and the die. The distal ends of the leads are exposed to allow external electrical communication with the die.Type: ApplicationFiled: June 22, 2020Publication date: January 14, 2021Inventors: You GE, Meng Kong LYE, Zhijie WANG
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Publication number: 20200411423Abstract: A power die package includes a lead frame having a flag with power leads on one lateral side and signal leads on one or more other lateral sides. A power die is attached to a bottom surface of the flag and electrically connected to the power leads with a conductive epoxy. A control die is attached to a top surface of the flag and electrically connected to the signal leads with bond wires. A mold compound is provided that encapsulates the dies, the bond wires, and proximal parts of the leads, while distal ends of the leads are exposed, forming a PQFN package.Type: ApplicationFiled: June 17, 2020Publication date: December 31, 2020Inventors: You Ge, Meng Kong Lye, Zhijie Wang, Kabir Mirpuri
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Publication number: 20200312751Abstract: A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.Type: ApplicationFiled: May 14, 2020Publication date: October 1, 2020Inventors: You Ge, Meng Kong Lye, Zhijie Wang
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Patent number: 10787361Abstract: A semiconductor sensor device includes a lead frame flag having a vent hole, an interposer mounted on the flag and having a vent hole in fluid communication with the vent hole of the flag, and a sensor die having an active region. The sensor die is mounted on and electrically connected to the interposer in a flip-chip manner such that the vent hole of the interposer is in fluid communication with the active region of the sensor die. Bond wires electrically connect the interposer to one or more other components of the device. A molding compound covers the sensor die, the interposer, and the bond wires. The sensor die may be a pressure-sensing (P-cell) die, and the device may also include a micro-controller unit (MCU) die and an acceleration-sensing (G-cell) die, for tire pressure monitoring applications.Type: GrantFiled: October 30, 2018Date of Patent: September 29, 2020Assignee: NXP USA, Inc.Inventors: Stanley Job Doraisamy, Meng Kong Lye, Norazham Mohd Sukemi
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Patent number: 10734311Abstract: Embodiments of packaged semiconductor devices and lead frames for such devices are provided, such as a lead frame including: a row of lead fingers, wherein an outer end of each lead finger is connected to a leaded side of the lead frame; a package body perimeter that indicates placement of a package body of the packaged semiconductor device, wherein an inner end of each lead finger falls within the package body perimeter; a retention tab that protrudes from an interior edge of a non-leaded side of the lead frame, wherein the retention tab falls outside of the package body perimeter; and a non-conductive tie bar structure attached to the retention tab, wherein the non-conductive tie bar structure falls within the package body perimeter.Type: GrantFiled: January 7, 2019Date of Patent: August 4, 2020Assignee: NXP USA, Inc.Inventors: Mariano Layson Ching, Jr., Burton Jesse Carpenter, Lidong Zhang, Kendall Dewayne Phillips, Quan Chen, Meng Kong Lye