Patents by Inventor MENG-PO LIU

MENG-PO LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11919997
    Abstract: A white photosensitive resin composition, a white spacer, a light conversion layer, and a light-emitting device are provided. The white photosensitive resin composition includes a polymerizable compound (A), an alkali-soluble resin (B), a photopolymerization initiator (C), a solvent (D), and a white pigment (E). The polymerizable compound (A) includes an ethylenically-unsaturated monomer (A-1) represented by formula (I-1) and a thiol compound (A-2) having two or more thiol groups in one molecule, wherein based on 100 mass % of the polymerizable compound (A), a total content of the ethylenically-unsaturated monomer (A-1) and the thiol compound (A-2) is 10 mass % to 98 mass %.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: March 5, 2024
    Assignee: eChem Solutions Corp.
    Inventors: Meng-Po Liu, Yu-Chun Chen
  • Publication number: 20220404698
    Abstract: A black light-shielding photosensitive resin composition, a black matrix, a black light-shielding film, a frame, and a filling material for a splicing area are provided. The black light-shielding photosensitive resin composition includes a resin (A), a pigment (B), a monomer (C), an initiator (D), and a solvent (E). The resin (A) includes an epoxy resin (A-1) and a resin (A-2) having an ethylenic unsaturated functional group. The pigment (B) includes black particles (B-1) and hollow particles (B-2).
    Type: Application
    Filed: May 23, 2022
    Publication date: December 22, 2022
    Applicant: eChem Solutions Corp.
    Inventors: Meng-Po Liu, Yu-Chun Chen
  • Publication number: 20210388158
    Abstract: A white photosensitive resin composition, a white spacer, a light conversion layer, and a light-emitting device are provided. The white photosensitive resin composition includes a polymerizable compound (A), an alkali-soluble resin (B), a photopolymerization initiator (C), a solvent (D), and a white pigment (E). The polymerizable compound (A) includes an ethylenically-unsaturated monomer (A-1) represented by formula (I-1) and a thiol compound (A-2) having two or more thiol groups in one molecule, wherein based on 100 mass % of the polymerizable compound (A), a total content of the ethylenically-unsaturated monomer (A-1) and the thiol compound (A-2) is 10 mass % to 98 mass %.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 16, 2021
    Applicant: eChem Solutions Corp.
    Inventors: Meng-Po Liu, Yu-Chun Chen
  • Publication number: 20180210115
    Abstract: The present invention provides a conductive composition solution, comprising: an (A) conductive polymer, comprising: a ?-conjugated conductive polymer and a multivalent anionic polymer, wherein the multivalent anionic polymer is mixed with the ?-conjugated conductive polymer; a (B) alkoxy silane, having a weight percentage to the conductive composition solution in a range of 1-5.5 wt %; and a (C) solvent, comprising: a low-boiling-point solvent, having a boiling point in a range of 55-120° C.; a high-boiling-point solvent, having a boiling point in a range of 170-250° C., and being soluble in water; and water.
    Type: Application
    Filed: August 1, 2017
    Publication date: July 26, 2018
    Inventors: HSIN-JEN CHEN, MENG-PO LIU