Abstract: Vias and methods of making the same. The vias including a middle portion located in a via opening in an interconnect-level dielectric layer, a top portion including a top head that extends above the via opening and extends laterally beyond upper edges of the via opening and a bottom portion including a bottom head that extends below the via opening and extends laterally beyond lower edges of the via opening. The via may be formed from a refractory material.

Abstract: A method includes forming a first metal into a first trench in a dielectric layer, performing a thermal treatment to the first metal such that an average grain size of the first metal is increased, and performing a first chemical mechanical polish (CMP) process to the first metal after the performing the thermal treatment.

Abstract: A method includes forming a first metal into a first trench in a dielectric layer, performing a thermal treatment to the first metal such that an average grain size of the first metal is increased, and performing a first chemical mechanical polish (CMP) process to the first metal after the performing the thermal treatment.

Abstract: A thermoelectric module including at least one PN junction device is provided. The PN junction device includes a PN junction structure, top electrodes and at least one bottom electrode. The PN junction structure includes an N-type thermoelectric element and a P-type thermoelectric element, wherein side surfaces of the N-type thermoelectric element and the P-type thermoelectric element facing each other are in contact. The top electrodes are separated from each other and respectively cover a portion of a top surface of the N-type thermoelectric element or a portion of a top surface of the P-type thermoelectric element. The bottom electrode covers a bottom surface of the N-type thermoelectric element and a bottom surface of the P-type thermoelectric element.

Abstract: A highly efficient thermoelectric material with one end coated in silver adhesive and placed in a high temperature furnace to heat and diffuse the silver adhesive into the homogeneous thermoelectric material, thereby producing an non-uniform thermoelectric material one-side doped thermoelectric material. The non-uniform thermoelectric material one-side doped thermoelectric material is able to achieve a high thermoelectric figure of merit.