Patents by Inventor Meng-Tzu Lee

Meng-Tzu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7575045
    Abstract: A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: August 18, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7327575
    Abstract: A locking device (10) for securing a heat sink (20) to a heat generating component (30) includes a pair of operating members (14) and a pair of locking members (16). Each operating member includes a pivot shaft (142) defining an axis and an operation handle (144) extending from the pivot shaft along a first direction. The pivot shaft has an offset section (146) offsetting from the axis thereof in a second direction. The first direction and the second direction form an angle therebetween. Each locking member is attached to the offset section of one of the operating members. The operation handle of each operating member is capable of rotating about the axis of the pivot shaft from an unlocked position to a locked position and accordingly the offset section of the pivot shaft drives the locking member to move upwardly.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: February 5, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Patent number: 7269010
    Abstract: A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which comprises a cutout on each corner. The fan mounting structure mounts on two opposite sides of the heat sink and the fixing devices fix the fan on the fan mounting structure wherein the fixing devices extend through the mounting structure into the cutouts and do not damage the heat sink. The fan mounting structure has two lower plates fitted into two grooves in two opposite sides of the heat sink. Each lower plate extends along a whole length of each of the grooves.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: September 11, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7180746
    Abstract: A retaining device (20) for mounting a heat sink (30) to an electronic device (40) includes an unitary metal wire clip (22), a locking device (26) and a camming member (24). The clip includes a pair of spaced apart pressing beams (221), at least one latching beam (223) and a crossbeam (225). The latching beam is set at one side of the pressing beams. The crossbeam extends between the pressing beams at an opposite side thereof. The camming member is pivotably attached to the locking device and includes a cam (242) being engageable with the crossbeam. The camming member is pivotable relative to the locking device from an unlocked position to a locked position and the pressing beams force the heat sink into close contact with the electronic device when the camming member is located at the locked position.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: February 20, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin, Ming-Kun Cao
  • Patent number: 7131485
    Abstract: A fan holder, for attaching a fan to a heat sink, includes a base, fasteners, and clamping arms. The fasteners extend from the base. Each of the fasteners defines an arc-shaped locking portion engaging with the fan. The clamping arms extend from the base opposite to the fasteners, and engage with the heat sink to thereby attach the fan to the heat sink.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: November 7, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Publication number: 20060133038
    Abstract: A retaining device (20) for mounting a heat sink (30) to an electronic device (40) includes an unitary metal wire clip (22), a locking device (26) and a camming member (24). The clip includes a pair of spaced apart pressing beams (221), at least one latching beam (223) and a crossbeam (225). The latching beam is set at one side of the pressing beams. The crossbeam extends between the pressing beams at an opposite side thereof. The camming member is pivotably attached to the locking device and includes a cam (242) being engageable with the crossbeam. The camming member is pivotable relative to the locking device from an unlocked position to a locked position and the pressing beams force the heat sink into close contact with the electronic device when the camming member is located at the locked position.
    Type: Application
    Filed: December 17, 2004
    Publication date: June 22, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin, Ming-Kun Cao
  • Patent number: 7063136
    Abstract: A heat dissipation device includes a heat sink (10), thermal interface material (30) spread on a bottom surface (16) of the heat sink, two legs (22) of a clip (20) disposed at opposite sides of the heat sink, and a protective cap (40) enclosing the thermal interface material therein. The protective cap includes ears (48) interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member (52) on a printed circuit board (50) thereby firmly mounting the heat sink to a CPU (54) on the printed circuit board.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: June 20, 2006
    Assignee: HON HAI Precision Industry Co., LTD
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20060120044
    Abstract: A heat dissipating apparatus includes a heat sink (20) having a base plate (22) for contacting an electronic component (10). A number of main fins (24) extend from the base plate. A cooling fan (30) is mounted on the heat sink. A center of the cooling fan offsets in a first direction from a center of the electronic component, so that a portion of the cooling fan that generates more and stronger airflows than the center of the cooling fan does is aligned with the center of the electronic component.
    Type: Application
    Filed: October 3, 2005
    Publication date: June 8, 2006
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin, Jun Luo
  • Publication number: 20060120046
    Abstract: A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which comprises a cutout on each corner. The fan mounting structure mounts on two opposite sides of the heat sink and the fixing devices fix the fan on the fan mounting structure wherein the fixing devices extend through the mounting structure into the cutouts and do not damage the heat sink. The fan mounting structure has two lower plates fitted into two grooves in two opposite sides of the heat sink. Each lower plate extends along a whole length of each of the grooves.
    Type: Application
    Filed: August 15, 2005
    Publication date: June 8, 2006
    Applicant: Foxconn Technology CO., LTD.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7028758
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: April 18, 2006
    Assignee: HON HAI Precision Industry Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7025125
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: April 11, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20060042787
    Abstract: A heat dissipation device includes a heat sink (10), thermal interface material (30) spread on a bottom surface (16) of the heat sink, two legs (22) of a clip (20) disposed at opposite sides of the heat sink, and a protective cap (40) enclosing the thermal interface material therein. The protective cap includes ears (48) interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member (52) on a printed circuit board (50) thereby firmly mounting the heat sink to a CPU (54) on the printed circuit board.
    Type: Application
    Filed: May 23, 2005
    Publication date: March 2, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20060007654
    Abstract: A fan holder, for attaching a fan to a heat sink, includes a base, fasteners, and clamping arms. The fasteners extend from the base. Each of the fasteners defines an arc-shaped locking portion engaging with the fan. The clamping arms extend from the base opposite to the fasteners, and engage with the heat sink to thereby attach the fan to the heat sink.
    Type: Application
    Filed: December 17, 2004
    Publication date: January 12, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Publication number: 20050263267
    Abstract: A cooling apparatus for dissipating heat from an electronic component, includes a body and two lids. The body is integrally formed by extruding a claviform aluminum stuff and includes a hollow tube with two open ends on opposite ends thereof and a plurality of fins integrally extending from the periphery of the tube. The two lids respectively seal the two open ends of the tube and form a chamber in the body. A wicking structure is installed on the inner peripheral surface of the tube. Heat-conductive evaporable working medium is contained in the chamber for transmitting heat absorbed by one of the lids contacting with the electronic component.
    Type: Application
    Filed: September 29, 2004
    Publication date: December 1, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Publication number: 20050263265
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.
    Type: Application
    Filed: December 21, 2004
    Publication date: December 1, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20050257920
    Abstract: A heat dissipating device includes a heat receiver, a fin member including a plurality of spaced fins defining aligned holes, and at least one heat pipe connecting the heat receiver with the fin member. Some of the fins adjacent the heat receiver define enlarged openings each communcating with a corresponding hole. The at least one heat pipe is U-shaped and includes an evaporative section attached to the heat receiver, a pair of condesative sections received in the holes of the fins, and a pair of curved sections connected between opposite ends of the evaporative section and the condensative sections respectively and received in the enlarged openings.
    Type: Application
    Filed: April 15, 2005
    Publication date: November 24, 2005
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20050247434
    Abstract: A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.
    Type: Application
    Filed: March 29, 2005
    Publication date: November 10, 2005
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20050219823
    Abstract: A locking device (10) for securing a heat sink (20) to a heat generating component (30) includes a pair of operating members (14) and a pair of locking members (16). Each operating member includes a pivot shaft (142) defining an axis and an operation handle (144) extending from the pivot shaft along a first direction. The pivot shaft has an offset section (146) offsetting from the axis thereof in a second direction. The first direction and the second direction form an angle therebetween. Each locking member is attached to the offset section of one of the operating members. The operation handle of each operating member is capable of rotating about the axis of the pivot shaft from an unlocked position to a locked position and accordingly the offset section of the pivot shaft drives the locking member to move upwardly.
    Type: Application
    Filed: February 18, 2005
    Publication date: October 6, 2005
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Patent number: D509486
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: September 13, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin, Ming-Kun Cao
  • Patent number: D514529
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: February 7, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee