Patents by Inventor Meng-Shiun Tsai

Meng-Shiun Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170261529
    Abstract: A method for identifying friction parameters for a linear module is disclosed. Since an acting interval of a friction is determined by a relative velocity between two contacting surfaces, and when the relative velocity is much greater than a Stribeck velocity, there is only a Coulomb friction and a viscous friction exist between the contacting surfaces, it is possible to use a measured torque signal of this interval to identify a Coulomb friction torque, a the linear module's friction torque, and the linear module's equivalent inertia. When the relative velocity between the two contacting surfaces is smaller than the Stribeck velocity, it is possible to identify a maximum static friction torque and the Stribeck velocity by referring to the three known parameters. Thereby, all the friction parameters can be identified within one reciprocating movement of the linear module, making the method highly feasible in practice.
    Type: Application
    Filed: May 30, 2017
    Publication date: September 14, 2017
    Inventors: Meng-Shiun TSAI, Wei-Hsiang YUAN, Chih-Wei WANG, Hong-Wei HUANG, Chung-Ching LIU
  • Patent number: 9593987
    Abstract: A method for detecting a preload residual rate involves: a. installing a temperature sensor on one of two preloaded elements; b. making the two preloaded elements to move with respect to each other, and recording a time-related temperature variation sensed by the temperature sensor, so as to obtain an initial temperature-rising curve; c. making the two preloaded elements to move with respect to each other, and recording a time-related temperature variation sensed by the temperature sensor, so as to obtain a detected temperature-rising curve; and d. comparing the initial and detected temperature-rising curves, so as to obtain the preload residual rate between the two preloaded elements of the step c to the step b. The method detects a preload residual rate applied to an object when the object is operating while being advantageous in terms of cost, service life, response and accuracy.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: March 14, 2017
    Assignee: HIWIN TECHNOLOGIES CORP.
    Inventors: Meng-Shiun Tsai, Wen-Hsin Hsieh, An-Shik Yang, Wei-Hsiang Yuan, Hong-Wei Huang, Chung-Ching Liu, Yih-Chyun Hwang
  • Publication number: 20150377719
    Abstract: A method for detecting a preload residual rate involves: a. installing a temperature sensor on one of two preloaded elements; b. making the two preloaded elements to move with respect to each other, and recording a time-related temperature variation sensed by the temperature sensor, so as to obtain an initial temperature-rising curve; c. making the two preloaded elements to move with respect to each other, and recording a time-related temperature variation sensed by the temperature sensor, so as to obtain a detected temperature-rising curve; and d. comparing the initial and detected temperature-rising curves, so as to obtain the preload residual rate between the two preloaded elements of the step c to the step b. The method detects a preload residual rate applied to an object when the object is operating while being advantageous in terms of cost, service life, response and accuracy.
    Type: Application
    Filed: August 7, 2014
    Publication date: December 31, 2015
    Inventors: MENG-SHIUN TSAI, WEN-HSIN HSIEH, AN-SHIK YANG, WEI-HSIANG YUAN, HONG-WEI HUANG, CHUNG-CHING LIU, YIH-CHYUN HWANG
  • Publication number: 20150377726
    Abstract: A method for identifying friction parameters for a linear module is disclosed. Since an acting interval of a friction is determined by a relative velocity between two contacting surfaces, and when the relative velocity is much greater than a Stribeck velocity, there is only a Coulomb friction and a viscous friction exist between the contacting surfaces, it is possible to use a measured torque signal of this interval to identify a Coulomb friction torque, a the linear module's friction torque, and the linear module's equivalent inertia. When the relative velocity between the two contacting surfaces is smaller than the Stribeck velocity, it is possible to identify a maximum static friction torque and the Stribeck velocity by referring to the three known parameters. Thereby, all the friction parameters can be identified within one reciprocating movement of the linear module, making the method highly feasible in practice.
    Type: Application
    Filed: September 5, 2014
    Publication date: December 31, 2015
    Inventors: Meng-Shiun TSAI, Wei-Hsiang YUAN, Chih-Wei WANG, Hong-Wei HUANG, Chung-Ching LIU
  • Publication number: 20100206077
    Abstract: A magnetic coupler for isolating noise and vibration transmitted from a drive source on a six-axles CNC gearset testing machine used to test degrees of noise and vibration is provided. The magnetic coupler for isolating noise and vibration transmitted from a drive source on a six-axles CNC gearset testing machine includes a drive source, a drive shaft, a transmission member for operatively interconnecting the drive shaft and the drive source, and a gearbox having an input shaft; a magnetic coupler comprising an outer cylinder and an inner cylinder adapted to dispose in the outer cylinder and space therefrom; a first chuck adapted to couple the inner cylinder and the input shaft of the gearbox to be tested together, and a second chuck adapted to couple the outer cylinder and the drive shaft together. From the above, noise and vibration would not transmitted from the drive source to the gearbox (e.g., motorcycle gearbox) during the test.
    Type: Application
    Filed: February 17, 2009
    Publication date: August 19, 2010
    Inventors: San-Ming Huang, Cheng-Kuo Sung, Zhang-Hua Fong, Chih-Chun Cheng, Meng-Shiun Tsai
  • Patent number: 7695351
    Abstract: A low-stress polishing device includes a base; a plurality of actuators mounted to the base and spaced from each other in a predetermined interval, each of the actuators having a drive shaft and a buffer spring connected with the drive shaft for providing the drive shaft with a predetermined impulsive pressure, each of the drive shafts having a buffer pad located at a distal end thereof; at least one drive circuit electrically connected with the actuators for control of driving the actuators; a working plate mounted to the buffer pads; and a polishing pad mounted to the working plate. Accordingly, the vibration mode generated by the device provides a dynamic pressure on the wafer surface for destroying the chemical product on the wafer surface and is applicable to polishing of low-dielectric integrated copper structures.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: April 13, 2010
    Assignee: National Chung Cheng University
    Inventors: Meng-Shiun Tsai, Yeau-Ren Jeng
  • Publication number: 20080287045
    Abstract: A low-stress polishing device includes a base; a plurality of actuators mounted to the base and spaced from each other in a predetermined interval, each of the actuators having a drive shaft and a buffer spring connected with the drive shaft for providing the drive shaft with a predetermined impulsive pressure, each of the drive shafts having a buffer pad located at a distal end thereof; at least one drive circuit electrically connected with the actuators for control of driving the actuators; a working plate mounted to the buffer pads; and a polishing pad mounted to the working plate. Accordingly, the vibration mode generated by the present invention can provide a dynamic pressure working on the wafer surface for destroying the chemical product on the wafer surface and thus the present invention is applicable to polishing of low-dielectric integrated copper process.
    Type: Application
    Filed: February 21, 2008
    Publication date: November 20, 2008
    Applicant: NATIONAL CHUNG CHENG UNIVERSITY
    Inventors: Meng-Shiun Tsai, Yeau-Ren Jeng
  • Publication number: 20080156078
    Abstract: A method of test includes the steps of preparing a sensing platform having an emitting electrode mounted at on one side thereof and a receiving electrode mounted on the other side thereof, wherein the sensing platform defines a sensing zone located between the emitting and receiving electrodes; placing a specimen on the sensing zone; emitting a surface acoustic wave from the emitting electrode, wherein the surface acoustic wave passes through the sensing zone and the specimen and then is received by the receiving electrode to be changed for its speed and phase by the change of material property of the specimen; and identifying the material property of the specimen according to the changed speed and phase of the surface acoustic wave to further infer the physical property of the specimen. In light of the steps, the surface acoustic wave can be employed for detection of the physical property of the specimen.
    Type: Application
    Filed: September 21, 2007
    Publication date: July 3, 2008
    Applicants: NATIONAL CHUNG CHENG UNIVERSITY, BUDDHIST DALIN TZU CHI GENERAL HOSPITAL
    Inventors: Wen-Hsin Hsieh, Meng-Shiun Tsai, Oscal Tzyh-Chiang Chen, Song-Jeng Huang, Tin-Kwang Lin, Yu-Wen Huang
  • Publication number: 20040259481
    Abstract: A method of polishing metal and barrier layer interconnect integrated with an extremely low dielectric constant material includes steps of (A) preparing a wafer composed of a copper layer and the extremely low dielectric constant material, (B) treating the copper layer chemically to produce a hard and brittle surface residual formed on the surface of the copper layer, (C) keeping polishing the surface residual by ultrasonic waves, (D) polishing a barrier layer of wafer by the ultrasonic waves, thereby polishing the wafer successfully.
    Type: Application
    Filed: July 14, 2003
    Publication date: December 23, 2004
    Applicant: CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY
    Inventors: Wen-Chueh Pan, Jer-Shyong Lai, Yih-Hsing Wang, Yang-Jiann Fann, Chih-Wei Chu, Hsing-Liao Chung, Chaug-Liang Hsu, Ming-Tseh Tsay, Yeau-Ren Jeng, Meng-Shiun Tsai