Abstract: A method for manufacturing a semiconductor device is described. The method includes the following steps. A low-dimensional material (LDM) layer is formed on a semiconductor substrate, wherein the LDM layer includes sublayers stacked upon one another. A plasma treatment is performed to the LDM layer to transform at least one sublayer into an oxide layer, wherein the plasma treatment is performed under a temperature equivalent to or lower than about 80 degrees Celsius. At least one electrode is disposed over the oxide layer.

Abstract: An automatic heating vending machine including a storage space, a storage mechanism, a fetching mechanism, a gripping arm mechanism, a rotating disc mechanism and a heating mechanism are disclosed. The storage mechanism is installed in the storage space to store food. The fetching mechanism is installed in the storage space and disposed under the storage mechanism to catch the food. The gripping arm mechanism grips the food on the fetching mechanism. The rotating disc mechanism is disposed on one side of the gripping arm mechanism. The gripping arm mechanism grips the food and then places the food on the rotating disc mechanism. The heating mechanism is disposed above the rotating disc mechanism. After the food has been placed on the rotating disc mechanism, the rotating disc mechanism undergoes horizontal movement and vertical movement, allowing the food to be admitted to the heating mechanism and heated.

Abstract: A method of auto scanning and scraping a work piece for a hard rail has a preparing step, a scanning step, a detecting step, an auto-scraping step and an analyzing step. The preparing step comprises preparing an auto scanning and scraping apparatus with a multi-axis machine tool, a control computer, an auto-scraping device and a position detector. The scanning step comprises scanning the surface of the work piece to read the roughness value and transporting the data to the control computer. The detecting step comprises forming a 3D-appearance drawing of the work piece and detecting the 3D-appearance drawing with multiple detection steps. The auto-scraping step comprises scraping the surface of the work piece by the auto-scraping device. The analyzing step comprises detecting the 3D-appearance drawing of the work piece that has been scraped with the preceding detection steps and scraping the work piece to meet the preceding detection steps.